Abstract: A method includes forming a barrier layer on a substrate surface including at least one contact opening; forming an interconnect in the contact opening; and reducing the electrical conductivity of the barrier layer. A method including forming a barrier layer on a substrate surface including a dielectric layer and a contact opening, depositing a conductive material in the contact opening, removing the conductive material sufficient to expose the barrier layer on the substrate surface, and reducing the electrical conductivity of the barrier layer. An apparatus including a circuit substrate including at least one active layer including at least one contact point, a dielectric layer on the at least one active layer, a barrier layer on a surface of the dielectric layer, a portion of the barrier layer having been transformed from a first electrical conductivity to a second different and reduced electrical conductivity, and an interconnect coupled to the at least one contact point.

Abstract: Apparatus and methods of fabricating an interconnect in a dielectric material, such as by a damascene or dual damascene processes. In specific, with the use of a barrier layer, such as to contain copper-containing materials used in the fabrication of the interconnect, a slurry jet is used to remove the barrier layer without significantly damaging underlying dielectric material. Such a process is particularly useful when low-k dielectrics are used as the dielectric material, as low-k dielectrics can be easily damaged by known barrier layer removal techniques.

Abstract: A filter element incorporating an adsorbent material is provided. The filter element may comprise a first section of filter material and a second section of filter material spaced apart to form a compartment therebetween. The compartment may be filled with one or more adsorbents or the compartment may be divided into two regions, wherein one compartment region is filled with an adsorbent and the other compartment region is either filled with an ion-exchange resin or remains empty. The section of filter material adjacent to the tobacco rod may include one or more channels therethrough for passaging smoke directly from the tobacco rod into the adsorbent-filled compartment. The mouth end section of filter material may contain a breakable capsule, wherein the breakable capsule is filled with a flavoring agent capable of altering the taste characteristics of mainstream smoke.

Abstract: A Cable Access Module is periodically monitored to detect lock-up condition on an upstream channel. Traffic activity on an upstream channel of the CAM is compared to predetermined criteria to determine lock-up. If CMs are detected being coupled to the CAM, a PING message is sent to a group of CMs. If the PING is not acknowledged, a round robin counter is used to cycle through modems sending PINGs thereto. If no PINGs are acknowledged, the CAM is deemed satisfactory if upstream bytes over the upstream channel are detected. If not, an escalating maintenance subroutine implements corrective action of increasing magnitude during based on a recovery count variable that increments with each successive pass before returning to the monitor period parent routine. If CMs were detected as coupled to the CAM, but some data has been passed over the upstream channel being evaluated, the escalating maintenance subroutine is invoked.

Abstract: A method of bonding semiconductor devices is disclosed. The method comprises providing a first substrate having a first conductive interconnecting structure formed thereon and a second substrate having a second conductive interconnecting structure formed thereon. A first conductive passivation layer is selectively formed over exposed areas of the first conductive interconnecting structure. A second conductive passivation layer is selectively formed over exposed areas of the second conductive interconnecting structure. The first substrate and the second substrate are bonded together in such a way that the first conductive passivation layer bonds to the second conductive passivation layer to create a passivation-passivation interface.

Abstract: According to one aspect of the present invention, a method of electrochemically polishing a semiconductor substrate may be provided. A semiconductor substrate processing fluid, having a plurality of abrasive particles therein, may be placed between the surface of the semiconductor substrate and the polish head. The polish head may be moved relative to the surface of the semiconductor substrate to cause the abrasive particles to polish the surface of the semiconductor substrate. According to a second aspect of the present invention, a method for electro-polishing a semiconductor substrate may be provided. A semiconductor substrate may be placed in an electrolytic solution. A surface of the semiconductor substrate may be contacted with at least one conductive member. A voltage may be applied across the electrolytic solution and the at least one conductive member. The at least one conductive member may be moved across the surface of the semiconductor substrate.

Abstract: A method includes forming a barrier layer on a substrate surface including at least one contact opening; forming an interconnect in the contact opening; and reducing the electrical conductivity of the barrier layer. A method including forming a barrier layer on a substrate surface including a dielectric layer and a contact opening, depositing a conductive material in the contact opening, removing the conductive material sufficient to expose the barrier layer on the substrate surface, and reducing the electrical conductivity of the barrier layer. An apparatus including a circuit substrate including at least one active layer including at least one contact point, a dielectric layer on the at least one active layer, a barrier layer on a surface of the dielectric layer, a portion of the barrier layer having been transformed from a first electrical conductivity to a second different and reduced electrical conductivity, and an interconnect coupled to the at least one contact point.

Abstract: A method includes forming a barrier layer on a substrate surface including at least one contact opening; forming an interconnect in the contact opening; and reducing the electrical conductivity of the barrier layer. A method including forming a barrier layer on a substrate surface including a dielectric layer and a contact opening, depositing a conductive material in the contact opening, removing the conductive material sufficient to expose the barrier layer on the substrate surface, and reducing the electrical conductivity of the barrier layer. An apparatus including a circuit substrate including at least one active layer including at least one contact point, a dielectric layer on the at least one active layer, a barrier layer on a surface of the dielectric layer, a portion of the barrier layer having been transformed from a first electrical conductivity to a second different and reduced electrical conductivity, and an interconnect coupled to the at least one contact point.

Abstract: Methods of forming a microelectronic structure are described. Embodiments of those methods include providing a substrate comprising at least one opening, and then applying a nanotube slurry comprising at least one nanotube to the substrate, wherein the at least one nanotube is substantially placed within the at least one opening.

