Patents by Inventor Paul Frank

Paul Frank has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11512140
    Abstract: Isolated monoclonal antibodies which bind to human c-Met, the hepatocyte growth factor receptor, and related antibody-based compositions and molecules, are disclosed. Pharmaceutical compositions comprising the antibodies and therapeutic and diagnostic methods for using the antibodies are also disclosed.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: November 29, 2022
    Assignee: GENMAB A/S
    Inventors: Joost J. Neijssen, Bart De Goeij, Edward Norbert Van Den Brink, Aran Frank Labrijn, Rene Hoet, Janine Schuurman, Paul Parren, Jan Van De Winkel
  • Publication number: 20220372683
    Abstract: A device for dosing a detergent ingredient into the drum of an automatic washing machine which can include a reservoir, a one-way valve, an inlet, and a dosing manifold.
    Type: Application
    Filed: May 17, 2022
    Publication date: November 24, 2022
    Inventors: Carlos Amador Zamarreno, Paul Gould, Michael Leslie Groombridge, Ahmad Khattab, Craig Nelson, Michael David Sawford, William Frank Tyldesley
  • Patent number: 11506876
    Abstract: Methods and systems for controlling a surgical microscope. Moveable optics of the surgical microscope are controlled using two sets of control parameters, to reduce jitter and image instability. Shifts in the image due to changes in temperature or due to the use of optical filter can also be compensated. Misalignment between the mechanical axis and the optical axis of the surgical microscope can also be corrected.
    Type: Grant
    Filed: March 28, 2021
    Date of Patent: November 22, 2022
    Assignee: Synaptive Medical Inc.
    Inventors: Tammy Kee-Wai Lee, William La, Paul Quevedo, Aryeh Benjamin Taub, Yusuf Bismilla, Sam Anthony Leitch, Yuri Alexander Kuzyk, Ze Shan Yao, Michael Frank Gunter Wood
  • Patent number: 11509981
    Abstract: An example loudspeaker arrangement includes a seat configured to support a listener sitting in the seat so that a head of the listener is in a listening position; and a loudspeaker array secured to the seat and disposed in a position in front of a backrest of the seat and to the side of the head when the head is in the listening position. The loudspeaker array includes at least one loudspeaker and has a main broadcasting axis representative of a main broadcasting direction, the main broadcasting direction of the loudspeaker array pointing to the head.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: November 22, 2022
    Assignee: Harman Becker Automotive Systems GmbH
    Inventors: Markus E Christoph, Paul Zukowski, Florin Negrut, Tingli Cai, Andreas Frank
  • Patent number: 11501047
    Abstract: A non-limiting example of a computer-implemented method for error injection includes executing a pre-silicon operation on a simulated chip verifying that a plurality of latches from a timing simulation set error checkers when run against a manufacturing test suite in order to generate a cross-reference file containing latch entries in a table. It executes a first post-silicon operation on a hardware chip based on the simulated chip to determine empirically that timing latches from logic built-in self tests (“LBIST”) trigger the same error checkers set by the plurality of latches verified in the simulated chip. The method updates the cross-reference file based on the results of the determination. The method executes a second post-silicon operation on the hardware chip to improve chip frequency by working around functional checkers using the cross-reference file and updating the cross-reference file based on the results of the improving.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: November 15, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Sean Michael Carey, Richard Frank Rizzolo, Bodo Hoppe, Divya Kumudprakash Joshi, Paul Jacob Logsdon, Sreekala Anandavally, William Rurik
  • Patent number: 11492371
    Abstract: The present invention relates to an in vitro method for production of heterodimeric proteins.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: November 8, 2022
    Assignee: GENMAB A/S
    Inventors: Michael Gramer, Amitava Kundu, Ewald T. J. Van Den Bremer, Muriel Van Kampen, Patrick Priem, Aran Frank Labrijn, Joyce I. Meesters, Joost J. Neijssen, Janine Schuurman, Paul Parren, Patrick Van Berkel, Werner L. Vos, Arnout F. Gerritsen
  • Patent number: 11485796
    Abstract: Described herein are, proteins comprising amino acid substitutions in at least one of a first and a second polypeptide chain. Furthermore, is described the uses and methods related to said proteins.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: November 1, 2022
    Assignee: GENMAB A/S
    Inventors: Aran Frank Labrijn, Joyce I. Meesters, Joost J. Neijssen, Edward Norbert Van Den Brink, Janine Schuurman, Paul Parren
  • Patent number: 11473322
    Abstract: An apparatus for tying a wire around one or more objects, such as concrete reinforcing includes a wire feed roller configured to pass a wire around the objects to form a loop, a wire twister configured to twist the sides of the loop together, and a guiding surface arranged to deflect the wire as it is being twisted so that the ends of the wire finish pointing at least partially in the direction of the objects being tied.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: October 18, 2022
    Assignee: HUSQVARNA AB
    Inventors: Ian David Coles, Graham Frank Barnes, Paul Anthony Goater, Matthew John Wilson, Roger Frank Duckworth
  • Publication number: 20220285307
    Abstract: A semiconductor device includes a semiconductor wafer or a single semiconductor chip or die, and a layer stack. The layer stack comprises a first layer comprising NiSi, and a second layer comprising NiV, wherein the second layer is arranged between the first layer and the semiconductor wafer or single semiconductor chip or die.
