Abstract: A method of cleaning elemental copper, cobalt, or nickel from the surface of equipment hardware without corroding or damaging the equipment parts and surfaces in the event of wafer breakage and non-wafer breakage is described. A solution comprising an alkyldione peroxide, a stabilizing agent, and alcohols is used to oxidize the metal and form soluble complexes which are removed by the cleaning solution. Also, a novel alkyldione peroxide solution for cleaning elemental copper, cobalt, or nickel from the surface of equipment hardware in the event of wafer breakage and non-wafer breakage is provided.

Abstract: A method of cleaning elemental copper, cobalt, or nickel from the surface of equipment hardware without corroding or damaging the equipment parts and surfaces in the event of wafer breakage and non-wafer breakage is described. A solution includes an alkyldione peroxide, a stabilizing agent, and alcohols is used to oxidize the metal and form soluble complexes which are removed by the cleaning solution. Also, a alkyldione peroxide solution for cleaning elemental copper, cobalt, or nickel from the surface of equipment hardware in the event of wafer breakage and non-wafer breakage is provided.

Abstract: A cleaner composition for removing from within a microelectronic fabrication a copper containing residue layer in the presence of a copper containing conductor layer, and a method for stripping from within a microelectronic fabrication the copper containing residue layer in the presence of the copper containing conductor layer. The cleaner composition comprises: (1) a hydroxyl amine material; (2) an ammonium fluoride material; and (3) a benzotriazole (BTA) material. The cleaner composition contemplates the method for stripping from within the microelectronic fabrication the copper containing residue layer in the presence of the copper containing conductor layer.

Abstract: A new method to prevent copper contamination of the intermetal dielectric layer during via or dual damascene etching by forming a capping layer over the first copper metallization is described. A first copper metallization is formed in a dielectric layer overlying a semiconductor substrate wherein a barrier metal layer is formed underlying the first copper metallization and overlying the dielectric layer. The first copper metallization is planarized, then etched to form a recess below the surface of the dielectric layer. A conductive capping layer is deposited overlying the first copper metallization within the recess and overlying the dielectric layer. The conductive capping layer is removed except over the first copper metallization within the recess using one of several methods. An intermetal dielectric layer is deposited overlying the dielectric layer and the conductive capping layer overlying the first copper metallization.

Abstract: A more reactive thoria catalyst for the production of diaryl ethers from aromatic compounds, a process for making the catalyst and the use of the catalyst is taught. The thoria catalyst has a specified surface area, density and average crystal size.

Abstract: A word processor using a standard United States keyboard which enables desired Chinese characters to be displayed by virtue of a phonetic selection of the consonant and vowel of the words represented by the various characters by the actuation of the letter keys of the keyboard; and by virtue of the selection of the first and last calligraphic strokes of the respective characters by actuation of the symbol keys on the standard keyboard which simulate the shape of such strokes.

Abstract: A word processor using a standard United States keyboard is provided which enables appropriate Chinese, Japanese, or other characters, to be selected phonetically and recorded for subsequent print-out. The letters on the standard keyboard are actuated to display characters corresponding to the Chinese words or syllables, each of which generally includes a consonant and a vowel. The keys of the keyboard are marked on top with letters corresponding phonetically with the consonant portions of the Japanese, Chinese or other words. The consonants are phonetically selected by the phonetic standard American letters on the keyboard, since the correspondence between the Chinese or Japanese consonants and the English letters are generally understood by Chinese and Japanese people. The keys on the keyboard are also marked, on the front sides, with characters and letters corresponding phonetically to the vowel portions of the Chinese or Japanese words.