Abstract: The present application discloses a high voltage electrolyte including an electrolyte solvent which includes a mixture of a dinitrile solvent and a nitrile solvent and is stable at voltage of about 5 V or above. The dinitrile solvent may include at least one selected from the group consisting of malononitrile, succinonitrile, glutaronitrile, adiponitrile, pimelonitrile, suberonitrile, azelanitrile and sebaconitrile. The nitrile solvent may include at least one selected from the group consisting of acetonitrile, propionitrile, butyronitrile, pivalonitrile and capronitrile. The present application also discloses a lithium ion battery including the above high voltage electrolyte. The lithium ion battery exhibits a cyclic performance of greater than about 300 cycles and with a capacity retention of greater than about 80%.

Abstract: The present invention relates to new fullerene derivatives of formulae 1a-d, 2 and 3: method of synthesizing said derivatives, and applications thereof in organic photovoltaics, e.g., organic solar cells. In particular, the fullerene derivatives of the present invention are soluble in non-halogenated solvents such that an environmental-friendly and low-cost fabrication method for industrialization of solar cell based on the new fullerene derivatives is provided. An ink formulation for forming a thin film on a substrate of organic photovoltaics comprising at least one of the fullerene derivatives of the present invention is also provided. Greater than 3% power conversion efficiency of the organic solar cells (area=0.16 cm2) formed based on the fullerene derivatives of the present invention with less pollution and lower cost in fabrication can be achieved in the present invention.

Abstract: The present invention provides an enhanced light out-coupling device for extraction of light radiation from a light source. The enhanced light out-coupling device comprises a grid having a plurality of channels, a reflective material layer coated on the grid, and a high refractive index fluid layer. In addition, the grid can be filled with phosphor particles for light converting. The device of the presently claimed invention is able to effectively avoid the scattering problem generated from the sapphire substrate and phosphor particles, as well as reduce light adsorption by the array of grid during the light extraction, leading to better image quality.

Abstract: The present invention relates to a method for fabricating a solution-processed PLED including an electron transport layer. The electron transport layer, deposited on an emission layer by a solution process, provides the performance comparable to those processed by vacuum deposition. In addition, the method of the present invention is able to lower manufacturing cost and reduce time for fabrication.

Abstract: The present invention relates to new fullerene derivatives of formulae 1a-d, 2 and 3: method of synthesizing said derivatives, and applications thereof in organic photovoltaics, e.g., organic solar cells. In particular, the fullerene derivatives of the present invention are soluble in non-halogenated solvents such that an environmental-friendly and low-cost fabrication method for industrialization of solar cell based on the new fullerene derivatives is provided. An ink formulation for forming a thin film on a substrate of organic photovoltaics comprising at least one of the fullerene derivatives of the present invention is also provided. Greater than 3% power conversion efficiency of the organic solar cells (area=0.16 cm2) formed based on the fullerene derivatives of the present invention with less pollution and lower cost in fabrication can be achieved in the present invention.

Abstract: The present application discloses a high voltage electrolyte including an electrolyte solvent which includes a mixture of a dinitrile solvent and a nitrile solvent and is stable at voltage of about 5 V or above. The dinitrile solvent may include at least one selected from the group consisting of malononitrile, succinonitrile, glutaronitrile, adiponitrile, pimelonitrile, suberonitrile, azelanitrile and sebaconitrile. The nitrile solvent may include at least one selected from the group consisting of acetonitrile, propionitrile, butyronitrile, pivalonitrile and capronitrile. The present application also discloses a lithium ion battery including the above high voltage electrolyte. The lithium ion battery exhibits a cyclic performance of greater than about 300 cycles and with a capacity retention of greater than about 80%.