    Type: Application
    Filed: March 7, 2022
    Publication date: September 8, 2022
    Inventors: Paul Frank, Thomas Heinelt, Oliver Schilling, Sven Schmidbauer, Frank Wagner
  • Publication number: 20220244656
    Abstract: Toner particles including a core and a shell thereover; wherein the core comprises at least one styrene-acrylate copolymer selected from styrene-acrylate copolymer 1, styrene-acrylate copolymer 2, and styrene-acrylate copolymer 3, and combinations thereof a wax; and an optional colorant; wherein the shell comprises at least one styrene-acrylate copolymer selected from styrene-acrylate copolymer 1, styrene acrylate copolymer 2, styrene acrylate copolymer 3, and combinations thereof.
    Type: Application
    Filed: February 4, 2021
    Publication date: August 4, 2022
    Inventors: Jordan A. Frank, Daniel W. Asarese, Chieh-Min Cheng, Paul K. Acquaviva, Richard P. N. Veregin, Michael F. Zona
  • Publication number: 20220237352
    Abstract: Systems and techniques that facilitate quantum circuit valuation are provided. In various embodiments, a system can comprise an input component that can access a first quantum circuit. In various embodiments, the system can further comprise a valuation component that can appraise the first quantum circuit based on one or more factors (e.g., frequency factor, complexity factor, resource factor, similarity factor), thereby yielding a value score that characterizes the first quantum circuit. In various instances, the system can further comprise an execution component that can recommend deployment of the first quantum circuit based on determining that the value score exceeds a threshold.
    Type: Application
    Filed: January 28, 2021
    Publication date: July 28, 2022
    Inventors: Frederik Frank Flöther, Robert E. Loredo, Shikhar Kwatra, Paul R. Bastide
  • Patent number: 11380991
    Abstract: An electronically a steerable and switchable antenna array is provided that can produce a first beam with a first coverage range and a second beam with a second coverage range by selecting one of a first and a second beamwidth for both the first and second beams; in response to selecting the first beamwidth: switching signal inputs to narrow-beam antenna arrays; steering the first beam to one of a first positive, negative, or zero offset position; independently steering the second beam to one of a second positive, negative offset, or zero offset position; and transmitting signals received from the signal inputs via the first beam and the second beam; and in response to selecting the second beamwidth: switching signal inputs to wide-beam antenna arrays; and transmitting signals received from the signal inputs via the first beam and the second beam.
    Type: Grant
    Filed: April 28, 2021
    Date of Patent: July 5, 2022
    Assignee: Cisco Technology, Inc.
    Inventors: Fred J. Anderson, Danielle N. Bane, John M. Blosco, Paul J. Stager, Daniel N. Johnson, Timothy A. Frank, John M. Swartz
  • Patent number: 11348222
    Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the water in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: May 31, 2022
    Assignee: KLA-Tencor Technologies Corp.
    Inventors: Paul Frank Marella, Sharon McCauley, Ellis Chang, William Volk, James Wiley, Sterling Watson, Sagar A. Kekare, Carl Hess
  • Publication number: 20220050780
    Abstract: A node controller is provided to include a first interface to interface with one or more processors, a second interface including a plurality of ports to interface with node controllers within a base node and other nodes in the cache-coherent interconnect network. The node controller can further include a third interface to interface with a first plurality of memory devices and a cache coherence management logic. The cache coherence management logic can maintain, based on a first circuitry, hardware-managed cache coherency in the cache-coherent interconnect network. The cache coherence management logic can further facilitate, based on a second circuitry, software-managed cache coherency in the cache-coherent interconnect network.
