Abstract: A packaging arrangement is described that utilizes a conductive panel (such as a leadless leadframe) as its base. The conductive panel has a matrix of device areas that each include a plurality of rows of contacts that are located outside of a die area. Tie bars provide support for the various contacts. Some of the tie bars are arranged to extend between adjacent contacts in the same row and some of the tie bars are arranged to extend diagonally between associated contacts in adjacent rows that are not adjacent one another. During packaging, the tie bars can be severed by cutting along lines (e.g. saw streets) that run adjacent the rows after a molding operation. The described panels are particularly useful in packages having three or more rows of contacts.

Abstract: A computer file may be scanned for suspicious words 18 occurring within suspicious contexts 20. Thus, messages embedded by malware authors within their malware may be detected. The detection of such embedded messages may be used to identify otherwise unknown items of malware or as a pre-filtering technique for controlling the use of further scanning techniques.

Abstract: A source computer 8 stores updated data that is to be distributed to a plurality of destination computers (12 to 30). The destination computers (12 to 30) are divided into groups sharing a common priority level (5, 4, 3, 2, 1). Each of these groups is then associated with a push update task to be executed by the source computer 8. These push update tasks are then sequentially executed. If a particular group of destination computers exceeds a threshold size, then it may be further divided in accordance with a hierarchy of splitting rules. The push update tasks use multicasting to transfer the update data to the destination computers within their groups in a manner that reduces network traffic.

Abstract: A panel assembly of packaged integrated circuit devices including conductive substrate panel having an array of device areas and a plurality of locking passageways. The locking passageways are positioned about an inactive buffer area which surrounds the periphery of the array of device areas. The locking passageways extend from a topside of the panel toward a bottom side of the panel. The panel assembly also includes a molded cap that is molded over the topside of the panel to encapsulate the array of device areas and the inactive buffer area. The molded cap includes conforming locking stem portions that extend into each of the locking passageways in a manner locking the molded cap to the substrate panel such that during singulation of the device areas, the molded cap will not separate from the substrate panel at the inactive buffer area. In another aspect of the invention, a method for producing the panel assembly having the locking passageways is described.

Abstract: The invention relates to the use of one or more antimicrobial metals preferably selected from silver, gold, platinum, and palladium but most preferably silver, formed with atomic disorder, and preferably in a nanocrystalline form, for reducing inflammation or infection of the mucosal membrane. The antimicrobial metal may be formulated as, or used in the form of, a nanocrystalline coating of one or more antimicrobial or noble metals, a nanocrystalline powder of one or more antimicrobial or noble metals, or a liquid or solution containing dissolved species from a nanocrystalline powder or coating of one or more antimicrobial or noble metals.

Abstract: An off-loading system comprising an array of suction tubes which are each able to pick up an associated semiconductor device from the matrix of devices and a pump which pulls air through the suction tubes to create a sufficiently low pressure within the suction tubes to allow each suction tube to pick up an associated device. In another embodiment of the invention, the off-loading system also includes a pin board which supports an array of pins configured to raise a selected array of the semiconductor devices to assist in picking up the selected array of devices from the matrix of devices. Another embodiment of the invention includes a rack that includes multiple elongated rails which form multiple channels through which the semiconductor devices travel so that they may properly enter a subsequent phase of the manufacturing process.

Abstract: A gas turbine engine abradeable seal system is provided comprising a seal assembly and a cooperating interacting turbine blade. The turbine blade has a tip portion containing cubic boron nitride abrasive particles and the seal assembly has a superalloy substrate with a bond coat thereon having a surface roughness of at least 300 RA and a porous ceramic abradeable seal material on the bond coat having a porosity of from 5 to 15 volume %.

Abstract: A malware protection mechanism is described whereby upon detection of an item of malware or malware like behaviour, I/O devices (18, 20, 22) of a computer (4, 6, 8, 10) may be disabled in order to resist propagation of the malware or infection by the malware. Alternatively, a System Administrator may manually trigger the disablement of the I/O devices as a pre-emptive precaution against infection.

Abstract: A malware detecting system is described in which a client computer 8 sends a file access clearance request to an assessment computer 24 to determine whether or not access is permitted to that file. In this way, the different client computers on a network 2 may share their scan results and centralized control may be provided over access permissions to individual files or groups of files.

Abstract: A gas turbine engine abradeable seal system is provided comprising a seal assembly and a cooperating interacting turbine blade. The turbine blade has a tip portion containing cubic boron nitride abrasive particles and the seal assembly has a superalloy substrate with a bond coat thereon having a surface roughness of at least 300 RA and a porous ceramic abradeable seal material on the bond coat having a porosity of from 5 to 15 volume %.

Abstract: The invention provides methods and kits to form water swellable gel coatings, preferably lubricious coatings, on substrates, and coated substrates thus formed. The coatings contain one or more antimicrobial metals formed with atomic disorder, together with one or more antimicrobial metals formed with atomic disorder such that the coatings provide an antimicrobial and anti-inflammatory effect when wet. The invention also provides a method to produce metal powders by sputtering a coating onto a moving surface, and then scraping the coating with one or more scrapers to produce the metal powder. The method is particularly useful for producing large amounts of nanocrystalline antimicrobial metal powders formed with atomic disorder, useful in the water swellable gel coatings of this invention.

