Abstract: A package structure includes a carrier substrate, a die, and an encapsulant. The carrier substrate includes through carrier vias (TCV). The die is disposed over the carrier substrate. The die includes a semiconductor substrate and conductive posts disposed over the semiconductor substrate. The conductive posts face away from the carrier substrate. The encapsulant laterally encapsulates the die.

Abstract: The shoe includes a sole and an upper including at least one layer of elastic material positioned to stretch and create tension that enhances securement of a foot inserted into the shoe. The shoe includes a heel cup with polymer material, the heel cup affixed to the sole and upper, and the heel cup includes an upper portion, a midportion, and a lower portion. The shoe includes an interior foam layer adjacent to at least an interior wall of the upper portion of the heel cup, the interior foam layer being compressible, and the interior foam layer extends into the shoe opening, providing securement of the foot once inserted.

Abstract: The shoe includes a sole and an upper including at least one layer of elastic material positioned to stretch and create tension that enhances securement of a foot inserted into the shoe. The shoe includes a heel cup with thermoplastic elastomer material. The heel cup is affixed to the sole and upper and includes an upper portion, a midportion, and a lower portion. The heel cup includes enhanced flexibility regions oriented vertically along its rearmost portion. The shoe includes an interior foam layer with EVA and/or polyurethane foam and that is bonded to an interior wall of the upper portion of the heel cup. The interior foam layer is compressible and extends into the shoe opening, providing securement of the foot once inserted. The interior foam layer is covered by an elastic textile having wicking properties, the elastic textile form fitted to the shape of the interior foam layer.

Abstract: The shoe includes a sole and an upper including a layer of elastic material positioned to stretch and create tension that enhances securement of a foot inserted into the shoe. The shoe includes a heel cup having polymer material, affixed to the sole and upper, and having an upper portion, a midportion, and a lower portion. In a first configuration, the upper portion has a downward incline with a first angle relative to a vertical line, and the upper portion is capable of distorting into a second configuration under a load of the foot when donning the shoe. In the second configuration, the upper portion has a downward incline with a second angle relative to the vertical line, the second angle being greater than the first angle. An interior foam layer is adjacent to an interior wall of the upper portion, is compressible, and extends into the shoe opening.

Abstract: The article of footwear further includes a heel cup attached to the upper and extending from the sole structure to at least a portion of the rear heel collar of upper. Additionally, the heel cup is uniformly molded with an upper portion, midportion, and lower portion and the upper portion has a smaller mediolateral length than the midportion, and the midportion and lower portion form a concave structure configured to receive the heel. The midportion includes a peripheral portion having a first thickness and a central portion having a second thickness, and the second thickness is less than the first thickness.

Abstract: A bulk acoustic wave resonant structure and a preparation method therefor, and an acoustic wave device are provided. The bulk acoustic wave resonant structure includes: a substrate; a reflection structure, a first electrode, a piezoelectric layer and a second electrode, which are successively located on the substrate, wherein the first electrode comprises a first sub-electrode located in a first region and a second sub-electrode located in a second region other than the first region, and the piezoelectric layer respectively comes into direct contact with the first sub-electrode and the second electrode in the first region; and a first gap, which is located between the piezoelectric layer and the second sub-electrode, wherein an orthographic projection of the first gap on the substrate surrounds the first region.

Abstract: A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes channel layers, a mask structure, a gate structure and a source/drain pattern. The channel layers are stacked vertically apart along a first direction over a substrate. The mask structure is disposed over and apart from the channel layers along the first direction. The gate structure laterally extends along a second direction perpendicular to the first direction disposed, wherein the gate structure wraps around the channel layers and laterally surround the mask structure. The source/drain pattern is in contact with the channel layers.

