Abstract: A spreading device (10) includes an injector (14) and a spreading tube (16) connected with the injector. The injector contains therein a viscous thermal medium material for being spread on a surface of a cooling device for electronic components. The spreading tube defines therein at least one outlet hole (164) for release of the thermal medium material contained in the injector. The spreading device further includes means formed on the spreading tube for evenly distributing the material released through the outlet hole of the spreading tube over an entire area of the surface to be applied with the thermal medium material.

Abstract: A flexible circuit incorporating an electrostatic discharge limiting feature, comprising a dielectric substrate selected from polyimide or liquid crystal polymer film having at least one conductive trace coated on at least one surface of the substrate wherein the discharge limiting feature includes a thin conductive polymer coating selectively applied over a at least a portion of the non-critical region of the circuit, said feature reducing the surface resistivity of the circuit to about 104 ohms to about 108 ohms and having tribocharging of less than about 50 V.

Abstract: A liquid cooling system (100) for removing heat from a heat-generating component is disclosed. The liquid cooling system includes a heat-absorbing member (20), a heat-dissipating member (30), a pump (50) and a mounting mechanism (10, 60). The heat-absorbing member defines therein a fluid flow channel (26) for passage of a coolant. The pump is in fluid communication with the heat-absorbing member and the heat-dissipating member for driving the coolant to circulate between the heat-absorbing member and the heat-dissipating member. The mounting mechanism includes a bottom portion (10) and a top portion (60) cooperating with the bottom portion to define therebetween a receiving space. The heat-absorbing member, heat-dissipating member and pump are received in the receiving space and are mounted to the mounting mechanism.

Abstract: A modular jack connector has an anti-mismating element for preventing incorrect insertion of smaller sized plug connectors. The modular jack connector includes all insulating housing, an insulating terminal seat disposed in the insulating housing, a plurality of contacts disposed in the insulating terminal seat, and two metal anti-mismating elements. One end of each anti-mismating element is fixed to the insulating terminal seat, and the other end is bifurcated with an inner bifurcation bent downward and vertically to form a stopper and an outer bifurcation extending forward and downward to form an inclined guide. The distance between the two stoppers of the two anti-mismating elements is smaller than that between the two inclined guides and equals the width of the smaller sized plug connector. A smaller sized plug connector cannot contact the inclined guides and are blocked by two stoppers to avoid incorrect insertion while it is inserted.

Abstract: A mounting assembly (30) for mounting an evaporator (21) of a refrigeration system (20) to an electronic component (10) includes a housing member (31) and a clamping member (32). The housing member defines a through hole (33) with the electronic component located therein. The evaporator is received in the through hole and located in axial alignment with the electronic component. The evaporator defines therein a fluid flow channel (25) for passage of a refrigerant fluid. The refrigeration system is in fluid communication with the fluid flow channel of the evaporator to supply refrigerant fluid thereto. The clamping member is attached to the housing member and has an abutting portion (84) integrally formed therefrom for exerting an uniform force to the evaporator to maintain the evaporator in thermal contact with the electronic component.

Abstract: A cooling device for multiple heat generating components is disclosed, which includes an evaporator (1), a condenser (3), a vapor conduit (6), a liquid conduit (5) and a diffluent member (19). The evaporator includes at least two cooling members (15) for thermally contacting the multiple heat-generating components, respectively. Each of the cooling members defines therein a fluid flow channel (22) for passage of a refrigerant fluid. The vapor and liquid conduits each are connected between the cooling member and the condenser. The diffluent member is in fluid communication with the liquid conduit and the fluid flow channel of each of the cooling members. The diffluent member functions to evenly distribute the refrigerant fluid into the cooling members so as to maintain the same heat removal capacity for the cooling members.

Abstract: A method for controlling the position of air gaps in intermetal dielectric layers between conductive lines and a structure formed using such a method. A first dielectric layer is deposited over at least two features and a substrate and an air gap is formed between the at least two features and above the feature height. The first dielectric layer is etched between the at least two features to open the air gap. Then a second dielectric layer is deposited over the etched first dielectric layer to form an air gap between the at least two features and completely below the feature height.

Abstract: A rotary total heat exchange apparatus includes at least an air-providing member, a first air passage and a second air passage, a sensible heat exchanger (21), and a total heat exchange wheel (1). The air-providing member provides a first airflow from outdoors and a second airflow from indoors into the rotary total heat exchange apparatus. The first and second air passages isolate from each other for guiding the first and second airflows respectively passing through. The sensible heat exchanger spans across the first and second air passages simultaneously for conducting a sensible heat exchange between the first and second airflows. The total heat exchange wheel is capable of rotating through the first and second air passages for conducting a total heat exchange between the first and second airflows.

