Abstract: A light-emitting diode (LED) package, including: a substrate with front and back surfaces, including: at least two metal blocks; an insulation portion, wherein the metal blocks are disposed in the insulation portion and have at least portions of upper and lower surfaces exposed; and an electrical insulation region between the at least two metal blocks; an LED chip disposed over, and forming one or more electrical connections with, the at least two metal blocks; and a package encapsulant disposed over the LED chip surface and covering at least a portion of the substrate; wherein the at least two metal blocks have protrusion connection portions that extend to an edge of the substrate.

Abstract: A package support including: metal frames connected together; one or more dielectric materials disposed in an inner gap of the metal frames; wherein: the package support has a frame region and a function region; wherein the function region has complete upper and lower surfaces configured to prevent leakage if at least one of the entire upper or lower surfaces is covered with an encapsulant material. A fabrication method allows for manufacturing the package support with a high cell density, relatively low price, high reflectivity, good heat dissipation, and high reliability. The LED package using the package support has a smaller size and improved dissipation properties.

Abstract: A light-emitting device includes a base having an insulating part and a metal block; a light-emitting diode (LED) chip over the base; a water soluble paste between the LED chip and the base metal block for chip fixing and heat conduction; packaging glue covering the LED chip; and the LED chip bottom, water soluble paste and the base metal block form an all-metal thermal conducting path to achieve low a thermal resistance.

Abstract: This application relates to a packaging structure, particularly to a light emitting diode package structure.

Abstract: A package support including: metal frames connected together; one or more dielectric materials disposed in an inner gap of the metal frames; wherein: the package support has a frame region and a function region; wherein the function region has complete upper and lower surfaces configured to prevent leakage if at least one of the entire upper or lower surfaces is covered with an encapsulant material. A fabrication method allows for manufacturing the package support with a high cell density, relatively low price, high reflectivity, good heat dissipation, and high reliability. The LED package using the package support has a smaller size and improved dissipation properties.

Abstract: A light source module includes a substrate, a first LED package and a second LED package. The first and second LED packages are disposed on the substrate. The first LED package includes a first blue LED chip and a first phosphor. The first blue LED chip emits light in the range of the wavelength for blue light. The first phosphor is used to convert the wavelength of a portion of the light emitted from the first blue LED chip. The second LED package includes a second blue LED chip and a second phosphor. The second blue LED chip emits light in the range of the wavelength for blue light. The second phosphor is used to convert the wavelength of a portion of the light emitted from the second blue LED chip. The wavelength associated with the second phosphor is greater than that associated with the first phosphor.

Abstract: The invention provides a light emitting diode package structure, including: a light emitting diode chip formed on a substrate; a composite coating layer formed on the light emitting diode chip, wherein the composite coating layer comprises a first coating layer and a second coating layer, and the composite coating layer has a reflectivity greater than 95% at the wavelength of 500-800 nm; a cup body formed on the substrate, wherein the cup body surrounds the light emitting diode chip; and an encapsulation housing covering the light emitting diode chip, wherein the encapsulation housing comprises a wavelength transformation material.

Abstract: A light-emitting diode (LED) package comprising a carrier, an LED chip and a phosphor glue is provided. The carrier has a recess, an upper surface, and a ring-shape rough surface connected to a top edge of the recess. The LED chip is disposed within the recess. The phosphor glue fills up the recess and over the upper surface of the carrier. An edge of the phosphor glue contacts the ring-shape rough surface.

Abstract: A light source module includes a substrate, a first illumination element, a second illumination element and a third illumination element. The first illumination element includes a blue LED chip disposed on the substrate and a first wavelength converting layer that covers the blue LED chip, in which blue light emitted from the blue LED chip can be converted to light in the range of a first wavelength. The second illumination element includes a blue LED chip disposed on the substrate and a second wavelength converting layer that covers the blue LED chip, in which blue light emitted from the blue LED chip can be converted to light in the range of a second wavelength. The third illumination element includes a blue LED chip.

Abstract: A light-emitting diode (LED) package comprising a carrier, an LED chip and a phosphor glue is provided. The carrier has a recess, an upper surface, and a ring-shape rough surface connected to a top edge of the recess. The LED chip is disposed within the recess. The phosphor glue fills up the recess and over the upper surface of the carrier. An edge of the phosphor glue contacts the ring-shape rough surface.

Abstract: A light source module includes a substrate, a first LED package and a second LED package. The first and second LED packages are disposed on the substrate. The first LED package includes a first blue LED chip and a first phosphor. The first blue LED chip emits light in the range of the wavelength for blue light. The first phosphor is used to convert the wavelength of a portion of the light emitted from the first blue LED chip. The second LED package includes a second blue LED chip and a second phosphor. The second blue LED chip emits light in the range of the wavelength for blue light. The second phosphor is used to convert the wavelength of a portion of the light emitted from the second blue LED chip. The wavelength associated with the second phosphor is greater than that associated with the first phosphor.

Abstract: A light-tuning method is provided. In the method, a filter material is first selected for filtering out unwanted light of a specific wavelength to obtain a transmittance spectrum. The transmittance spectrum is multiplied by an eye sensitivity function to obtain a filtered spectrum. The filtered spectrum has a wavelength range between 450 nm and 650 nm. According to a full width at half maximum (FWHM) wavelength range of the filtered eye sensitivity function, a phosphor is selected and a light-emitting spectrum of the phosphor is determined so that between the light-emitting spectrum of the phosphor and the filtered eye sensitivity function is an optimal matching degree.