Abstract: Embodiments of the present disclosure provide a bulk acoustic wave resonance structure and a preparation method therefor, and an acoustic wave device. The bulk acoustic wave resonance structure comprises: a substrate; a reflection structure, a first electrode, a piezoelectric layer, and a second electrode, which are sequentially located on the substrate, the effective region of a resonance area being a first overlapping area; a first surrounding structure surrounding the first overlapping area, said structure comprising first protruding structures and first intermittent structures that are arranged at intervals; and the first protruding structures, which are located between the piezoelectric layer and the first electrode and/or are located between the piezoelectric layer and the second electrode, the end of each first protruding structure that is close to the first overlapping area being covered by the first electrode and/or the second electrode.

Abstract: A shoe includes a heel counter with a heel cup. The heel cup may be uniformly molded with an upper portion, midportion, and a lower portion. The upper portion has a smaller mediolateral length than the midportion, and a thickness of the heel cup decreases from a peripheral portion of the heel cup toward a central region of the midportion. The central region of the midportion provides flexibility of the heel cup, and the rearmost portion of the heel cup has an overall vertical S wave cross-sectional shape.

Abstract: The article of footwear further includes a heel cup attached to the upper and extending from the sole structure to at least a portion of the rear heel collar of upper. Additionally, the heel cup is uniformly molded with an upper portion, midportion, and lower portion and the upper portion has a smaller mediolateral length than the midportion, and the midportion and lower portion form a concave structure configured to receive the heel. The midportion includes a peripheral portion having a first thickness and a central portion having a second thickness, and the second thickness is less than the first thickness.

Abstract: A device includes: a first electrode; a first interfacial layer in contact with the first electrode; a first insertion layer on the first interfacial layer, the first insertion layer having first orthorhombic-phase (O-phase) regions or first monoclinic-phase (M-phase) regions in a first area ratio that exceeds about 70%; a first dielectric layer on the first insertion layer, the first dielectric layer having tetragonal-phase (T-phase) regions in a second area ratio that exceeds those of second O-phase regions and second M-phase regions; a second insertion layer on the first dielectric layer, the second insertion layer having third O-phase regions or third M-phase regions in a third area ratio that exceeds about 70%; a second interfacial layer in contact with the second insertion layer, the second interfacial layer being a different material than the first interfacial layer; and a second electrode on the second interfacial layer.

Abstract: A shoe includes a sole and an upper having a heel counter with a heel cup. The upper includes a foot receiving shoe opening. The heel cup is uniformly molded with an upper portion, midportion, and lower portion. On a vertical cross-section, the heel cup has a S wave shape and a thickness of the heel cup decreases gradually from a peripheral portion of the heel cup toward a central region of the heel cup. The heel cup is attached to an interior compressible layer, and the compressible layer extends into the shoe opening. The compressible layer may be compressed by a user's foot during insertion or removal of the user's foot, and may at least partially expand to hold an ankle of the user's foot once the foot is inserted.

Abstract: A shoe has an upper with a foot receiving shoe opening. A heel counter is located at a rear portion of the upper and includes a rigid heel cup. The heel cup has a lower portion, a midportion, and an upper portion having a curvature extending from a top edge of the heel cup and that is curved downward towards the shoe opening. On a vertical cross-section, the heel cup has a S wave shape. A compressible layer is located along an inner wall of the heel cup and is configured to curve around a portion of a user's ankle above the user's heel once donned. The compressible layer may be compressed during donning of the shoe and may at least partially expand to secure the foot within the shoe once donned.

Abstract: A method of extending a lifetime of a memory cell is provided. The method includes detecting, by a memory controller, whether a memory cell has failed or not; repairing, by the memory controller, the memory cell by applying a first pulse having a first amplitude to the memory cell, in response to determining that the memory cell has failed; and writing, by the memory controller, input data to the memory cell by applying a second pulse having a second amplitude less than the first amplitude, in response to repairing the memory cell. In one expect, the detecting includes writing, by the memory controller, additional input data to the memory cell; reading, by the memory controller, data stored by the memory cell; comparing, by the memory controller, the data stored by the memory cell with the additional input data; and determining whether the memory cell has failed according to the comparison.

