Patents by Inventor Patryk GUMANN
Patryk GUMANN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11945104Abstract: Techniques facilitating increased operational reliability for jib cranes are provided. In one example, a jib crane can comprise a mast, a shaft mechanism, and a rod. The mast can extend vertically from a base structure. The shaft mechanism can be disposed within the mast. The rod can be coupled to a boom arm and can be disposed within the shaft mechanism. Rotation of the rod can facilitate continuous rotation of the boom arm about a longitudinal axis of the rod with respect to the base structure.Type: GrantFiled: January 8, 2021Date of Patent: April 2, 2024Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Patryk Gumann, Sean Hart, Valerio A. Grendanin, Raymond A. Watters, David Zarsky, Gilbert Bauer
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Patent number: 11948985Abstract: Devices, systems, methods, computer-implemented methods, apparatus, and/or computer program products that can facilitate a suspended Majorana fermion device comprising an ion implant defined nanorod in a semiconducting device are provided. According to an embodiment, a quantum computing device can comprise a Majorana fermion device coupled to an ion implanted region. The quantum computing device can further comprise an encapsulation film coupled to the ion implanted region and a substrate layer. The encapsulation film suspends the Majorana fermion device in the quantum computing device.Type: GrantFiled: April 18, 2022Date of Patent: April 2, 2024Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Steven J. Holmes, Devendra K. Sadana, Sean Hart, Patryk Gumann, Stephen W. Bedell, Ning Li
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Patent number: 11900217Abstract: A quantum computer includes a refrigeration system under vacuum including a containment vessel, a qubit chip contained within a refrigerated vacuum environment defined by the containment vessel. The quantum computer further includes a plurality of interior electromagnetic waveguides and a plurality of exterior electromagnetic waveguides. The quantum computer further includes a hermetic connector assembly operatively connecting the interior electromagnetic waveguides to the exterior electromagnetic waveguides while maintaining the refrigerated vacuum environment. The hermetic connector assembly includes an exterior multi-waveguide connector, an interior multi-waveguide connector, and a dielectric plate arranged between and hermetically sealed with the exterior multi-waveguide connector and the interior multi-waveguide connector. The dielectric plate permits electromagnetic energy when carried by the interior and exterior pluralities of electromagnetic waveguides to pass therethrough.Type: GrantFiled: November 15, 2022Date of Patent: February 13, 2024Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Nicholas T. Bronn, Patryk Gumann, Sean Hart, Salvatore B. Olivadese
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Patent number: 11889770Abstract: Techniques for designing and fabricating quantum circuitry, including a coplanar waveguide (CPW), for quantum applications are presented. With regard to a CPW, a central conductor and two return conductor lines can be formed on a dielectric substrate, with one return conductor line on each side of the central conductor and separated from it by a space. The central conductor can have bridge portions that can be raised a desired distance above the substrate and base conductor portions situated between the bridge portions and in contact with the surface of the substrate; and/or portions of the substrate underneath the bridge portions of the central conductor can be removed such that the bridge portions, whether raised or unraised, can be the desired distance above the surface of the remaining substrate, and the base conductor portions can be in contact with other portions of the surface of the substrate that were not removed.Type: GrantFiled: April 16, 2020Date of Patent: January 30, 2024Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Salvatore Bernardo Olivadese, Sarunya Bangsaruntip, Daniela Florentina Bogorin, Nicholas Torleiv Bronn, Sean Hart, Patryk Gumann
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Patent number: 11879789Abstract: Techniques regarding determining the temperature of one or more quantum computing devices are provided. For example, one or more embodiments described herein can comprise a system, which can comprise a temperature component that can determine a temperature of a superconducting resonator based on a frequency shift exhibited by the superconducting resonator due to a change in kinetic inductance with a change in temperature.Type: GrantFiled: July 2, 2019Date of Patent: January 23, 2024Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Salvatore Bernardo Olivadese, Daniela Florentina Bogorin, Nicholas Torleiv Bronn, Sean Hart, Patryk Gumann
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Patent number: 11875225Abstract: A system for transmission of quantum information for quantum error correction includes an ancilla qubit chip including a plurality of ancilla qubits, and a data qubit chip spaced apart from the ancilla qubit chip, the data qubit chip including a plurality of data qubits. The system includes an interposer coupled to the ancilla qubit chip and the data qubit chip, the interposer including a dielectric material and a plurality of superconducting structures formed in the dielectric material. The superconducting structures enable transmission of quantum information between the plurality of data qubits on the data qubit chip and the plurality of ancilla qubits on the ancilla qubit chip via virtual photons for quantum error correction.Type: GrantFiled: October 21, 2022Date of Patent: January 16, 2024Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Nicholas Torleiv Bronn, Daniela Florentina Bogorin, Patryk Gumann, Sean Hart, Salvatore Bernardo Olivadese
