Abstract: A hand-tool is provided for installing and removing a tyre, comprising a substantially elongated body member having a longitudinal axis, the body member further comprising a handle portion (102); a first engagement portion (108), arranged at a first end of said handle portion, adapted to operably engage with a first flange of opposed first and second rim flanges of a wheel, so as to form a fulcrum on the contact point with the first flange; a second engagement portion (112), spaced apart at a predetermined distance in a direction away from said first engagement portion along said longitudinal axis, adapted to abutingly engage with a rim-overlapping bead portion of a tyre.

Abstract: A stator assembly for a progressing cavity pump is provided. The stator assembly includes a number of stator laminates having a planar body defining a primary, inner passage and a number of outer passages, the outer passages disposed effectively adjacent the inner passage whereby the inner passage is at least partially defined by a band, wherein the band is outwardly flexible. The stator laminates are coupled to each other in a stack wherein the stator laminate body inner passages define a helical passage. The helical passage is a flexible helical passage.

Abstract: A method for soldering a circuit carrier to a carrier plate includes providing a carrier plate having an upper side and a first adjusting device, providing a circuit carrier having an underside and a second adjusting device, providing a solder and placing the circuit carrier onto the carrier plate in such a way that: the underside of the circuit carrier faces the upper side of the carrier plate; the solder is arranged between the carrier plate and the circuit carrier; and the first adjusting device forms a stop for the second adjusting device that limits a displacement of the circuit carrier placed on the carrier plate along the upper side of the carrier plate. After placing the circuit carrier onto the carrier plate, the solder is melted and subsequently cooled down until it solidifies and connects the circuit carrier to the carrier plate in a material-bonding manner at a lower metallization layer.

Abstract: A vertical internal coating machine is taught, which may be used with bodies such as cans (2 piece, 3 piece, draw, redraw,) and including cylinders, containers and any similar body. In the machine cans or similar bodies are vertical in the machine's star wheel rather than horizontal, and the bodies are sprayed with the star wheel in continuous motion without stopping and starting. The machine teaches that a plurality of spray guns may be provided for each pocket of the star wheel. By means of the machine an improved line layout is devised which may eliminate the need to raise the bodies immediately prior to a necker by allowing the vertical can internal coating machine and internal bake over to be disposed on any level of the facility, upper, lower, mezzanine, etc.

Abstract: A transfer ring of the type having a plurality of shoes arranged in a substantially circular configuration to define an inwardly-facing segmented cylindrical gripping surface, and a shoe for use in such a transfer ring, are disclosed. Each shoe comprises an arcuate interior surface defining a segment of the cylindrical gripping surface. The interior surface of each shoe has a first arcuate edge and an opposite second arcuate edge arranged substantially parallel to one another, and opposite first and second end edges extending between respective ends of said first and second arcuate edges. Each first end edge of each arcuate surface is mounted adjacent the second end edge of an adjacent arcuate surface, and the first end edge of at least one of the arcuate surfaces defines a varied or irregular shape along its arcuate surface.

Abstract: A method for producing a semiconductor module arrangement includes providing a semiconductor module and a printed circuit board. The semiconductor module has a circuit mount populated with a semiconductor chip, an adjustment device in a first relative position with respect to the circuit mount, and a plurality of electrical connections each of which has a free end. Each of the connections is routed through a different passage opening in the adjustment device. The printed circuit board is pushed onto the electrical connections by each of the free ends being inserted into a different contact opening in the printed circuit board. The adjustment device is moved to a second relative position, which is different from the first relative position, with respect to the circuit mount.

Abstract: An improved belt and tread drum incorporating an improved segment is disclosed. Segments are mounted in side-by-side relationship about a central axis for radial movement inwardly and outwardly with respect to the central axis and include arcuate outer surfaces that collectively define an outer circumferential working surface of the drum. The segments each define opposite first and second longitudinal side margins, at least one of the first and second longitudinal side margins defining an irregular longitudinal profile.

Abstract: An article of footwear includes an upper and a sole assembly secured to the upper. The sole assembly includes a first portion having a lower ground engaging surface, an upper surface, and a recess formed in the upper surface. The upper surface of the first portion is in contact with the upper. A second portion is seated in the recess in the first portion and has an upper surface, with the upper surface of the second portion being in contact with the upper. The second portion comprises a foam material having a density less than 0.25 g/cm3.

Abstract: An article of footwear includes an upper and a sole assembly secured to the upper. The sole assembly includes a first portion having a lower ground engaging surface, an upper surface, and a recess formed in the upper surface. The upper surface of the first portion is in contact with the upper. A second portion is seated in the recess in the first portion and has an upper surface, with the upper surface of the second portion being in contact with the upper. The second portion comprises a foam material having a density less than 0.25 g/cm3.

Abstract: A transfer ring of the type having a plurality of shoes arranged in a substantially circular configuration to define an inwardly-facing segmented cylindrical gripping surface, and a shoe for use in such a transfer ring, are disclosed. Each shoe comprises an arcuate interior surface defining a segment of the cylindrical gripping surface. The interior surface of each shoe has a first arcuate edge and an opposite second arcuate edge arranged substantially parallel to one another, and opposite first and second end edges extending between respective ends of said first and second arcuate edges. Each first and second end edge defines a substantially non-linear shape with each first and second end edge being shaped for mating engagement with an end edge of an adjacent shoe in the circular configuration.

Abstract: A method for producing a semiconductor module arrangement includes providing a semiconductor module and a printed circuit board. The semiconductor module has a circuit mount populated with a semiconductor chip, an adjustment device in a first relative position with respect to the circuit mount, and a plurality of electrical connections each of which has a free end. Each of the connections is routed through a different passage opening in the adjustment device. The printed circuit board is pushed onto the electrical connections by each of the free ends being inserted into a different contact opening in the printed circuit board. The adjustment device is moved to a second relative position, which is different from the first relative position, with respect to the circuit mount.