Abstract: A laser assembly, such as a flood illuminator, has laser (e.g., VCSEL) emitters on a substrate configured to emit optical signals. An optic structure of optically transparent material, such as a polymer, is formed directly on the substrate, and micro-optic elements are nano-imprinted on the optic structure. The micro-optic elements are arranged in optical communication with the optical signals emitted from the laser emitters to perform field mapping or other optical functions. The laser emitters are on the same surface of the substrate as the optic structure along with electrical contacts so forming the optic structure involves covering the electrical contacts with a protective layer, dispensing a polymer for the optic structure, cutting away portions of the optic structure, removing the remaining protective layer, and exposing the electrical contacts.

Abstract: A display includes a stack that includes, from top to bottom: a display layer including an array of spaced pixels and/or spaced subpixels and an array of spaced transmission spaces, wherein each transmission space is defined by a spacing between a subset of the spaced pixels and/or spaced subpixels; a micro-lens array (MLA) layer including an array of micro-lenses, wherein each micro-lens includes a curved surface in alignment with a corresponding one of the transmission spaces; and a laser light emitting (LLE) layer including an array laser diodes, wherein each laser diode is positioned in alignment with one micro-lens of the MLA layer and the corresponding one of the transmission spaces of the display layer and the curved surfaces of the micro-lenses face the LLE layer.

Abstract: VCSEL-based flood illuminators are fabricated to be compact and surface-mounted devices. A substrate is constructed as a panel array having top and bottom electrodes. Individual ones of the VCSEL dies are mounted in electrical communication with pairs of the top electrodes. The VCSEL dies are encased in an encasement disposed on the top surface of the substrate, and a diffuser structure is nano-imprinted adjacent each of the VCSEL dies. The encasement can use a potting resin and a polymer layer. The potting resin encases the VCSEL dies. The polymer layer is softer and is disposed on the potting resin. Nanoimprint lithography forms the diffuser structures in the polymer layer. The panel array is then singulated to form the individual VCSEL-based flood illuminators.

Abstract: A shared optic assembly for combined flood and dot illumination modules is disclosed. The shared optic assembly includes a first high-powered VCSEL element for providing a flood beam and a second high-powered VCSEL element for providing a dot beam, where both the first and second VCSEL elements share the same optics and are incorporated onto the same module for space savings.

Abstract: An illumination device includes a laser source, a conventional diffuser element, and an extender optic with a curved interior surface and a curved outer surface. Light emitted by the laser source with a given field of illumination (FOI) is received by the conventional diffuser element and outputted towards the interior surface of the extender optic with an increased FOI; the outer surface of the extender optic then outputs the light received by the interior surface as light with an even greater FOI, typically in the range of 120° to 185°.

Abstract: A light-emitting module structure includes a substrate, a plurality of light-emitting diodes (LEDs) disposed on the substrate, and a light-guiding layer covering the light-emitting diodes. The light-guiding layer has an upper surface, the upper surface has a plurality of recesses, and the recesses are above the light-emitting diodes or between the light-emitting diodes. This light-emitting module structure can improve the brightness and uniformity of the light-emitting module.

Abstract: An illumination device includes a laser source, a conventional diffuser element, and an extender optic with a curved interior surface and a curved exterior surface. Light emitted by the laser source with a given field of illumination (FOI) is received by the conventional diffuser element and outputted towards the interior surface of the extender optic with an increased FOI; the exterior surface of the extender optic then outputs the light received by the interior surface as light with an even greater FOI usually in the range of 120°-185°.

Abstract: An illumination device includes a laser source, a conventional diffuser element, and an extender optic with a curved interior surface and a curved exterior surface. Light emitted by the laser source with a given field of illumination (FOI) is received by the conventional diffuser element and outputted towards the interior surface of the extender optic with an increased FOI; the exterior surface of the extender optic then outputs the light received by the interior surface as light with an even greater FOI, usually in the range of 120°-185°.

Abstract: A light-emitting module structure includes a substrate, a plurality of light-emitting diodes (LEDs) disposed on the substrate, and a light-guiding layer covering the light-emitting diodes. The light-guiding layer has an upper surface, the upper surface has a plurality of recesses, and the recesses are above the light-emitting diodes or between the light-emitting diodes. This light-emitting module structure can improve the brightness and uniformity of the light-emitting module.

Abstract: A light-emitting module structure includes a substrate, a plurality of light-emitting diodes (LEDs) disposed on the substrate, and a light-guiding layer covering the light-emitting diodes. The light-guiding layer has an upper surface, the upper surface has a plurality of recesses, and the recesses are above the light-emitting diodes or between the light-emitting diodes. This light-emitting module structure can improve the brightness and uniformity of the light-emitting module.

