Abstract: A quantum dot composite structure and a method for forming the same are provided. The quantum dot composite structure includes: a glass particle including a glass matrix and a plurality of quantum dots located in the glass matrix, wherein at least one of the plurality of quantum dots includes an exposed surface in the glass matrix; and an inorganic protective layer disposed on the glass particle and covering the exposed surface.

Abstract: A stacked package structure and a manufacturing method thereof are provided. The stacked package structure includes an upper redistribution layer, a first chip, and an upper molding layer. The first chip is disposed on the upper redistribution layer and is electrically connected to the upper redistribution layer. The upper molding layer is disposed on the first chip and the upper redistribution layer, and is configured to package the first chip. The upper molding layer includes a recess, the recess is recessed relative to a surface of the upper molding layer away from the upper redistribution layer, and the recess is circumferentially formed around a periphery of the upper molding layer.

Abstract: A fan-out package structure and a manufacturing method thereof are provided. The fan-out package structure includes an upper redistribution layer, a die, a passive element, and an active element. The upper redistribution layer includes a first surface and a second surface opposite to the first surface. The die is disposed on the first surface of the upper redistribution layer and is electrically connected to the upper redistribution layer. The passive element is disposed on the second surface of the upper redistribution layer and is electrically connected to the upper redistribution layer. The active element is disposed on the second surface of the upper redistribution layer and is electrically connected to the upper redistribution layer. The active element is laterally adjacent to the passive element, and the die is electrically connected to the active element and the passive element through the upper redistribution layer.

Abstract: An illumination system providing an illumination light beam is provided. The excitation light beam passes beside a central region from a first side of the wavelength conversion wheel and then exits from a second side and is transmitted to the first mirror. The first mirror reflects the excitation light beam to the central region on the second side. A non-conversion reflection region of the wavelength conversion wheel reflects the excitation light beam, or a wavelength conversion reflection region of the wavelength conversion wheel converts the excitation light beam into a converted light beam and reflects the converted light beam. The excitation light beam or the converted light beam that is reflected is transmitted to the light homogenizing element. The light homogenizing element homogenizes the excitation light beam and the converted light beam to form the illumination light beam. A projection device is proposed, too.

Abstract: An illumination system providing an illumination light beam is provided. The excitation light beam passes beside a central region from a first side of the wavelength conversion wheel and then exits from a second side and is transmitted to the first mirror. The first mirror reflects the excitation light beam to the central region on the second side. A non-conversion reflection region of the wavelength conversion wheel reflects the excitation light beam, or a wavelength conversion reflection region of the wavelength conversion wheel converts the excitation light beam into a converted light beam and reflects the converted light beam. The excitation light beam or the converted light beam that is reflected is transmitted to the light homogenizing element. The light homogenizing element homogenizes the excitation light beam and the converted light beam to form the illumination light beam. A projection device is proposed, too.

Abstract: A chip package structure using silicon interposer as interconnection bridge lifts multi-dies above the fan-out molding package embedded with premade Si interposer interconnection bridge under the multi-die space. The interconnection bridge connects the multi-dies through fine pitch high I/O interconnection. A first RDL and a second RDL are further disposed on top side and bottom side of the fan-out molding package, further providing connection for the multi-dies to a substrate via the connection routing inside the fan-out molding package.

Abstract: A method for forming a semiconductor device structure and method for forming the same are provided. The method includes forming a conductive pad over the substrate, and forming a protection layer over the conductive pad. The method also includes forming a conductive structure accessibly arranged through the protection layer and electrically connected to the conductive pad, and the conductive structure has a curved top surface. A lowest point of the curved top surface of the conductive structure is higher than a topmost surface of the protection layer.

Abstract: A semiconductor device structure and method for forming the same are provided. The semiconductor device structure includes a conductive pad formed over a substrate, and a conductive structure formed over the conductive pad. The conductive structure has a curved top surface. The semiconductor device structure also includes a protection layer between the conductive pad and the conductive structure. A lowest point of the curved top surface of the conductive structure is higher than a topmost surface of the protection layer.

Abstract: A chip package structure using silicon interposer as interconnection bridge lifts multi-dies above the fan-out molding package embedded with premade Si interposer interconnection bridge under the multi-die space. The interconnection bridge connects the multi-dies through fine pitch high I/O interconnection. A first RDL and a second RDL are further disposed on top side and bottom side of the fan-out molding package, further providing connection for the multi-dies to a substrate via the connection routing inside the fan-out molding package.

Abstract: A fan-out chip package assembly with fine pitch silicon through via uses one or more silicon interposers in the bottom package as interconnections between the top package and the substrate. The one or more partially distributed silicon interposers may be disposed in the same layer of the bottom semiconductor die according to the design requirement of the fan-out contact pads of the top package, allowing more design freedom of the top high level chips.