Abstract: In a method and system for placing an IC (integrated circuit) die onto a package substrate, a first reference is determined after locating a first fiducial on the package substrate, and a second reference is determined after locating a second fiducial on the package substrate. The IC die is placed onto the package substrate to be aligned with respect to the first and second references of the first and second fiducials that are comprised of a plurality of markings such as a plurality of dots.

Abstract: In a method and system for inspecting alignment between an IC (integrated circuit) die and a package substrate, a plurality of fiducials are located on the package substrate for determining a plurality of references. A center point of the package substrate is determined from the plurality of references. In addition, whether a center point of the IC die is aligned to the center point of the package substrate within an acceptable range is determined.

Abstract: A high density plasma chemical vapor deposition (HDP-CVD) process is used to deposit silicon dioxide in trenches of various widths. The thickness of the silicon dioxide filling both narrow and wide trenches is made more uniform by reducing an HDP-CVD etch to deposition ratio. The lowered etch to deposition ratio is achieved by lowering a ratio of oxygen to silane gas, by lowering the power of a high frequency bias signal, and by lowering the total gas flow rate.

Abstract: A method and system for detecting the presence of subterranean termites, involving use of a thermal imaging camera to scan the structure before installation of an acoustic sensor in order to quickly locate potential areas of subterranean termite infestation, and an acoustic sensor in the form of an accelerometer or the disclosed innovative acoustic sensors having a bandwidth of at least 100 Hz to 15 kHz to detect noises made by the subterranean termites. Information collected by the acoustic sensor may be transmitted to a portable mini-computer (pocket PC) for confirmation and to a central operations center for inclusion in a comprehensive database of termite data and information.

Abstract: This invention relates to various methods for using a thermal imaging apparatus to inspect exterior and interior residential components. In particular these methods can be used to detect mold, electrical problems and moisture in EFIS residential building components.

Abstract: An OXO-type inter-poly insulator (where X is a high-K metal oxide and O is an insulative oxide) is defined by forming an amorphous metal oxide layer on a silicon-based insulator (e.g., a silicon oxide layer) and then nitridating at least upper and lower sub-layers of the amorphous metal oxide with a low temperature plasma treatment that maintains temperature below the recrystallization temperature of the amorphous material. Such a plasma treatment has been found to improve breakdown voltage characteristics of the insulator. In one embodiment, the metal oxide includes aluminum oxide and it is fluorinated with low temperature plasma prior to nitridation.

Abstract: A method for producing an ultraviolet light (UV) transmissive silicon nitride layer in a plasma enhanced chemical vapor deposition (PECVD) reactor is presented. The UV transmissive film is produced by reducing, in comparison to a standard silicon nitride process, a flow rate of the silane and ammonia gas precursors to the PECVD reactor, and significantly increasing a flow rate of nitrogen gas to the reactor. The process reduces the concentration of Si—H bonds in the silicon nitride film to provide UV transmissivity. Further, the amount of nitrogen in the film is greater than in a standard PECVD silicon nitride film, and as a percentage constitutes a greater part of the film than silicon. The film has excellent step coverage and a low number of pinhole defects. The film may be used as a passivation layer in a UV erasable memory integrated circuit.

Abstract: A digital camera is provided, comprising a case, a lens, a liquid crystal display, a control button and a light emitting object, wherein the case has a rear cover, the control button is located on the rear cover, and the light emitting object is located on the back of the control button. Through the variations of the lighting color of the light emitting object irradiated on the control button, the user can recognize the current usage mode of the digital camera by the color through the light emitting object, thus making operations thereof more recognizable.

Abstract: An acoustic attenuator includes an intake air duct having an intake air duct opening leading to an outside environment and a blower fan opening leading to a blower fan. Air is drawn through the intake air duct opening towards the blower fan and a primary reflecting panel disposed in the intake air duct. The primary reflecting panel is configured to reflect sound propagated from the blower fan away from the intake air duct opening.

Abstract: A method for controlling the position of air gaps in intermetal dielectric layers between conductive lines and a structure formed using such a method. A first dielectric layer is deposited over at least two features and a substrate and an air gap is formed between the at least two features and above the feature height. The first dielectric layer is etched between the at least two features to open the air gap. Then a second dielectric layer is deposited over the etched first dielectric layer to form an air gap between the at least two features and completely below the feature height.

Abstract: Newly elucidated sequences of hepatitis C virus type 4 and type 5 are described, together with those of a newly discovered type 6. Unique type-specific sequences in the NS4, NS5 and core regions enable HCV detection and genotyping into types 1 to 6. Antigenic peptides and immunoassays are described.

Abstract: A method for controlling the position of air gaps in intermetal dielectric layers between conductive lines and a structure formed using such a method. A first dielectric layer is deposited over at least two features and a substrate and an air gap is formed between the at least two features and above the feature height. The first dielectric layer is etched between the at least two features to open the air gap. Then a second dielectric layer is deposited over the etched first dielectric layer to form an air gap between the at least two features and completely below the feature height.