Abstract: A method for producing a semiconductor module arrangement includes providing a semiconductor module and a printed circuit board. The semiconductor module has a circuit mount populated with a semiconductor chip, an adjustment device in a first relative position with respect to the circuit mount, and a plurality of electrical connections each of which has a free end. Each of the connections is routed through a different passage opening in the adjustment device. The printed circuit board is pushed onto the electrical connections by each of the free ends being inserted into a different contact opening in the printed circuit board. The adjustment device is moved to a second relative position, which is different from the first relative position, with respect to the circuit mount.

Abstract: An improved belt and tread drum incorporating an improved segment is disclosed. Segments are mounted in side-by-side relationship about a central axis for radial movement inwardly and outwardly with respect to the central axis and include arcuate outer surfaces that collectively define an outer circumferential working surface of the drum. The segments each define opposite first and second longitudinal side margins, at least one of the first and second longitudinal side margins defining an irregular longitudinal profile.

Abstract: An article of footwear includes an upper and a sole assembly secured to the upper. The sole assembly includes a first portion having a lower ground engaging surface, an upper surface, and a recess formed in the upper surface. The upper surface of the first portion is in contact with the upper. A second portion is seated in the recess in the first portion and has an upper surface, with the upper surface of the second portion being in contact with the upper. The second portion comprises a foam material having a density less than 0.25 g/cm3.

Abstract: An article of footwear includes an upper and a sole assembly secured to the upper. The sole assembly includes a first portion having a lower ground engaging surface, an upper surface, and a recess formed in the upper surface. The upper surface of the first portion is in contact with the upper. A second portion is seated in the recess in the first portion and has an upper surface, with the upper surface of the second portion being in contact with the upper. The second portion comprises a foam material having a density less than 0.25 g/cm3.

Abstract: A transfer ring of the type having a plurality of shoes arranged in a substantially circular configuration to define an inwardly-facing segmented cylindrical gripping surface, and a shoe for use in such a transfer ring, are disclosed. Each shoe comprises an arcuate interior surface defining a segment of the cylindrical gripping surface. The interior surface of each shoe has a first arcuate edge and an opposite second arcuate edge arranged substantially parallel to one another, and opposite first and second end edges extending between respective ends of said first and second arcuate edges. Each first and second end edge defines a substantially non-linear shape with each first and second end edge being shaped for mating engagement with an end edge of an adjacent shoe in the circular configuration.

Abstract: A semiconductor module arrangement is provided having a first subassembly, a second subassembly and a third subassembly. The third subassembly has a quantity of adjustment pins which are fixedly connected to one another. The first subassembly has a number N1 of first adjustment openings, and the second subassembly has a number N2 of second adjustment openings. Each of the adjustment pins engages into a different one of the first adjustment openings and/or into one of the second adjustment openings. A corresponding method of producing the semiconductor module arrangement is also provided.

Abstract: A method for producing a semiconductor module arrangement includes providing a semiconductor module and a printed circuit board. The semiconductor module has a circuit mount populated with a semiconductor chip, an adjustment device in a first relative position with respect to the circuit mount, and a plurality of electrical connections each of which has a free end. Each of the connections is routed through a different passage opening in the adjustment device. The printed circuit board is pushed onto the electrical connections by each of the free ends being inserted into a different contact opening in the printed circuit board. The adjustment device is moved to a second relative position, which is different from the first relative position, with respect to the circuit mount.

Abstract: A power module includes a substrate including an insulating member and a patterned metallization on the insulating member. The patterned metallization is segmented into a plurality of spaced apart metallization regions. Adjacent ones of the metallization regions are separated by a groove which extends through the patterned metallization to the insulating member. A first power transistor circuit includes a first power switch attached to a first one of the metallization regions and a second power switch attached to a second one of the metallization regions adjacent a first side of the first metallization region. A second power transistor circuit includes a third power switch attached to the first metallization region and a fourth power switch attached to a third one of the metallization regions adjacent a second side of the first metallization region which opposes the first side. The second power transistor circuit mirrors the first power transistor circuit.

