Abstract: A memory device including a memory array, a driver circuit, and a recover circuit is provided. The memory array includes multiple memory cells. Each memory cell is coupled to a control line, a data line, and a source line and, during a normal operation, is configured to receive first and second voltage signals. The driver circuit is configured to output at least one of the first voltage signal or the second voltage signal to the memory cells. The recover circuit is configured to output, during a recover operation, a third voltage signal, through the driver circuit to at least one of the memory cells. The third voltage signal is configured to have a first voltage level that is higher than a highest level of the first voltage signal or the second voltage signal, or lower than a lowest level of the first voltage signal or the second voltage signal.

Abstract: The shoe includes a sole and an upper including a layer of elastic material positioned to stretch and create tension that enhances securement of a foot inserted into the shoe. The shoe includes a heel cup having polymer material, affixed to the sole and upper, and having an upper portion, a midportion, and a lower portion. In a first configuration, the upper portion has a downward incline with a first angle relative to a vertical line, and the upper portion is capable of distorting into a second configuration under a load of the foot when donning the shoe. In the second configuration, the upper portion has a downward incline with a second angle relative to the vertical line, the second angle being greater than the first angle. An interior foam layer is adjacent to an interior wall of the upper portion, is compressible, and extends into the shoe opening.

Abstract: The shoe includes a sole and an upper including at least one layer of elastic material positioned to stretch and create tension that enhances securement of a foot inserted into the shoe. The shoe includes a heel cup with polymer material, the heel cup affixed to the sole and upper, and the heel cup includes an upper portion, a midportion, and a lower portion. The shoe includes an interior foam layer adjacent to at least an interior wall of the upper portion of the heel cup, the interior foam layer being compressible, and the interior foam layer extends into the shoe opening, providing securement of the foot once inserted.

Abstract: Present invention teaches the method of using a keratin hydrolysis peptide (“KHP”) solution to enhance sweetness and flavors of tea leaves. By selectively choosing specific weights of feathers and water, and treating the mixture to a high-temperature high-pressure hydrolysis process, the resulting solution is confirmed to contain at least 253 peptides and then applied to the surface of tea leaves during sprouting stage and infused to the soil around the tea trees/plants; the increased content of L-theanine and polyphenol is separately tested and confirmed. Optionally, the KHP solution can be diluted by water, as taught in the specification, before applying to the tea leaves and the soil as taught herein.

Abstract: A memory cell structure includes a transistor structure and a capacitor structure, where the capacitor structure includes a hydrogen absorption layer. The hydrogen absorption layer absorbs hydrogen, which prevents or reduces the likelihood of the hydrogen diffusing into an underlying metal-oxide channel of the transistor structure. In this way, the hydrogen absorption layer minimizes and/or reduces the likelihood of hydrogen contamination in the metal-oxide channel, which may enable a low current leakage to be achieved for the memory cell structure and reduces the likelihood of data corruption and/or failure of the memory cell structure, among other examples.

Abstract: Present invention teaches the method of using a keratin hydrolysis peptide (“KHP”) solution to increase the coffee production. By selectively choosing specific weights of feathers and water, and treating the mixture, though one embodiment does not have water mixed in, to a high-temperature high-pressure hydrolysis process, the resulting solution is confirmed to contain at least 253 peptides and then applied to the leaf surface of coffee plants at different growth stages. Optionally, the KHP solution can be diluted by water, as taught in the specification, before applying to the leaf surface of the coffee plants.

Abstract: Present invention teaches the method of using a keratin hydrolysis peptide (“KHP”) solution to accelerate the ripening and color change of the coffee fruits, to increase the reducing sugar content, and to decrease the chlorogenic acid content in coffee beans. By selectively choosing specific weights of feathers and water, and treating the mixture, though one embodiment does not have water mixed in, to a high-temperature high-pressure hydrolysis process, the resulting solution is confirmed to contain at least 253 peptides and then applied to the leaf surface of coffee plants at different growth stages. Optionally, the KHP solution can be diluted by water, as taught in the specification, before applying to the leaf surface of the coffee plants.