Abstract: An article of footwear includes a heel cup that is attached to the upper and extends from the sole structure to at least a portion of the rear heel collar of the upper. The heel cup may be uniformly molded with an upper portion, midportion, and lower portion and the upper portion has a smaller mediolateral length than the midportion, and the midportion and lower portion form a concave structure that receives the heel. The upper portion has a first configuration and is capable of distorting into a second configuration under a load of a user's foot when the user is donning the footwear. In the second configuration, at least part of the upper portion is lowered and is capable of returning to the first configuration after the load of the user's foot is removed. The midportion includes a peripheral portion that may be thicker than a central portion.

Abstract: A phase-change memory (PCM) cell is provided to include a first electrode, a second electrode, and a phase-change feature disposed between the first electrode and the second electrode. The phase-change feature is configured to change its data state based on a write operation performed on the PCM cell. The write operation includes a reset stage and a set stage. In the reset stage, a plurality of reset current pulses are applied to the PCM cell, and the reset current pulses have increasing current amplitudes. In the set stage, a plurality of set current pulses are applied to the PCM cell, and the set current pulses exhibit an increasing trend in current amplitude. The current amplitudes of the set current pulses are smaller than those of the reset current pulses.

Abstract: Disclosed herein are related to a system and a method of extending a lifetime of a memory cell. In one aspect, a memory controller applies a first pulse having a first amplitude to the memory cell to write input data to the memory cell. In one aspect, the memory controller applies a second pulse having a second amplitude larger than the first amplitude to the memory cell to extend a lifetime of the memory cell. The memory cell may include a resistive memory device or a phase change random access memory device. In one aspect, the memory controller applies the second pulse to the memory cell to repair the memory cell in response to determining that the memory cell has failed. In one aspect, the memory controller periodically applies the second pulse to the memory cell to extend the lifetime of the memory cell before the memory cell fails.

Abstract: A memory device is provided, including a memory array, a driver circuit, and recover circuit. The memory array includes multiple memory cells. Each memory cell is coupled to a control line, a data line, and a source line and, during a normal operation, is configured to receive first and second voltage signals. The driver circuit is configured to output at least one of the first voltage signal or the second voltage signal to the memory cells. The recover circuit is configured to output, during a recover operation, a third voltage signal, through the driver circuit to at least one of the memory cells. The third voltage signal is configured to have a first voltage level that is higher than a highest level of the first voltage signal or the second voltage signal, or lower than a lowest level of the first voltage signal or the second voltage signal.

Abstract: An article of footwear includes a heel cup that is attached to the upper and extends from the sole structure to at least a portion of the rear heel collar of the upper. The heel cup may be uniformly molded with an upper portion, midportion, and lower portion and the upper portion has a smaller mediolateral length than the midportion, and the midportion and lower portion form a concave structure that receives the heel. The upper portion has a first configuration and is capable of distorting into a second configuration under a load of a user's foot when the user is donning the footwear. In the second configuration, at least part of the upper portion is lowered and is capable of returning to the first configuration after the load of the user's foot is removed. The midportion includes a peripheral portion that may be thicker than a central portion.

Abstract: An article of footwear includes an upper and a U-shaped foamed ankle collar. The ankle collar may form the topmost region of the foot receiving shoe opening and the foamed ankle collar may extend at least partially around and over a foot receiving shoe opening. The ankle collar is capable of being compressed by the user's heel during foot insertion and the ankle collar may exert pressure on the user's ankle once the foot is inserted. The ankle collar may have a flattened region along its length forming a downward angle from the topmost region toward the front of the article of footwear. The ankle collar may be located along at least a portion of an inner surface of a heel cup and the heel cup may have a shoe-horn like configuration. The ankle collar may reduce the dimensions of the shoe opening when not compressed.