Abstract: The present invention relates to a process for recovering metals from indium tin oxide (ITO) scrap. It allows the selective recovery of indium and tin from waste ITO by means of a simple and environmentally benign dissolution-deposition method, with no requirement of using strong corrosive acid/alkaline chemicals (e.g. hydrochloric acid, nitric acid, sulfuric acid and sodium hydroxide) for dissolution and complicated procedures/operation. The dissolution baths can be reused without observable recovery deterioration. It significantly reduces the cost requirement in the recovery process.

Abstract: The present invention provides an enhanced light out-coupling device for extraction of light radiation from a light source. The enhanced light out-coupling device comprises a grid having a plurality of channels, a reflective material layer coated on the grid, and a high refractive index fluid layer. In addition, the grid can be filled with phosphor particles for light converting. The device of the presently claimed invention is able to effectively avoid the scattering problem generated from the sapphire substrate and phosphor particles, as well as reduce light adsorption by the array of grid during the light extraction, leading to better image quality.

Abstract: A semiconductor chip having an exposed metal terminating pad thereover, and a separate substrate having a corresponding exposed metal bump thereover are provided. A conducting polymer plug is formed over the exposed metal terminating pad. A conforming interface layer is formed over the conducting polymer plug. The conducting polymer plug of the semiconductor chip is aligned with the corresponding metal bump. The conforming interface layer over the conducting polymer plug is mated with the corresponding metal bump. The conforming interface layer is thermally decomposed, adhering and permanently attaching the conducting polymer plug with the corresponding metal bump. Methods of forming and patterning a nickel carbonyl layer are also disclosed.

Abstract: This invention provides an object locator to locate a variety of target objects. A selective directional transceiver is used to determine the relative direction of the target object, even in a multiple-story building, from a hand held component of the object locator. And moving the hand held component toward the target object according to the relative direction shall allow the user to quickly locate the target object. The hand held component may keep a list of identifications of multiple target objects in the memory and locate them one by one. A voice recognition unit and a key stroke recognition unit in the hand held component shall allow the user of the object locator to easily locate the object by voice and/or key stroke. To share the hardware, software, memory and the display unit of an existing device like cellular phone hand set, personal digital assistant, or car alarm remote, the object locator may be (embedded) accommodated in it, and expand its additional application.

Abstract: Embodiments of systems and methods for efficient hand-off in a wireless network employ a neighbor report which may include, in addition to more convention information about neighboring access point, search thresholds, target beacon transmission time of neighboring access points, and execution thresholds. The present systems and methods also provide a mechanism of updating neighbor report and its elements. A faster and lower spectrum cost active search scheme based on sending a null packet may also be used by the systems and methods.

Abstract: This invention provides a waste issue alarm device to detect and indicate the weight increment of new urine issue or feces issue in the diaper, and transmit a waste issue alarm. The number of the urine or feces issue is counted separately. The waste issue alarm will indicate the count of the urine issue and the feces issue and their weights. An adjustable belt unit with hanger is used to hold the waste issue alarm device and hang it outside the diaper. A remote alarm may also be used. It may also monitor the urine issue and the feces issue of multiple diapers. An emergency alarm may be activated when the carried component of the device is submerged in the water.

Abstract: This invention provides an object locator to locate a variety of target objects. A selective directional transceiver is used to determine the relative direction of the target object, even in a multiple-story building, from a hand held component of the object locator. And moving the hand held component toward the target object according to the relative direction shall allow the user to quickly locate the target object. The hand held component may keep a list of identifications of multiple target objects in the memory and locate them one by one. A voice recognition unit and a key stroke recognition unit in the hand held component shall allow the user of the object locator to easily locate the object by voice and/or key stroke. To share the hardware, software, memory and the display unit of an existing device like cellular phone hand set, personal digital assistant, or car alarm remote, the object locator may be embedded in it, and expand its additional application.

Abstract: A container (10) has a lid (12) for rotation mounting thereon. A tamper evident mechanism is located for operation between the container and lid. The mechanism includes at least one projection (42) on the container and at least one corresponding flange (44) on the lid. Each flange and projection pair is arranged such that, when the lid is rotation mounted on the container, the flange moves relatively past the projection to a position such that removal of the lid by counter rotation may only occur by deforming or breaking of the flange and/or projection.