Abstract: The present disclosure provides a correction system and method for correcting a semiconductor circuit. The correction system includes a plurality of redundant circuit units, a plurality of switching circuit units and a control circuit. The redundant circuit units are coupled to the semiconductor circuit. The switching circuit units are coupled to the redundant circuit units and a plurality of basic circuit units of the semiconductor circuit. The control circuit is coupled to the semiconductor circuit and the switching circuit units, is configured to obtain a noise signal of the semiconductor circuit, is configured to determine whether the semiconductor circuit passes a noise test by recognizing a characteristic of the noise signal, and is configured to replace one of the basic circuit units with one of the redundant circuit units by controlling the switching circuit units when the semiconductor circuit does not pass the noise test.

Abstract: A memory device is provided, including a memory array, a driver circuit, and recover circuit. The memory array includes multiple memory cells. Each memory cell is coupled to a control line, a data line, and a source line and, during a normal operation, is configured to receive first and second voltage signals. The driver circuit is configured to output at least one of the first voltage signal or the second voltage signal to the memory cells. The recover circuit is configured to output, during a recover operation, a third voltage signal, through the driver circuit to at least one of the memory cells. The third voltage signal is configured to have a first voltage level that is higher than a highest level of the first voltage signal or the second voltage signal, or lower than a lowest level of the first voltage signal or the second voltage signal.

Abstract: A shoe has an upper with a foot receiving shoe opening. A heel counter is located at a rear portion of the upper and includes a rigid heel cup. The heel cup has a lower portion, a midportion, and an upper portion having a curvature extending from a top edge of the heel cup and that is curved downward towards the shoe opening. On a vertical cross-section, the heel cup has a S wave shape. A compressible layer is located along an inner wall of the heel cup and is configured to curve around a portion of a user's ankle above the user's heel once donned. The compressible layer may be compressed during donning of the shoe and may at least partially expand to secure the foot within the shoe once donned.

Abstract: An article of footwear includes a heel counter support situated on the upper and above the sole structure. The heel counter support may have at least two hollow receptacles with backward angles, a compressible component having two ends, and each one of the two hollow receptacles receives one end of the compressible component. The compressible component may have a first configuration and may be capable of distorting into a second configuration under a load of a user's foot when the user is donning the footwear. The compressible component may be capable of automatically returning to the first configuration after the user's foot in fully inserted into the footwear.

Abstract: The shoe includes a sole and an upper including a layer of elastic material positioned to stretch and create tension that enhances securement of a foot inserted into the shoe. The shoe includes a heel cup having polymer material, affixed to the sole and upper, and having an upper portion, a midportion, and a lower portion. In a first configuration, the upper portion has a downward incline with a first angle relative to a vertical line, and the upper portion is capable of distorting into a second configuration under a load of the foot when donning the shoe. In the second configuration, the upper portion has a downward incline with a second angle relative to the vertical line, the second angle being greater than the first angle. An interior foam layer is adjacent to an interior wall of the upper portion, is compressible, and extends into the shoe opening.

Abstract: The shoe includes a sole and an upper including at least one layer of elastic material positioned to stretch and create tension that enhances securement of a foot inserted into the shoe. The shoe includes a heel cup with polymer material, the heel cup affixed to the sole and upper, and the heel cup includes an upper portion, a midportion, and a lower portion. The shoe includes an interior foam layer adjacent to at least an interior wall of the upper portion of the heel cup, the interior foam layer being compressible, and the interior foam layer extends into the shoe opening, providing securement of the foot once inserted.

