Abstract: A panel assembly of packaged integrated circuit devices including a conductive substrate panel having an array of device areas and a plurality of locking passageways. The locking passageways are positioned about an inactive buffer area which surrounds the periphery of the array of device areas. The panel assembly also includes a molded cap that is molded over the topside of the panel to encapsulate the array of device areas and the inactive buffer area. The molded cap includes conforming locking stem portions that extend into each of the locking passageways in a manner locking the molded cap to the substrate panel such that during singulation of the device areas, the molded cap will not separate from the substrate panel at the inactive buffer area. In another aspect of the invention, a method for producing the panel assembly having the locking passageways is described.

Abstract: An image projection system is provided that includes a portable projector, where the projector includes a light engine, and a projector housing having a closed configuration and an open configuration, where in the closed configuration the projector housing at least partially encloses the light engine, and in the open configuration the projector housing supports the light engine.

Abstract: Briefly described, embodiments of this disclosure include systems and methods for ejecting fluid from a fluid ejection system. One exemplary method, among others, includes: heating a fluid to a lower threshold using an electric heating layer; heating the fluid to an upper threshold using laser energy; and ejecting a volume of fluid.

Abstract: A lamp assembly including an integral reflector and heat sink having a reflector portion comprising an integrated heat sink and a plurality of integral cooling fins connected to the integrated heat sink, a cathode assembly mechanically coupled to the reflector portion, an anode mechanically coupled to the reflector portion and electrically isolated from the cathode assembly, and at least one thermal stress reduction feature.

Abstract: A leadless leadframe semiconductor package having a plurality of contacts, which have contact surfaces on the bottom surface of the package. At least some of the contacts have integrally formed stems that extend outward to the peripheral surface of the package. These stems have heights and widths less than the heights and widths of their corresponding contacts. A molded cap encapsulates at least a portion of the die, the stems and the contacts. Another aspect of the invention pertains to a leadless leadframe panel assembly having a conductive substrate panel that has at least one array of device areas, each array of device areas having a plurality of tie bars and a plurality of contacts. The contacts also have integrally formed stems that extend towards and connect to one of the tie bars. The stems have widths and heights that are less than the widths and heights of their corresponding contacts.

Abstract: A technique is described to reduce overfill of light that has exited a light integrating device and is applied to an optical modulator in the form of an illuminating pattern. The illumination reduction technique makes the illuminating pattern more closely conform to a active planar surface of the optical modulator by at least partially providing anamorphic magnification of the illuminating pattern.

Abstract: An integral reflector and heat sink for use in a projector assembly includes a reflector portion comprising an integrated heat sink and a plurality of integral cooling fins connected to the integrated heat sink.

Abstract: An image projection system is provided that includes a portable projector, where the projector includes a light engine, and a projector housing having a closed configuration and an open configuration, where in the closed configuration the projector housing at least partially encloses the light engine, and in the open configuration the projector housing supports the light engine.

Abstract: A fluidic apparatus for modulating the rate of fuel flow into the combustor of a gas turbine engine. The apparatus includes a fluidic oscillator device (preferably an astable fluidic oscillator, or “flip-flop”) having a supply inlet connected to a fluid fuel source and a pair of outlets one of which is connected to the combustor. The fluidic device operates to output fluid fuel from the outlets alternately, so modulating fuel flow into the combustor.

Abstract: An intelligent well system and method has a sand face completion and a monitoring system to monitor application of a well operation. Various equipment and services may be used. In another aspect, the invention provides a monitoring system for determining placement of a well treatment. Yet another aspect of the invention is an instrumented sand screen. Another aspect is a connector for routing control lines. It is emphasized that this abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR 1.72(b).

Abstract: An intelligent well system and method has a sand face completion and a monitoring system to monitor application of a well operation. Various equipment and services may be used. In another aspect, the invention provides a monitoring system for determining placement of a well treatment. Yet another aspect of the invention is an instrumented sand screen. Another aspect is a connector for routing control lines. It is emphasized that this abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

Abstract: A leadless leadframe semiconductor package includes a plurality of contacts, at least some of which have integrally formed stems that extend to the peripheral surface of the package. These stems have heights and widths less than the heights and widths of their corresponding contacts. A molded cap encapsulates the stems and the contacts to leave contact surfaces of the contacts exposed on the bottom surface of the package. Another aspect of the invention pertains to a leadless leadframe panel assembly having a conductive substrate panel that has at least one array of device areas, which has a plurality of tie bars and a plurality of contacts. The contacts have integrally formed stems that extend towards and connect to one of the tie bars. The stems have widths and heights that are less than the widths and heights of their corresponding contacts.