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Patent number: 11802663Abstract: Techniques facilitating multiple cryogenic systems sectioned within a common vacuum space are provided. In one example, a cryostat can comprise a plurality of thermal stages and a thermal switch. The plurality of thermal stages can intervene between a 4-Kelvin (K) stage and a Cold Plate stage. The plurality of thermal stages can include a Still stage and an intermediate thermal stage that can be directly coupled mechanically to the Still stage via a support rod. The thermal switch can be coupled to the intermediate thermal stage and an adjacent thermal stage. The thermal switch can facilitate modifying a thermal profile of the cryostat by providing a switchable thermal path between the intermediate thermal stage and the adjacent thermal stage.Type: GrantFiled: January 8, 2021Date of Patent: October 31, 2023Assignee: International Business Machines CorporationInventors: Antonio Corcoles-Gonzalez, Patryk Gumann, Jerry M. Chow
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Patent number: 11804641Abstract: Techniques for facilitating reduced thermal resistance attenuator on high-thermal conductivity substrates for quantum applications are provided. A device can comprise a substrate that provides a thermal conductivity level that is more than a defined thermal conductivity level. The device can also comprise one or more grooved transmission lines formed in the substrate. The one or more grooved transmission lines can comprise a powder substance. Further, the device can comprise one or more copper heat sinks formed in the substrate. The one or more copper heat sinks can provide a ground connection. Further, the one or more copper heat sinks can be formed adjacent to the one or more grooved transmission lines.Type: GrantFiled: June 21, 2022Date of Patent: October 31, 2023Assignee: International Business Machines CorporationInventors: Salvatore Bernardo Olivadese, Patryk Gumann, Jay M. Gambetta, Jerry M. Chow
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Patent number: 11788685Abstract: Techniques facilitating efficient thermal profile management within cryogenic environments are provided. In one example, a cryostat can comprise a plurality of thermal stages intervening between a 4-Kelvin (K) stage and a Cold Plate stage. The plurality of thermal stages can include a Still stage and an intermediate thermal stage that provides additional cooling capacity for the cryostat. The intermediate thermal stage can be directly coupled mechanically to the Still stage via a support rod.Type: GrantFiled: January 8, 2021Date of Patent: October 17, 2023Assignee: International Business Machines CorporationInventors: Jerry M. Chow, Patryk Gumann
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Patent number: 11777478Abstract: A quantum circuit includes a first qubit and a second qubit. A bus resonator transmission line is coupled between the first qubit and the second qubit. A readout bus is coupled to the first qubit. A switch is coupled to the bus resonator transmission line between the first qubit and the second qubit.Type: GrantFiled: December 10, 2021Date of Patent: October 3, 2023Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Salvatore Bernardo Olivadese, Patryk Gumann, Sean Hart, April Carniol
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Patent number: 11754323Abstract: Techniques facilitating mechanical vibration management for cryogenic environments are provided. In one example, a system can comprise a processor that executes computer executable components stored in memory. The computer executable components can comprise a linearization component and a drive component. The linearization component can translate data indicative of a nonlinear drive signal into a linear drive signal. The drive component can dynamically control operation of a compressor of a cryocooler using the linear drive signal. The cryocooler can provide cooling capacity for a cryogenic environment.Type: GrantFiled: January 8, 2021Date of Patent: September 12, 2023Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jerry M. Chow, Patryk Gumann
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Patent number: 11757169Abstract: An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.Type: GrantFiled: December 8, 2022Date of Patent: September 12, 2023Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Patryk Gumann, Salvatore Bernardo Olivadese
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Patent number: 11727295Abstract: A superconducting coupling device includes a resonator structure. The resonator structure has a first end configured to be coupled to a first device and a second end configured to be coupled to a second device. A gate is positioned proximal to a portion of the resonator structure. The gate is configured to receive a gate voltage and vary a kinetic inductance of the portion of the resonator based upon the gate voltage. The varying of the kinetic inductance induces the resonator structure to vary a strength of coupling between the first superconducting device and the second superconducting device.Type: GrantFiled: April 2, 2019Date of Patent: August 15, 2023Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Sean Hart, Patryk Gumann
