Abstract: A method of aggregation of a source address bunch. The method includes constituting a source address block, associating the source address block to form a source address bunch, and allocating, split, merging, and aggregating the source address bunch.

Abstract: A safe and environmental protection package for tiny battery provides the tiny battery recycled and prevents the children from obtaining and eating by mistake, the technical scheme comprising a bottom cover body and a top cover body; the bottom cover body including a bottom piece body and a containing groove; an exit part disposed in one end of the containing groove and an access groove disposed in the other end thereof; two symmetric low positioning blocks and two symmetric high positioning blocks, by which a containing space is formed with the top cover body; said top cover body including a top piece body, a top groove part, and inserting slit; by applied to the above-mentioned structures, the tiny battery dispose inside the package is removed by inserting the used tiny battery.

Abstract: The invention generally relates to compounds of formula (I) with neural protective effect, and preparation and uses thereof. The compounds have multiple mechanisms or functions, for example, inhibition of monoamine oxidase and cholinesterase, scavenging of free radicals, and protection of cells such as nerve cells. The compounds can be used for manufacture of medicaments of cell protection, for prevention and/or treatment of monoamine oxidase, cholinesterase and free radicals related diseases, for example, neurodegenerative diseases such as Alzheimer's disease, Parkinson's disease and stroke, and free-radical related diseases such as heart disease, myocardial ischemia, diabetes and other cardiovascular and cerebrovascular diseases.

Abstract: A safe package of micro battery with used battery recycling function, which can prevent the children from taking the micro battery easily and swallowed by mistake, comprising a lower cover plate, a folding portion, and an upper cover plate, the same side edge of said lower cover plate and said upper cover plate respectively connected with corresponding side of folding portion; said folding portion configure to fold the upper cover plate in the lower cover plate for fixing integrally and matched mutually; the lower cover plate including a concave part, a insertion slot, an exit slot, and two projecting parts; the upper cover plate including a insertion slit, two sides slits, and an exit slit thereby taking the new micro battery and recycled the used battery via double hands.

Abstract: A semiconductor optoelectronic structure with increased light extraction efficiency, includes a substrate; a buffer layer is formed on the substrate and includes a pattern having plural grooves formed adjacent to the substrate; a semiconductor layer is formed on the buffer layer and includes an n-type conductive layer formed on the buffer layer, an active layer formed on the n-type conductive layer, and a p-type conductive layer formed on the active layer; a transparent electrically conductive layer is formed on the semiconductor layer; a p-type electrode is formed on the transparent electrically conductive layer; and an n-type electrode is formed on the n-type conductive layer.

Abstract: This invention provides a load-balancing structure for packet switches and its constructing method. In this method, the structure based on self-routing concentrators is divided into two stages, that is, a first stage and a second stage fabric. A virtual output group queue (VOGQ) is appended to each input group port of the first stage fabric, and a reordering buffer (RB) is configured behind each output group port of the second stage fabric. Packets stored in the VOGQ are combined into data blocks with preset length, which is divided into data slices of fixed size, finally each data slice is added an address tag and is delivered to the first stage fabric for self-routing. Once reaching the RB, data slices are recombined into data blocks. This invention solves the packet out-of-sequence problem in the load-balancing Birkhoff-von Neumann switching structure and improves the end-to-end throughput.

Abstract: A structure of semiconductor device includes a first semiconductor layer; an intermediate layer on a surface of said first semiconductor layer; a second semiconductor layer on said intermediate layer, wherein said intermediate layer and said second semiconductor layer are integrated to a set of sub-structures; and a semiconductor light emitting device on said second semiconductor layer.

Abstract: Work described herein provides, in one embodiment, a method for increasing proliferation or replication of pancreatic beta cells in a subject in need thereof, comprising administering to said subject an effective amount of an agent that increases the level or activity of hepatocellular carcinoma-associated protein TD26 (TD26), thereby increasing proliferation or replication of pancreatic beta cells. Such an agent may function by, for example, increasing the level of active TD26 in the subject or by increasing the functional activity of TD26 in the subject.

Abstract: Articles and methods for forming nanostructures having unique and/or predetermined shapes are provided. The methods and articles may involve the use of nucleic acid containers as structural molds. For instance, a pre-designed nucleic acid container including a cavity may be used to control the shape-specific growth of nanoparticles. Growth of the nanoparticles within the cavities may be confined by the specific shape of the nucleic acid container. In some embodiments, the resulting nucleic acid-nanoparticle structures can be used to control the orientation and numbers of surface ligands on the surface of nanoparticles. The addressability of the surface ligands can be used to form higher ordered assemblies of the structures.