Abstract: A semiconductor chip having an exposed metal terminating pad thereover, and a separate substrate having a corresponding exposed metal bump thereover are provided. A conducting polymer plug is formed over the exposed metal terminating pad. A conforming interface layer is formed over the conducting polymer plug. The conducting polymer plug of the semiconductor chip is aligned with the corresponding metal bump. The conforming interface layer over the conducting polymer plug is mated with the corresponding metal bump. The conforming interface layer is thermally decomposed, adhering and permanently attaching the conducting polymer plug with the corresponding metal bump. Methods of forming and patterning a nickel carbonyl layer are also disclosed.

Abstract: A semiconductor chip having an exposed metal terminating pad thereover, and a separate substrate having a corresponding exposed metal bump thereover are provided. A conducting polymer plug is formed over the exposed metal terminating pad. A conforming interface layer is formed over the conducting polymer plug. The conducting polymer plug of the semiconductor chip is aligned with the corresponding metal bump. The conforming interface layer over the conducting polymer plug is mated with the corresponding metal bump. The conforming interface layer is thermally decomposed, adhering and permanently attaching the conducting polymer plug with the corresponding metal bump. Methods of forming and patterning a nickel carbonyl layer are also disclosed.

Abstract: An integrated circuit wafer element and an improved method for bonding the same to produce a stacked integrated circuit. An integrated circuit wafer according to the present invention includes a substrate having first and second surfaces constructed from a wafer material, the first surface having a circuit layer that includes integrated circuit elements constructed thereon. A plurality of vias extend from the first surface through the circuit layer and terminate in the substrate at a first distance from the first surface. The vias include a stop layer located in the bottom of each via constructed from a stop material that is more resistant to chemical/mechanical polishing (CMP) than the wafer material. The vias may be filled with an electrically conducting material to provide vertical connections between the various circuit layers in a stacked integrated circuit.

Abstract: A polishing method is achieved comprising the following steps. A layer made of material containing a metal as a main component over a substrate having recessed portions on a surface thereof so as to fill the recessed portions with the metal layer is formed. The metal is Cu, a Cu alloy, Al, or an Al alloy. The metal layer is polished by a chemical mechanical polishing method using a slurry including a polishing agent. The polishing agent contains a chemical agent and an etching agent. The chemical agent includes at least a carbonyl derivative of benzotriazole and is responsible for forming a protective film on the surface of the metal layer by reacting with the material containing a metal as a main component. The etching agent is responsible for etching the material containing a metal as a main component.

Abstract: A semiconductor chip having an exposed metal terminating pad thereover, and a separate substrate having a corresponding exposed metal bump thereover are provided. A conducting polymer plug is formed over the exposed metal terminating pad. A conforming interface layer is formed over the conducting polymer plug. The conducting polymer plug of the semiconductor chip is aligned with the corresponding metal bump. The conforming interface layer over the conducting polymer plug is mated with the corresponding metal bump. The conforming interface layer is thermally decomposed, adhering and permanently attaching the conducting polymer plug with the corresponding metal bump. Methods of forming and patterning a nickel carbonyl layer are also disclosed.

Abstract: Electromigration can be reduced in a copper-based metallization of an integrated circuit that includes a first copper-containing via that electrically connects an underlying conductive line and an overlying copper-containing line through an intervening insulating layer. Electromigration can be reduced by forming at least a second copper-containing via that electrically connects the underlying conductive line and the overlying copper-containing line through the intervening insulating layer, in parallel with the first copper-containing via. Multi-vias can provide redundancy to reduce early failure statistics. Moreover, since current is distributed among the vias, the electromigration driving force can be reduced and local Joule heating, in voids at the via interface, also may be reduced. Accordingly, even if via voids are formed, the structure may not fail by catastrophic thermal runaway due to Joule heating.