Abstract: A semiconductor device exhibiting a lower incidence of burrs forming on its contacts during the singulation process. The semiconductor device includes a die which is electrically connected to a set of contacts wherein each contact has a contact surface and a non-contact surface. Each contact surface of the contacts contains a recessed region filled with a first deposit of molding material. The die and the non-contact surfaces of the contacts are encapsulated with a second deposit of molding material. The semiconductor device is singulated from a molded lead frame by guiding a saw blade through recessed regions formed on the contact surface of the contacts. The molding material in the recessed regions creates a “buffer zone” which separates the path of the saw blade from the contact surface of the contacts.

Abstract: A respiratory monitor apparatus comprises, in combination, a flexible mask fabricated from a stretchable fabric, such as spandex, that is designed to support a pneumotach flow measuring instrument in a way that does not require the instrument to be placed in the wearer's mouth, yet still remaining in fluid communication with the wearer's mouth and with little or no dead-space or leakage between the mask member and the wearer's face.

Abstract: A supported membrane for separation of hydrogen in a fuel cell includes a microetched foil to form a substrate. The supported membrane also includes a membrane metal of a metal alloy deposited over the substrate to form a thin metal supported membrane for hydrogen separation.

Abstract: The load distributing arrangement includes a load distributing member of the type described which is configured to define a running board for a vehicle, and a mounting apparatus for removably mounting the load distributing member in position on the vehicle so that the load distributing member serves as a running board, in use. The load distributing member may be formed of a plurality of steel channel sections attached to one another in a side-by-side relation, and the sides of the channel sections may form reinforcing ribs to inhibit deformation of the of the load distributing member, in use. The steel channel sections may include perforations to inhibit slipping of persons standing on the load distributing member, and to provide purchase for tires of a vehicle, when the load distributing member is used in its application as a sand ladder.

Abstract: A variety of leadless packaging arrangements and methods of packaging integrated circuits in leadless packages that are arranged to have relatively low inductance are disclosed. In one aspect, a leadless semiconductor package is described having an exposed die pad and a plurality of exposed contacts that are formed from a common substrate material. The die attach pad, however, is thinned relative to at least a portion of the contacts. A die is mounted on the thinned die attach pad and wire bonded to the contacts. Since the die attach pad is lower than the contact surface being wire bonded to, the length of the bonding wires can be relatively reduced, thereby reducing inductance of the device. A plastic cap is molded over the die and the contacts thereby encapsulating the bonding wires while leaving the bottom surface of the contacts exposed. In some embodiments, the die is arranged to overhangs beyond the die attach pad towards the contacts.

Abstract: Leadframe based packages, such as leadless leadframe packages are described that include an orientation indicator that is integrally formed with the leadframe. In one aspect, the leadframe includes a die attach pad, a plurality of contact fingers, a tie bar extending from the die attach pad, and an indicator stem extending from the tie bar. An integrated circuit die is mounted on the die attach pad and electrically coupled bond to associated contact fingers. A protective cap encapsulates the connectors and covers at least a portion of the die and contact fingers while leaving at least a portion of a bottom surface area of the contact fingers exposed to form external electrical contacts for the package. The protective cap leaves an identifying end of the indicator stem exposed through the surface of the protective cap to facilitate identification of a particular contact or region of the package. The described leadless leadframes may be produced in panel form which facilitates panel based packaging.

Abstract: A cable release apparatus includes a housing and latch mounted at one end of the housing. The latch has a central opening and a plurality of projecting members extending into the housing. A releasable connector is mounted inside the housing. An actuator has one end disposed in the central opening in the latch and another end in contact with the releasable connector. The actuator is movable between a first position prior to activation of the releaseable connector and a second position wherein the releasable connector is activated. Prior to activation of the releasable connector, the latch is held in place by an interference fit between the projecting members and the housing. When the releasable connector is activated, the projecting members are deflected by applying tension to the latch, thereby releasing the latch from the housing.

Abstract: A supported membrane for separation of hydrogen in a fuel cell includes a microetched foil to form a substrate. The supported membrane also includes a membrane metal of a metal alloy deposited over the substrate to form a thin metal supported membrane for hydrogen separation.

Abstract: A variety of techniques for electrically debussing conductive substrate panels used in the formation of a matrix of leadless integrated circuit packages are described. Generally, after a matrix of leadless packages have been fabricated in panel form on a conductive substrate panel, tie bars that are used to support contacts and potentially other structures on the conductive substrate are removed after plastic caps have been molded over the matrix, but before separating the packaged devices. This serves to electrically isolate the contacts from one another while leaving sufficient portions of the molded substrate structure in tact to facilitate handling the structure in panel form. With the described arrangement, the packaged devices may be tested in panel form. After testing and any other desired panel based operations, the packaged devices may be separated using conventional techniques. The removal of the tie bars can be accomplished by any suitable technique including, for example, sawing or etching.