Abstract: The shoe includes a sole and an upper including at least one layer of elastic material positioned to stretch and create tension that enhances securement of a foot inserted into the shoe. The shoe includes a heel cup with thermoplastic elastomer material. The heel cup is affixed to the sole and upper and includes an upper portion, a midportion, and a lower portion. The heel cup includes enhanced flexibility regions oriented vertically along its rearmost portion. The shoe includes an interior foam layer with EVA and/or polyurethane foam and that is bonded to an interior wall of the upper portion of the heel cup. The interior foam layer is compressible and extends into the shoe opening, providing securement of the foot once inserted. The interior foam layer is covered by an elastic textile having wicking properties, the elastic textile form fitted to the shape of the interior foam layer.

Abstract: A bulk acoustic wave resonant structure and a preparation method therefor, and an acoustic wave device are provided. The bulk acoustic wave resonant structure includes: a substrate; a reflection structure, a first electrode, a piezoelectric layer and a second electrode, which are successively located on the substrate, wherein the first electrode comprises a first sub-electrode located in a first region and a second sub-electrode located in a second region other than the first region, and the piezoelectric layer respectively comes into direct contact with the first sub-electrode and the second electrode in the first region; and a first gap, which is located between the piezoelectric layer and the second sub-electrode, wherein an orthographic projection of the first gap on the substrate surrounds the first region.

Abstract: The article of footwear further includes a heel cup attached to the upper and extending from the sole structure to at least a portion of the rear heel collar of upper. Additionally, the heel cup is uniformly molded with an upper portion, midportion, and lower portion and the upper portion has a smaller mediolateral length than the midportion, and the midportion and lower portion form a concave structure configured to receive the heel. The midportion includes a peripheral portion having a first thickness and a central portion having a second thickness, and the second thickness is less than the first thickness.

Abstract: Embodiments of the present disclosure provide a bulk acoustic wave resonance structure and a preparation method therefor, and an acoustic wave device. The bulk acoustic wave resonance structure comprises: a substrate; a reflection structure, a first electrode, a piezoelectric layer, and a second electrode, which are sequentially located on the substrate, the effective region of a resonance area being a first overlapping area; a first surrounding structure surrounding the first overlapping area, said structure comprising first protruding structures and first intermittent structures that are arranged at intervals; and the first protruding structures, which are located between the piezoelectric layer and the first electrode and/or are located between the piezoelectric layer and the second electrode, the end of each first protruding structure that is close to the first overlapping area being covered by the first electrode and/or the second electrode.

Abstract: A shoe includes a heel counter with a heel cup. The heel cup may be uniformly molded with an upper portion, midportion, and a lower portion. The upper portion has a smaller mediolateral length than the midportion, and a thickness of the heel cup decreases from a peripheral portion of the heel cup toward a central region of the midportion. The central region of the midportion provides flexibility of the heel cup, and the rearmost portion of the heel cup has an overall vertical S wave cross-sectional shape.

Abstract: The article of footwear further includes a heel cup attached to the upper and extending from the sole structure to at least a portion of the rear heel collar of upper. Additionally, the heel cup is uniformly molded with an upper portion, midportion, and lower portion and the upper portion has a smaller mediolateral length than the midportion, and the midportion and lower portion form a concave structure configured to receive the heel. The midportion includes a peripheral portion having a first thickness and a central portion having a second thickness, and the second thickness is less than the first thickness.

Abstract: A device includes: a first electrode; a first interfacial layer in contact with the first electrode; a first insertion layer on the first interfacial layer, the first insertion layer having first orthorhombic-phase (O-phase) regions or first monoclinic-phase (M-phase) regions in a first area ratio that exceeds about 70%; a first dielectric layer on the first insertion layer, the first dielectric layer having tetragonal-phase (T-phase) regions in a second area ratio that exceeds those of second O-phase regions and second M-phase regions; a second insertion layer on the first dielectric layer, the second insertion layer having third O-phase regions or third M-phase regions in a third area ratio that exceeds about 70%; a second interfacial layer in contact with the second insertion layer, the second interfacial layer being a different material than the first interfacial layer; and a second electrode on the second interfacial layer.