Abstract: A slurry for use in a chemical mechanical polishing process for planarizing copper-based metal structures on a substrate comprises an oxidizer, an organic complexing agent, surfactants, and a plurality of copper-based metal abrasive particles, wherein the copper in the copper-based metal is capable of dissolving into the slurry and forming copper ion complexes. During the chemical mechanical polishing process, the copper removal rate may be selectively increased by increasing the concentration of copper metal abrasive particles in the slurry, and the copper removal rate may be selectively decreased by decreasing the concentration of copper metal abrasive particles in the slurry.

Abstract: A photographic printing system for anodizing coloring refractory metals using computer graphic imaging is provided. The system comprises a plurality of film masks and a metal plate. Registration marks are formed in each of the film masks and the metal plate for aligning the film masks and the metal plate for controlling the color application in multicolored line art images. A method for anodizing coloring refractory metals using computer graphic imaging is also provided.

Abstract: Method and apparatus for providing customer data to an agent in connection with an organization's automatic call distribution (ACD) system. The desired customer data and its format can be tailored to the organization's needs and packaged as a web page. The ACD provides a URL to a browser of the agent, which accesses the URL at a server. The web page corresponds with the URL and is provided by the server to the browser. The data can be displayed to the agent, regardless of the type of customer contact with the organization's ACD system.

Abstract: According to one aspect of the present invention, a method of electrochemically polishing a semiconductor substrate may be provided. A semiconductor substrate processing fluid, having a plurality of abrasive particles therein, may be placed between the surface of the semiconductor substrate and the polish head. The polish head may be moved relative to the surface of the semiconductor substrate to cause the abrasive particles to polish the surface of the semiconductor substrate. According to a second aspect of the present invention, a method for electro-polishing a semiconductor substrate may be provided. A semiconductor substrate may be placed in an electrolytic solution. A surface of the semiconductor substrate may be contacted with at least one conductive member. A voltage may be applied across the electrolytic solution and the at least one conductive member. The at least one conductive member may be moved across the surface of the semiconductor substrate.

Abstract: A laser cutting system, including a steering mirror assembly for directing a laser beam through a predetermined cutting path along a workpiece or substrate material. The steering mirror assembly includes a base, and a mirror pivotally supported on the base by a flexure assembly which confines pivotal movement of the mirror about a vertical Y-axis and/or about a horizontal X-axis. A pair of electrical actuator assemblies include movable bobbin assemblies connected to the mirror by control rod flexures at locations on the mirror which are spaced 90° apart from one another. In operation, selective electrical energization of the actuator assemblies controls movement of the bobbin assemblies to pivot the mirror about the vertical Y-axis and/or about the horizontal X-axis throughout a number of angular orientations to thereby direct the laser beam through a predetermined cutting operation pattern along the substrate surface to cut materials from the substrate.

Abstract: A gaming tablet including a planar tablet having an upper surface, a lower surface and a plurality of sides, a padding disposed over the planar tablet and, a covering material disposed over the padding. The covering material and padding provide a soft resilient covering allowing a dealer to position his thumbs under the cards for shuffling without lifting the cards. Thus the players can not see the cards during shuffling.

Abstract: Apparatus and methods of fabricating an interconnect in a dielectric material, such as by a damascene or dual damascene processes. In specific, with the use of a barrier layer, such as to contain copper-containing materials used in the fabrication of the interconnect, a slurry jet is used to remove the barrier layer without significantly damaging underlying dielectric material. Such a process is particularly useful when low-k dielectrics are used as the dielectric material, as low-k dielectrics can be easily damaged by known barrier layer removal techniques.

Abstract: The invention provides a method of treating coronary artery disease in a human patient comprising directly injecting into an ischemic cardiac muscle, via multiple injections to different points of the cardiac muscle, a dose of a pharmaceutical composition comprising a pharmaceutically acceptable carrier and a replication-deficient adenoviral vector comprising a nucleic acid sequence encoding an angiogenic peptide operably linked to a promoter, whereby the coronary artery disease is treated.

Abstract: Method and structure for optimizing and controlling chemical mechanical planarization are disclosed. Embodiments of the invention include planarization techniques to make nonplanar surfaces comprising alternating metal and intermetal layers. Relative protrusion dimensions and uniformity of various layers may be accurately controlled using the disclosed techniques.

Abstract: A method includes forming a barrier layer on a substrate surface including at least one contact opening; forming an interconnect in the contact opening; and reducing the electrical conductivity of the barrier layer. A method including forming a barrier layer on a substrate surface including a dielectric layer and a contact opening, depositing a conductive material in the contact opening, removing the conductive material sufficient to expose the barrier layer on the substrate surface, and reducing the electrical conductivity of the barrier layer. An apparatus including a circuit substrate including at least one active layer including at least one contact point, a dielectric layer on the at least one active layer, a barrier layer on a surface of the dielectric layer, a portion of the barrier layer having been transformed from a first electrical conductivity to a second different and reduced electrical conductivity, and an interconnect coupled to the at least one contact point.

Abstract: Polyester containers having a reduced coefficient of friction (“COF”) are produced by increasing the surface roughness of the polyester using either thermal crystallization or solvent crystallization. Because the low COF reduces or eliminates friction between polyester containers, the containers do not become entangled and disrupt the manufacturing process. As a result, the containers move easily through typical conveying and filling lines in manufacturing processes that use the containers.