Patents by Inventor Pei-Song Cai

Pei-Song Cai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LIGHT EMITTING DIODE PACKAGE STRUCTURE
    Publication number: 20120235198
    Abstract: The invention provides a light emitting diode package structure, including: a light emitting diode chip formed on a substrate; a composite coating layer formed on the light emitting diode chip, wherein the composite coating layer comprises a first coating layer and a second coating layer, and the composite coating layer has a reflectivity greater than 95% at the wavelength of 500-800 nm; a cup body formed on the substrate, wherein the cup body surrounds the light emitting diode chip; and an encapsulation housing covering the light emitting diode chip, wherein the encapsulation housing comprises a wavelength transformation material.
    Type: Application
    Filed: March 15, 2012
    Publication date: September 20, 2012
    Applicant: LEXTAR ELECTRONICS CORPORATION
    Inventors: Pei-Song Cai, Tzu-Pu Lin, Szu-Wei Fu