Abstract: A semiconductor optoelectronic structure with increased light extraction efficiency, includes a substrate; a buffer layer is formed on the substrate and includes a pattern having plural grooves formed adjacent to the substrate; a semiconductor layer is formed on the buffer layer and includes an n-type conductive layer formed on the buffer layer, an active layer formed on the n-type conductive layer, and a p-type conductive layer formed on the active layer; a transparent electrically conductive layer is formed on the semiconductor layer; a p-type electrode is formed on the transparent electrically conductive layer; and an n-type electrode is formed on the n-type conductive layer.

Abstract: A method for manufacturing a polychromatic light emitting diode device, comprising steps of providing an epitaxial substrate and forming a multiple semiconductor layer on the epitaxial substrate, wherein the multiple semiconductor layer comprises an n-type semiconductor layer, a p-type semiconductor layer and an active layer. The active layer emits light of a first wavelength. Thereafter a first wavelength conversion layer is formed on the multiple semiconductor layer. The first wavelength conversion layer is made of semiconductor and absorbs a portion of the light of a first wavelength and emits light of a second wavelength, wherein the second wavelength is longer than the first wavelength.

Abstract: A method of aggregation of a source address bunch. The method includes constituting a source address block, associating the source address block to form a source address bunch, and allocating, split, merging, and aggregating the source address bunch.

Abstract: A semiconductor optoelectronic structure with increased light extraction efficiency and a fabrication method thereof are presented. The semiconductor optoelectronic structure includes continuous grooves formed under an active layer of the semiconductor optoelectronic structure to reflect light from the active layer and thereby direct more light through a light output surface so as to increase the light intensity from the semiconductor optoelectronic structure.

Abstract: A method for fabricating flip-chip semiconductor optoelectronic devices initially flip-chip bonds a semiconductor optoelectronic chip attached to an epitaxial substrate to a packaging substrate. The epitaxial substrate is then separated using lift-off technology.

Abstract: A lateral thermal dissipation LED and a fabrication method thereof are provided. The lateral thermal dissipation LED utilizes a patterned metal layer and a lateral heat spreading layer to transfer heat out of the LED. The thermal dissipation efficiency of the LED is increased, and the lighting emitting efficiency is accordingly improved.

Abstract: A method for fabricating flip-chip semiconductor optoelectronic devices initially flip-chip bonds a semiconductor optoelectronic chip attached to an epitaxial substrate to a packaging substrate. The epitaxial substrate is then separated using lift-off technology.

Abstract: A method for manufacturing a polychromatic light emitting diode device, comprising steps of providing an epitaxial substrate and forming a multiple semiconductor layer on the epitaxial substrate, wherein the multiple semiconductor layer comprises an n-type semiconductor layer, a p-type semiconductor layer and an active layer. The active layer emits light of a first wavelength. Thereafter a first wavelength conversion layer is formed on the multiple semiconductor layer. The first wavelength conversion layer is made of semiconductor and absorbs a portion of the light of a first wavelength and emits light of a second wavelength, wherein the second wavelength is longer than the first wavelength.

Abstract: A wavelength conversion layer is formed on a surface of a light emitting device for transforming a portion of light emitted from the light emitting device into light of a different wavelength. The transformed light is mixed with the untransformed light, and thus the light emitting device can emit light having preferred CIE coordinates.

Abstract: A system and a method for starting a cloud computing service according to a user location are disclosed, the system comprises an authentication server, a central management server, a central database management server, a central storage server, a local management server, a local computing server, and a local storage server to determine a user access location, and to distribute cloud computing resources, thereby providing a simple, convenient and efficient cloud computing service.

Abstract: A semiconductor device fabrication method is disclosed. A buffer layer is provided and a first semiconductor layer is formed on the buffer layer. Next, a first intermediate layer is formed on the first semiconductor layer by dopant with high concentration during an epitaxial process. A second semiconductor layer is overlaid on the first intermediate layer. A semiconductor light emitting device is grown on the second semiconductor layer. The formation of the intermediate layer and the second semiconductor layer is a set of steps.