Abstract: A panel assembly of packaged integrated circuit devices comprising a conductive substrate panel having an array of device areas and a plurality of locking passageways. The locking passageways are positioned about an inactive buffer area which surrounds the periphery of the array of device areas. The locking passageways extend from a topside of the panel toward a bottom side of the panel. The panel assembly also includes a molded cap that is molded over the topside of the panel to encapsulate the array of device areas and the inactive buffer area. The molded cap includes conforming locking stem portions that extend into each of the locking passageways in a manner locking the molded cap to the substrate panel such that during singulation of the device areas, the molded cap will not separate from the substrate panel at the inactive buffer area. In another aspect of the invention, a method for producing the panel assembly having the locking passageways is described.

Abstract: The invention provides methods and kits to form water swellable gel coatings, preferably lubricious coatings, on substrates, and coated substrates thus formed. The coatings contain one or more antimicrobial metals formed with atomic disorder, together with one or more antimicrobial metals formed with atomic disorder such that the coatings provide an antimicrobial and anti-inflammatory effect when wet. The invention also provides a method to produce metal powders by sputtering a coating onto a moving surface, and then scraping the coating with one or more scrapers to produce the metal powder. The method is particularly useful for producing large amounts of nanocrystalline antimicrobial metal powders formed with atomic disorder, useful in the water swellable gel coatings of this invention.

Abstract: The invention provides methods and kits to form water swellable gel coatings, preferably lubricious coatings, on substrates, and coated substrates thus formed. The coatings contain one or more antimicrobial metals formed with atomic disorder, together with one or more antimicrobial metals formed with atomic disorder such that the coatings provide an antimicrobial and anti-inflammatory effect when wet. The invention also provides a method to produce metal powders by sputtering a coating onto a moving surface, and then scraping the coating with one or more scrapers to produce the metal powder. The method is particularly useful for producing large amounts of nanocrystalline antimicrobial metal powders formed with atomic disorder, useful in the water swellable gel coatings of this invention.

Abstract: A respiratory monitor apparatus comprises, in combination, a flexible mask fabricated from a stretchable fabric, such as spandex, that is designed to support a pneumotach flow measuring instrument in a way that does not require the instrument to be placed in the wearer's mouth, yet still remaining in fluid communication with the wearer's mouth and with little or no dead-space or leakage between the mask member and the wearer's face.

Abstract: A fluidic apparatus for modulating the rate of fuel flow into the combustor of a gas turbine engine. The apparatus includes a fluidic oscillator device (preferably an astable fluidic oscillator, or “flip-flop”) having a supply inlet connected to a fluid fuel source and a pair of outlets one of which is connected to the combustor. The fluidic device operates to output fluid fuel from the outlets alternately, so modulating fuel flow into the combustor.

Abstract: A leadless leadframe semiconductor package comprising a plurality of contacts, which have contact surfaces on the bottom surface of the package. At least some of the contacts have integrally formed stems that extend outward to the peripheral surface of the package. These stems have heights and widths less than the heights and widths of their corresponding contacts. A molded cap encapsulates at least a portion of the die, the stems and the contacts. The molded cap leaves the contact surfaces of the contacts exposed on the bottom surface of the package, leaves a peripheral surface of the stems exposed on the peripheral surface of the package, and covers a bottom surface of each of the stems. Another aspect of the invention pertains to a leadless leadframe panel assembly having a conductive substrate panel that has at least one array of device areas, each array of device areas having a plurality of tie bars and a plurality of contacts.

Abstract: A leadless leadframe panel comprising a partially etched top surface of a substrate panel that forms recessed regions that define a portion of a first and a second set of tie bars and a portion of a first and second set of contact pads. A bottom surface of the panel forms lower recessed regions that define the remaining portion of the first and second set of tie bars and the remaining portion of the first and second set of contact pads. The resulting contact pads are connected to a respective one of the tie bars.

Abstract: This invention proposes a method for enabling segment protection, whereby one or more hops in the lightpath are protected by either a dedicated or shared wavelength. This provides a more cost effective solution for the service provider such that they only need to configure protection, and therefore deploy equipment, to those sensitive portions of the network rather than dedicating wavelengths and equipment for protection end-to-end for a lightpath. Further, allowing protecting wavelengths to be shared for protection, gives further flexibility and therefore, savings, to the service provider. To utilize lightpath segment protection and sharing the protection between multiple lightpaths requires the new mesh networking capabilities of the network elements and new network management tools to configure, and monitor these protected lightpaths.