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Publication number: 20230252332Abstract: A quantum computer includes a refrigeration system under vacuum including a containment vessel, a qubit chip contained within a refrigerated vacuum environment defined by the containment vessel. The quantum computer further includes a plurality of interior electromagnetic waveguides and a plurality of exterior electromagnetic waveguides. The quantum computer further includes a hermetic connector assembly operatively connecting the interior electromagnetic waveguides to the exterior electromagnetic waveguides while maintaining the refrigerated vacuum environment. The hermetic connector assembly includes an exterior multi-waveguide connector, an interior multi-waveguide connector, and a dielectric plate arranged between and hermetically sealed with the exterior multi-waveguide connector and the interior multi-waveguide connector. The dielectric plate permits electromagnetic energy when carried by the interior and exterior pluralities of electromagnetic waveguides to pass therethrough.Type: ApplicationFiled: November 15, 2022Publication date: August 10, 2023Applicant: International Business Machines CorporationInventors: Nicholas T. Bronn, Patryk Gumann, Sean Hart, Salvatore B. Olivadese
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Publication number: 20230198115Abstract: An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.Type: ApplicationFiled: December 8, 2022Publication date: June 22, 2023Inventors: Patryk Gumann, Salvatore Bernardo Olivadese
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Publication number: 20230199936Abstract: A quantum mechanical circuit includes a substrate; a first electrical conductor and a second electrical conductor provided on the substrate and spaced apart to provide a gap therebetween; and a third electrical conductor to electrically connect the first electrical conductor and the second electrical conductor. The third electrical conductor is a poor thermal conductor.Type: ApplicationFiled: December 8, 2022Publication date: June 22, 2023Inventors: Trevor Timpane, Layne A. Berge, Patryk Gumann, Sean Hart, Curtis Eugene Larsen, Michael Good
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Patent number: 11683996Abstract: A superconducting coupling device includes a resonator structure. The resonator structure has a first end configured to be coupled to a first device and a second end configured to be coupled to a second device. The device further includes an electron system coupled to the resonator structure, and a gate positioned proximal to a portion of the electron system. The electron system and the gate are configured to interrupt the resonator structure at one or more predetermined locations forming a switch. The gate is configured to receive a gate voltage and vary an inductance of the electron system based upon the gate voltage. The varying of the inductance induces the resonator structure to vary a strength of coupling between the first device and the second device.Type: GrantFiled: October 1, 2020Date of Patent: June 20, 2023Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Sean Hart, Jay M. Gambetta, Patryk Gumann
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Publication number: 20230188124Abstract: A quantum circuit includes a first qubit and a second qubit. A bus resonator transmission line is coupled between the first qubit and the second qubit. A readout bus is coupled to the first qubit. A switch is coupled to the bus resonator transmission line between the first qubit and the second qubit.Type: ApplicationFiled: December 10, 2021Publication date: June 15, 2023Inventors: Salvatore Bernardo Olivadese, Patryk Gumann, Sean Hart, April Carniol
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Patent number: 11674854Abstract: Techniques regarding determining and/or analyzing temperature distributions experienced by quantum computer devices during operation are provided. For example, one or more embodiments described herein can comprise a system, which can comprise a memory that can store computer executable components. The system can also comprise a processor, operably coupled to the memory, and that can execute the computer executable components stored in the memory. The computer executable components can comprise a region component that can define a plurality of temperature regions from a quantum computing device layout. The computer executable component can also comprise a map component that can generate a map that characterizes a temperature distribution by determining at least one temperature achieved within the plurality of temperature regions during an operation of the quantum computing device layout.Type: GrantFiled: July 2, 2019Date of Patent: June 13, 2023Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Salvatore Bernardo Olivadese, Daniela Florentina Bogorin, Nicholas Torleiv Bronn, Sean Hart, Patryk Gumann
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Publication number: 20230133709Abstract: A gated Josephson junction includes a substrate and a vertical Josephson junction formed on the substrate and extending substantially normal the substrate. The vertical Josephson junction includes a first superconducting layer, a semiconducting layer, and a second superconducting layer. The first superconducting layer, the semiconducting layer, and the second superconducting layer form a stack that is substantially perpendicular to the substrate. The gated Josephson junction includes a gate dielectric layer in contact with the first superconducting layer, the semiconducting layer, and the second superconducting layer at opposing side surfaces of the vertical Josephson junction, and a gate electrically conducting layer in contact with the gate dielectric layer. The gate electrically conducting layer is separated from the vertical Josephson junction by the gate dielectric layer.Type: ApplicationFiled: December 29, 2022Publication date: May 4, 2023Inventors: Devendra K. Sadana, Ning Li, Stephen W. Bedell, Sean Hart, Patryk Gumann