Abstract: The invention relates to an arrangement for installing a source into a gas deposition reactor. The arrangement comprises at least one source fitting for the source such that the source fitting is connected to a reaction space of the gas deposition reactor, and a source installable at least partly inside the source fitting or a source space connected to the source fitting. According to the invention, the arrangement further comprises reception means in the source fitting for receiving the source, and charging means for installing the source in place in the source fitting for use, and a chamber (1), provided in the source, for a solid or liquid source material (3), and isolating means (7, 19) for isolating the chamber (1) substantially from environment.

Abstract: The invention relates to an arrangement in connection with an ALD reactor comprising a reaction chamber, the arrangement comprising fittings for feeding a reaction gas to the reaction chamber and for suctioning the reaction gas back, and fittings for feeding a barrier gas. The fittings for feeding and suctioning back the reaction gas and for feeding the barrier gas comprise a middle element having multiple parallel channels which extend through the element, and a first and a second flow-reversing element arranged at ends of the middle element into which the channels open, the flow-reversing elements being arranged to combine the channels in the middle element so as to provide an interchannel flow.

Abstract: A glass product of the present invention (1) comprises a glass substrate (2), a reflective metal layer (3) deposited on the glass substrate, and a passivation layer (4) deposited on the reflective metal layer. According to the present invention, the passivation layer (4) is deposited using an Atomic Layer Deposition (ALD) process.

Abstract: A reaction chamber of a reactor for coating or treating a substrate by an atomic layer deposition process (ALD) by exposing the substrate to alternately repeated surface reactions of two or more gas-phase reactants. The reaction chamber is configured to generate capacitively coupled plasma and comprises a reaction space within said reaction chamber, a first inlet to guide gases into the reaction chamber and an outlet to lead gases out of the reaction chamber. The reaction chamber is configured to lead the two or more reactants into the reaction chamber such that the two or more reactants may flow through the reaction space across the substrate in a direction essentially parallel to the inner surface of the lower wall.

Abstract: The invention relates to a process for coating and/or doping a surface of a substrate, an inner surface of a structure or another piece to be processed in a reaction space with the atomic layer deposition method (ALD method). In the process the substrate surface to be processed is subjected alternately to iterated, saturated surface reactions by feeding successive pulses of starting materials into the reaction space.

Abstract: The invention relates to an apparatus for producing nanotubes, the apparatus being adapted to produce doped and/or undoped single-walled or multi-walled nanotubes, the apparatus comprising at least a thermal reactor. In accordance with the invention, the reactor is at least of the hottest part thereof and at least partly manufactured from a material that is at least partly sublimed into the thermal reactor as a result of the thermal reactor being heated, and the sublimed material at least partly participates in the growth of the nanotubes.

Abstract: The invention relates to an arrangement for installing a source into a gas deposition reactor. The arrangement comprises at least one source fitting for the source such that the source fitting is connected to a reaction space of the gas deposition reactor, and a source installable at least partly inside the source fitting or a source space connected to the source fitting. According to the invention, the arrangement further comprises reception means in the source fitting for receiving the source, and charging means for installing the source in place in the source fitting for use, and a chamber (1), provided in the source, for a solid or liquid source material (3), and isolating means (7, 19) for isolating the chamber (1) substantially from environment.

Abstract: The invention relates to a reaction chamber of an ALD reactor which comprises a bottom wall, a top wall and side walls extending between the bottom wall and the top wall which define an inner portion (28) of the reaction chamber. The reactor further comprises one or more feed openings (30) for feeding gas into the reaction chamber and one or more discharge openings (40, 50) for discharging gas fed into the reactor from the reaction chamber. The reaction chamber is characterized in that each side wall of the reaction chamber comprises one or more feed openings (30), in which case all side walls of the reaction chamber participate in gas exchange.

Abstract: The invention relates to a loading apparatus for an ALD reactor, the ALD reactor comprising a vacuum chamber (2) having a first end wall (6) and a second end wall (20), which comprises a rear flange, and side walls/casing (22) connecting the first and the second end wall, and a reaction chamber (4) provided inside the vacuum chamber (2). According to the invention, the loading apparatus is provided in the side wall/casing (22) of the vacuum chamber (2), in which case one or more substrates (10) may be introduced into the reaction chamber (4) and removed therefrom through the side wall (22) of the vacuum chamber (2).

Abstract: A hot source for vapour deposition apparatuses for supplying source substance into a reactor, the source comprising a source container having a source space for the source substance. The source further comprises a lid comprising first heating means for heating the lid, the lid being detachably installable in the source container in such a way that the heat generated by the first heating means is transmitted by conduction to the source container and further to the source space to heat the source substance.

Abstract: A reactor for an atomic layer deposition (ALD) method, the reactor comprising a vacuum chamber which has a first end wall provided with a loading hatch, a second end wall provided with a rear flange, side walls/casing connecting the first and the second end walls, and at least one source material fitting for feeding source materials into the vacuum chamber of the reactors. According to the invention, at least one of the source material fittings is provided in the side wall/casing of the vacuum of the reactor.