    Type: Application
    Filed: August 17, 2020
    Publication date: February 17, 2022
    Inventors: Randy Passint, Paul Frank, Russell L. Nicol, Thomas McGee, Michael Woodacre
  • Publication number: 20210242034
    Abstract: An electronic device comprises a semiconductor die, a layer stack disposed on the semiconductor die and comprising one or more functional layers, wherein the layer stack comprises a protection layer which is an outermost functional layer of the layer stack, and a sacrificial layer disposed on the protection layer, wherein the sacrificial layer comprises a material which decomposes or becomes volatile at a temperature between 100° and 400° C.
    Type: Application
    Filed: February 4, 2021
    Publication date: August 5, 2021
    Applicant: Infineon Technologies AG
    Inventors: Frederik OTTO, Paul FRANK
  • Publication number: 20210225795
    Abstract: A SiC power semiconductor device includes: a power semiconductor die including SiC and a metallization layer, wherein the metallization layer includes a first metal; a die carrier, wherein the power semiconductor die is arranged over the die carrier such that the metallization layer faces the die carrier, the die carrier being at least partially covered by a plating that includes Ni; and a first intermetallic compound arranged between the power semiconductor die and the plating and including Ni3Sn4.
    Type: Application
    Filed: January 15, 2021
    Publication date: July 22, 2021
    Inventors: Ralf Otremba, Gregor Langer, Paul Frank, Alexander Heinrich, Alexandra Ludsteck-Pechloff, Daniel Pedone
  • Publication number: 20210208083
    Abstract: An apparatus and method to determine a property of a substrate by measuring, in the pupil plane of a high numerical aperture lens, an angle-resolved spectrum as a result of radiation being reflected off the substrate. The property may be angle and wavelength dependent and may include the intensity of TM- and TE-polarized radiation and their relative phase difference.
    Type: Application
    Filed: March 4, 2021
    Publication date: July 8, 2021
    Applicant: ASML Netherlands B.V.
    Inventors: Arie Jeffrey DEN BOEF, Amo Jan BLEEKER, Youri Johannes VAN DOMMELEN, Mircea DUSA, Antoine Gaston Marie KIERS, Paul Frank LUEHRMANN, Henricus Petrus Maria PELLEMANS, Maurits VAN DER SCHAAR, Cédric Désiré GROUWSTRA, Markus Geradus Maritinus VAN KRAAIJ
  • Patent number: 11046211
    Abstract: A spring assembly (1) is provided for an unlocking mechanism for a longitudinal adjustment system for a vehicle seat. The spring assembly (1) includes a clip wire (2), a spring guide (3) and a leg spring (4). In an installed state, the spring guide (3) can be disposed or is disposed in an axially movable but not rotatable manner on a straight first clip section (2.1) of the clip wire (2). The spring guide (3) can be brought or is brought into an operating state, in which it is rotatable with respect to the first clip section (2.1), via an axial movement on the first clip section (2.1). A method is further provided for installing a spring assembly (1) in an unlocking mechanism for a longitudinal adjustment system for a vehicle seat.
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: June 29, 2021
    Assignee: Adient Luxembourg Holding S.á r.l.
    Inventor: Paul Frank
  • Patent number: 11027048
    Abstract: A method for producing sterile, decellurized bioprosthetic tissue comprising: (a) contacting a human tissue with a hypotonic solution to produce a lysed tissue, (b) contacting the lysed tissue with a first surfactant to produce a surfactant-treated tissue, (c) contacting the surfactant-treated tissue with a nuclease enzyme solution to produce an enzyme-treated tissue, (d) contacting the enzyme-treated tissue with a cleaning solution comprising a second surfactant, a chaotropic agent or a mixture thereof to produce a decellurized tissue and (e) contacting the decellurized tissue with a bioburden reducing agent to produce the final bioprosthetic tissue. Kits to be used in conjunction with said method, as well as, the bioprosthetic tissue produced via said method are also provided.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: June 8, 2021
    Assignee: DECELL TECHNOLOGIES INC.
    Inventor: Paul Frank Gratzer
  • Publication number: 20210134708
    Abstract: A semiconductor package includes a power semiconductor chip comprising SiC, a leadframe part comprising Cu, wherein the power semiconductor chip is arranged on the leadframe part, and a solder joint electrically and mechanically coupling the power semiconductor chip to the leadframe part, wherein the solder joint comprises at least one intermetallic phase.
    Type: Application
    Filed: October 26, 2020
    Publication date: May 6, 2021
    Inventors: Ralf Otremba, Paul Frank, Alexander Heinrich, Alexandra Ludsteck-Pechloff, Daniel Pedone