Abstract: A device is provided. The device may comprise an integrated circuit package. The integrated circuit package may comprise a first layer and a solder mask. The first layer may comprise a top surface wherein the solder mask is disposed on the top surface of the first layer. The solder mask may comprise a vertical edge. The vertical edge may form an angle between the top surface of the first layer and the vertical edge of not less than 90 degrees. The angle may be not less than 120 degrees or not less than 150 degrees.

Abstract: A structure comprises a substrate comprising a plurality of traces on top of the substrate, a plurality of connectors formed on a top surface of a semiconductor die, wherein the semiconductor die is formed on the substrate and coupled to the substrate through the plurality of connectors and a dummy metal structure formed at a corner of a top surface of the substrate, wherein the dummy metal structure has two discontinuous sections.

Abstract: Disclosed are compositions and synthetic methods of phosphors that can be efficiently excited by blue light. The wavelength of the blue light is between 400 nm to 480 nm. The phosphors contain garnet fluorescent material activated with cerium, which contain Ba, Y, Tb, Lu, Sc, La, Gd, Sm, or combinations thereof, and Al, Ga, In, or combinations thereof. In addition, the phosphors are easily and quickly prepared in a large amount. The phosphors have high thermal stability and high emission intensity, therefore, being high of value in industry for utilization.

Abstract: An embodiment ladder bump structure includes an under bump metallurgy (UBM) feature supported by a substrate, a copper pillar mounted on the UBM feature, the copper pillar having a tapering curved profile, which has a larger bottom critical dimension (CD) than a top critical dimension (CD) in an embodiment, a metal cap mounted on the copper pillar, and a solder feature mounted on the metal cap.

Abstract: A system and method for forming conductive connections is disclosed. An embodiment comprises forming conductive material on to contacts of a semiconductor substrate. The semiconductor substrate is then inverter such that the conductive material is beneath the semiconductor substrate, and the conductive material is reflowed to form a conductive bump. The reflow is performed using gravity in order to form a more uniform shape for the conductive bump.

Abstract: A package-on-package (PoP) comprises a substrate with a plurality of substrate traces, a first function chip on top of the substrate connected to the substrate by a plurality of bond-on-trace connections, and a second function chip on top of the first function chip, directly connected to the substrate. Another package-on-package (PoP) comprises: a substrate with a plurality of substrate traces, a first function chip on top of the substrate connected to the substrate by a plurality of solder mask defined (SMD) connections formed on SMD bonding pads connected to solder bumps, and a second function chip on top of the first function chip, directly connected to the substrate by a plurality of bond-on-trace connections.

Abstract: A system and method for forming conductive connections is disclosed. An embodiment comprises forming conductive material on to contacts of a semiconductor substrate. The semiconductor substrate is then inverter such that the conductive material is beneath the semiconductor substrate, and the conductive material is reflowed to form a conductive bump. The reflow is performed using gravity in order to form a more uniform shape for the conductive bump.

Abstract: Disclosed are compositions and synthetic methods of phosphors that can be efficiently excited by blue light. The wavelength of the blue light is between 400 nm to 480 nm. The phosphors contain garnet fluorescent material activated with cerium, which contain Ba, Y, Tb, Lu, Sc, La, Gd, Sm, or combinations thereof, and Al, Ga, In, or combinations thereof. In addition, the phosphors are easily and quickly prepared in a large amount. The phosphors have high thermal stability and high emission intensity, therefore, being high of value in industry for utilization.