Abstract: A method of operating a progressive die wherein the progressive die acts on a work piece having an elongated body with a blank at one end. The work piece is supported by a bandolier which is also formed in the progressive die. The progressive die acts on each blank.

Abstract: A power module includes a housing, a power semiconductor die enclosed within the housing and a first power terminal embedded in the housing and electrically connected to the power semiconductor die. A portion of the first power terminal protrudes outward from an external surface of the housing. The power module further includes a second power terminal embedded in the housing and electrically connected to the power semiconductor die and electrically insulated from the first power terminal. A portion of the second power terminal protrudes outward from the external surface of the housing by a distance less than the portion of the first power terminal so that the module has power connections with different heights.

Abstract: A power module includes a substrate including an insulating member and a patterned metallization on the insulating member. The patterned metallization is segmented into a plurality of spaced apart metallization regions. Adjacent ones of the metallization regions are separated by a groove which extends through the patterned metallization to the insulating member. A first power transistor circuit includes a first power switch attached to a first one of the metallization regions and a second power switch attached to a second one of the metallization regions adjacent a first side of the first metallization region. A second power transistor circuit includes a third power switch attached to the first metallization region and a fourth power switch attached to a third one of the metallization regions adjacent a second side of the first metallization region which opposes the first side. The second power transistor circuit mirrors the first power transistor circuit.

Abstract: A power module includes a housing, a power semiconductor die enclosed within the housing and a first power terminal embedded in the housing and electrically connected to the power semiconductor die. A portion of the first power terminal protrudes outward from an external surface of the housing. The power module further includes a second power terminal embedded in the housing and electrically connected to the power semiconductor die and electrically insulated from the first power terminal. A portion of the second power terminal protrudes outward from the external surface of the housing by a distance less than the portion of the first power terminal so that the module has power connections with different heights.

Abstract: A liquid disposal system comprises a nozzle configured to suck liquid from a kitchen container, wherein the nozzle is configured to be manipulated by a user's hand. The system comprises a pipe coupled to the nozzle, wherein the pipe is configured to direct liquid from the nozzle to a disposal means. The system comprises a suction pump coupled to the nozzle and to the pipe, wherein the suction pump is configured to suck liquid through the nozzle and pipe when the suction pump is activated.

Abstract: A semiconductor device includes a semiconductor chip and a base plate coupled to the semiconductor chip. The base plate includes an upper portion and a lower portion. The upper portion has a bottom surface intersecting a sidewall of the lower portion. The semiconductor device includes a cooling element coupled to the base plate. The cooling element has a first surface directly contacting the bottom surface of the upper portion of the base plate, a second surface directly contacting the sidewall of the lower portion of the base plate, and a third surface parallel to the first surface and aligned with a bottom surface of the lower portion of the base plate.

Abstract: A method of operating a progressive die wherein the progressive die acts on a work piece having an elongated body with a blank at one end. The work piece is supported by a bandolier which is also formed in the progressive die. The progressive die acts on each blank.

Abstract: A method of operating a progressive die wherein the progressive die acts on a work piece having an elongated body with a blank at one end. The work piece is supported by a bandolier which is also formed in the progressive die. The progressive die acts on each blank.

Abstract: The present invention provides systems and methods for supporting native TDM and native Packet switching simultaneously in a meshed switching architecture. Specifically with the present invention, the meshed links are common to both TDM and packet traffic, and both types terminate to a common system interface without the need to separate physical resources and infrastructure; the common termination function has access to both the TDM (Time Slot Interchange (TSI)) switching and packet switching elements. Native TDM switching and packet switching operate in concurrently in the mesh over common links, with the personality of the links derived by the card type (attached to the mesh). In this, a given card or slot in a system can communicate in the native format to both packet based cards (slots) or TDM based cards (slots) simultaneously with no preconceived restrictions or limitations on slot or link definition.