Abstract: A semiconductor package structure including a circuit substrate, a redistribution layer, and at least two dies is provided. The circuit substrate has a first surface and a second surface opposite the first surface. The redistribution layer is located on the first surface. The redistribution layer is electrically connected to the circuit substrate. The spacing of the opposing sidewalls of the redistribution layer is less than the spacing of the opposing sidewalls of the circuit substrate. The redistribution layer is directly in contact with the circuit substrate. At least two dies are disposed on the redistribution layer. Each of the at least two dies has an active surface facing the circuit substrate. One of the at least two dies is electrically connected to the other of the at least two dies by the redistribution layer. A manufacturing method of a semiconductor package structure is also provided.

Abstract: A handheld apparatus, a control method thereof of a presenting mode and a computer-readable recording medium are provided. The handheld apparatus includes at least one first sensor, a second sensor, a screen and a processor. The first sensor is disposed on the handheld apparatus. The second sensor detects orientation. The handheld apparatus has an auto-rotate screen function of automatically adjusting a presenting mode of the screen to a portrait mode or a landscape mode according to the orientation. The processor determines whether the handheld apparatus is in a hold state according to sensing data of the first sensor. In response to determining that the handheld apparatus is in the hold state, the processor locks the presenting mode according to the presenting mode currently performed by the handheld apparatus without adjusting the presenting mode according to the auto-rotate screen function. Accordingly, a convenient operation of the presenting mode is provided.

Abstract: A method for operating a handheld device, a handheld device, and a computer-readable recording medium thereof are provided. A first and a second sensors are disposed on a first and a second side of the handheld device, respectively. A processor of the handheld device is configured to determine the handheld device is in a left hand state or a right hand state according to a compared result between sensing data of the first and second sensors, and to display an operating interface corresponding to the right or left hand state on a display, where the compared result includes a force comparison between forces applied on the first and second sides of the handheld device, the first side corresponds to the right hand state, and the second side corresponds to the left hand state. Accordingly, a better operating experience for one hand can be provided.

Abstract: A method for operating a handheld device, a handheld device, and a computer-readable recording medium thereof are provided. The handheld device at least includes, but not limited to, a body, one or more sensors, a display, and a processor. The one or more sensors are disposed on at least one side of the body, respectively. The processor is coupled to the one or more sensors and the display and configured to receive an operation through the one or more sensors, determine a position of the operation on at least one side of the body according to sensing data generated by the sensors, and display a user interface corresponding to the position by the display. Accordingly, a convenient function for one hand operation is provided.

Abstract: An image processing method, suitable for a mobile device including a camera unit and a display unit, includes separating a foreground portion and a background portion of a first image sensed by the camera unit, calculating a dimension of the foreground portion, generating an adjustment level in positively correlated with the dimension, applying an image effect at the adjustment level to the foreground or the background portion of the first image to generate a second image, and displaying the second image on the display unit.

Abstract: A semiconductor device structure and method for forming the same are provided. The semiconductor device structure includes a conductive pad formed over a substrate, and a conductive structure formed over the conductive pad. The conductive structure has a curved top surface. The semiconductor device structure also includes a protection layer between the conductive pad and the conductive structure. A lowest point of the curved top surface of the conductive structure is higher than a topmost surface of the protection layer.

Abstract: A method for forming a semiconductor device structure and method for forming the same are provided. The method includes forming a conductive pad over the substrate, and forming a protection layer over the conductive pad. The method also includes forming a conductive structure accessibly arranged through the protection layer and electrically connected to the conductive pad, and the conductive structure has a curved top surface. A lowest point of the curved top surface of the conductive structure is higher than a topmost surface of the protection layer.

Abstract: A method for operating a handheld device, a handheld device, and a computer-readable recording medium thereof are provided. A first and a second sensors are disposed on a first and a second side of the handheld device, respectively. A processor of the handheld device is configured to determine the handheld device is in a left hand state or a right hand state according to a compared result between sensing data of the first and second sensors, and to display an operating interface corresponding to the right or left hand state on a display, where the compared result includes a force comparison between forces applied on the first and second sides of the handheld device, the first side corresponds to the right hand state, and the second side corresponds to the left hand state. Accordingly, a better operating experience for one hand can be provided.

Abstract: A method for operating a handheld device, a handheld device, and a computer-readable recording medium thereof are provided. The handheld device at least includes, but not limited to, a body, one or more sensors, a display, and a processor. The one or more sensors are disposed on at least one side of the body, respectively. The processor is coupled to the one or more sensors and the display and configured to receive an operation through the one or more sensors, determine a position of the operation on at least one side of the body according to sensing data generated by the sensors, and display a user interface corresponding to the position by the display. Accordingly, a convenient function for one hand operation is provided.