Abstract: A light-emitting diode (LED) device and a manufacturing method thereof are provided. The LED device includes a frame body, a first conductive extension structure, a second conductive extension structure, and a LED chip. The frame body includes an upper surface, a bottom, a recess on the opposite side of the bottom, and a first side surface and a second side surface opposite to each other. The first and second conductive extension structures are located in the frame body. The first and second conductive extension structures extend from the first side surface to the second side surface of the frame body. The frame body encapsulates a left side surface, a right side surface, a top surface, and a bottom surface of each of the first and second conductive extension structures. The LED chip is disposed in the recess and includes a first conductive pad and a second conductive pad.

Abstract: A light-emitting diode (LED) package includes a substrate with upper and lower surfaces, including: a metal block; an electrically insulating region surrounding at least a portion of the metal block; an LED chip mounted on the substrate and in electrical communication with the metal block; and an encapsulant covering at least an upper surface of the LED chip. A light-emitting system includes a plurality of light-emitting diode (LED) chips; and a package support for the plurality of LED chips.

Abstract: A light-emitting module structure includes a substrate, a plurality of light-emitting diodes (LEDs) disposed on the substrate, and a light-guiding layer covering the light-emitting diodes. The light-guiding layer has an upper surface, the upper surface has a plurality of recesses, and the recesses are above the light-emitting diodes or between the light-emitting diodes. This light-emitting module structure can improve the brightness and uniformity of the light-emitting module.

Abstract: A light-emitting device includes a base having an insulating part and a metal block; a light-emitting diode (LED) chip over the base; a water soluble paste between the LED chip and the base metal block for chip fixing and heat conduction; packaging glue covering the LED chip; and the LED chip bottom, water soluble paste and the base metal block form an all-metal thermal conducting path to achieve low a thermal resistance.

Abstract: A light-emitting diode (LED) device and a manufacturing method thereof are provided. The LED device includes a frame body, a first conductive extension structure, a second conductive extension structure, and a LED chip. The frame body includes an upper surface, a bottom, a recess on the opposite side of the bottom, and a first side surface and a second side surface opposite to each other. The first and second conductive extension structures are located in the frame body. The first and second conductive extension structures extend from the first side surface to the second side surface of the frame body. The frame body encapsulates a left side surface, a right side surface, a top surface, and a bottom surface of each of the first and second conductive extension structures. The LED chip is disposed in the recess and includes a first conductive pad and a second conductive pad.

Abstract: A light emitting diode package structure allows for an improved light-emitting efficiency by including a first reflecting material layer with through holes; a flip chip on the first reflecting material layer, with the electrodes inlaid in the through holes of the first reflecting material layer; a first transparent material layer surrounding the side surface of the flip chip except the electrodes; and a second reflecting material layer surrounding the first transparent material layer. An interface between the first transparent material layer and the reflecting material layer is an inclined plane, an arc plane, or an irregular shape, to thereby facilitate upward light reflection of the flip chip. A wavelength conversion material layer is over the first reflecting material layer, the flip chip, and the second reflecting material layer.

Abstract: A light source module includes a substrate, a first illumination element, a second illumination element and a third illumination element. The first illumination element includes a blue LED chip disposed on the substrate and a first wavelength converting layer that covers the blue LED chip, in which blue light emitted from the blue LED chip can be converted to light in the range of a first wavelength. The second illumination element includes a blue LED chip disposed on the substrate and a second wavelength converting layer that covers the blue LED chip, in which blue light emitted from the blue LED chip can be converted to light in the range of a second wavelength. The third illumination element includes a blue LED chip.

Abstract: A light-emitting diode (LED) package includes a substrate with upper and lower surfaces, including: a metal block; an electrically insulating region surrounding at least a portion of the metal block; an LED chip mounted on the substrate and in electrical communication with the metal block; and an encapsulant covering at least an upper surface of the LED chip. A light-emitting system includes a plurality of light-emitting diode (LED) chips; and a package support for the plurality of LED chips.

Abstract: A light-emitting diode (LED) package, including: a substrate with front and back surfaces, including: at least two metal blocks; an insulation portion, wherein the metal blocks are disposed in the insulation portion and have at least portions of upper and lower surfaces exposed; and an electrical insulation region between the at least two metal blocks; an LED chip disposed over, and forming one or more electrical connections with, the at least two metal blocks; and a package encapsulant disposed over the LED chip surface and covering at least a portion of the substrate; wherein the at least two metal blocks have protrusion connection portions that extend to an edge of the substrate.

Abstract: A light emitting diode package structure includes: a first reflecting material layer with through holes; a flip chip on the first reflecting material layer, with the electrodes inlaid in the through holes of the first reflecting material layer; a first transparent material layer surrounding the side surface of the flip chip except the electrodes; a second reflecting material layer surrounding the first transparent material layer, the interface between the first transparent material layer and the reflecting material layer is an inclined plane, an arc plane, or an irregular shape, to thereby facilitate upward light reflection of the flip chip; and a wavelength conversion material layer covered over the above structure.