Abstract: In the method, silver is protected against tarnishing using an Atomic Layer Deposition method. In the Atomic Layer Deposition method, a thin film coating is formed 5 on the surface of silver by depositing successive molecule layers of the coating material. For example aluminium oxide (Al 2O3) or zirconium oxide may be used as the coating material.

Abstract: High dielectric constant (high-k) materials are formed directly over oxidation-susceptible conductors such as silicon. A discontinuous layer is formed, with gaps between grains of the high-k material. Exposed conductor underneath the grain boundaries is oxidized or nitridized to form, e.g., silicon dioxide or silicon nitride, when exposed to oxygen or nitrogen source gases at elevated temperatures. This dielectric growth is preferential underneath the grain boundaries such that any oxidation or nitridation at the interface between the high-k material grains and covered conductor is not as extensive. The overall dielectric constant of the composite film is high, while leakage current paths between grains is reduced. Ultrathin high-k materials with low leakage current are thereby enabled.

Abstract: A dielectric film is formed by atomic layer deposition to conformally fill a narrow, deep trench for device isolation. The method of the illustrated embodiments includes alternately pulsing vapor-phase reactants in a string of cycles, where each cycle deposits no more than about a monolayer of material, capable of completely filling high aspect ratio trenches. Additionally, the trench-fill material composition can be tailored by processes described herein, particularly to match the coefficient of thermal expansion (CTE) to that of the surrounding substrate within which the trench is formed. Mixed phases of mullite and silica have been found to meet the goals of device isolation and matched CTE. The described process includes mixing atomic layer deposition cycles of aluminum oxide and silicon oxide in ratios selected to achieve the desired composition of the isolation material, namely on the order of 30% alumina and 70% silicon oxide by weight.

Abstract: The invention relates to a method for doping material, the method being characterized by depositing at least one dopant deposition layer or a part thereof on the surface of the material and/or on a surface of a part or parts thereof with the atom layer deposition (ALD) method, and further processing the material coated with a dopant in such a manner that the original structure of the dopant layer is changed to obtain new properties for the doped material. The material to be doped is preferably glass, ceramic, polymer, metal, or a composite material made thereof, and the further processing of the material coated with the dopant is a mechanical, chemical, radiation, or heat treatment, whereby the aim is to change the refraction index, absorbing power, electrical and/or heat conductivity, colour, or mechanical or chemical durability of the doped material.

Abstract: The present invention relates generally to depositing elemental thin films. In particular, the invention concerns a method of growing elemental metal thin films by Atomic Layer Deposition (ALD) using a boron compound as a reducing agent. In a preferred embodiment the method comprises introducing vapor phase pulses of at least one metal source compound and at least one boron source compound into a reaction space that contains a substrate on which the metal thin film is to be deposited. Preferably the boron compound is capable of reducing the adsorbed portion of the metal source compound into its elemental electrical state.

Abstract: Containers for providing vapor phase reactant from liquid sources include bubbler designs and designs in which carrier gas flows over the liquid surface. Among the bubbler arrangements, a bypass conductance is provided to release excess pressure from the gas volume inside the container, or an enlarged bubbler tube is provided with a volume sufficient to accommodate all possible liquid backflow without having the liquid exit the container. Among the overflow designs, flow dividers provide a tortuous path for the gas to increase the time exposure of carrier gas packets to the evaporating liquid surface. The flow dividers can be microporous to encourage capillary action, thereby increasing the evaporating surface. The tortuous gas flow path can be separated from the liquid phase by a breathable semi-porous membrane that permits vapor phase reactant to pass through but prohibits liquid from passing in the other direction.

Abstract: Apparatus, and associated method, for facilitating use of an antenna assembly forming a portion of a communication station, such as a node of a wireless mesh network. Antenna information is determined and stored at a routing table of the node. The antenna information is combined with an IP address or other identifier of another node to which a data packet is to be communicated. The antenna information is utilized to define characteristics to be exhibited by the antenna assembly to best facilitate communication of the data packet between the nodes.

Abstract: Method and structures are provided for conformal lining of dual damascene structures in integrated circuits. Trenches and contact vias are formed in insulating layers. The trenches and vias are exposed to alternating chemistries to form monolayers of a desired lining material. Exemplary process flows include alternately pulsed metal halide and ammonia gases injected into a constant carrier flow. Self-terminated metal layers are thus reacted with nitrogen. Near perfect step coverage allows minimal thickness for a diffusion barrier function, thereby maximizing the volume of a subsequent filling metal for any given trench and via dimensions.

Abstract: A method of growing a thin film onto a substrate placed in a reaction chamber according to the ALD method by subjecting the substrate to alternate and successive surface reactions. The method includes providing a first reactant source and providing an inactive gas source. A first reactant is fed from the first reactant source in the form of repeated alternating pulses to a reaction chamber via a first conduit. The first reactant is allowed to react with the surface of the substrate in the reaction chamber. Inactive gas is fed from the inactive gas source into the first conduit via a second conduit that is connected to the first conduit at a first connection point so as to create a gas phase barrier between the repeated alternating pulses of the first reactant entering the reaction chamber. The inactive gas is withdrawn from said first conduit via a third conduit connected to the first conduit at a second connection point.