Abstract: Accounting for oscillations with drop ejection waveforms can include identifying a previous ejection waveform having a first plurality of parameters including a time interval from a final pulse of the previous ejection waveform. Accounting for oscillations with drop ejection waveforms can include determining a second plurality of parameters based on the first plurality of parameters, where the second plurality of parameters define a current ejection waveform that accounts for oscillations caused by the previous ejection waveform. Accounting for oscillations with drop ejection waveforms can include applying the current ejection waveform to cause an ejection nozzle of the printhead to generate a desired fluid drop.

Abstract: In some examples, a piezoelectric fluid ejection assembly includes a micro-electro mechanical system (MEMS) die including a plurality of nozzles, a first application-specific integrated circuit (ASIC) die electrically connected to the MEMS die, and a second ASIC die electrically connected to the MEMS die. The first ASIC die includes a plurality of driver amplifiers for respective nozzles of a first number of the plurality of nozzles, and a plurality of unique waveform data generators to generate respective different waveforms for activating the nozzles of the first number of the plurality of nozzles.

Abstract: In some examples, a piezoelectric printhead assembly can include a plurality of piezoelectric micro-electro mechanical system (MEMS) dies, and application-specific integrated circuit (ASIC) dies electrically connected to the piezoelectric MEMS dies.

Abstract: In some examples, a piezoelectric fluid ejection assembly includes a micro-electro mechanical system (MEMS) die including a plurality of nozzles, a first application-specific integrated circuit (ASIC) die electrically connected to the MEMS die, and a second ASIC die electrically connected to the MEMS die. The first ASIC die includes a plurality of driver amplifiers for respective nozzles of a first number of the plurality of nozzles, and a plurality of unique waveform data generators to generate respective different waveforms for activating the nozzles of the first number of the plurality of nozzles.

Abstract: In some examples, a piezoelectric printhead assembly can include a plurality of piezoelectric micro-electro mechanical system (MEMS) dies, and application-specific integrated circuit (ASIC) dies electrically connected to the piezoelectric MEMS dies.

Abstract: A piezoelectric printhead assembly can include a micro-electro mechanical system (MEMS) die including a plurality of nozzles and a first application-specific integrated circuit (ASIC) die coupled to the MEMS die by a first plurality of wire bonds.

Abstract: A piezoelectric printhead assembly can include a plurality of piezoelectric micro-electro mechanical system (MEMS) dies each having a first application-specific integrated circuit (ASIC) die coupled to a respective piezoelectric MEMS die and a second ASIC die coupled to the respective piezoelectric MEMS die.

Abstract: A piezoelectric printhead assembly can include a plurality of piezoelectric micro-electro mechanical system (MEMS) dies each having a first application-specific integrated circuit (ASIC) die coupled to a respective piezoelectric MEMS die and a second ASIC die coupled to the respective piezoelectric MEMS die.

Abstract: A piezoelectric printhead assembly can include a micro-electro mechanical system (MEMS) die including a plurality of nozzles and a first application-specific integrated circuit (ASIC) die coupled to the MEMS die by a first plurality of wire bonds.

Abstract: Accounting for oscillations with drop ejection waveforms can include identifying a previous ejection waveform having a first plurality of parameters including a time interval from a final pulse of the previous ejection waveform. Accounting for oscillations with drop ejection waveforms can include determining a second plurality of parameters based on the first plurality of parameters, where the second plurality of parameters define a current ejection waveform that accounts for oscillations caused by the previous ejection waveform. Accounting for oscillations with drop ejection waveforms can include applying the current ejection waveform to cause an ejection nozzle of the printhead to generate a desired fluid drop.

Abstract: A method and apparatus supply electrical current to a firing actuator of a printhead die across a high side switching transistor in a source follower arrangement and supply a regulated voltage, that is no greater than a concurrent voltage at a drain of the HSS transistor, to a gate of the high side switching transistor.

Abstract: A print head die includes rows of nozzles. In one implementation, an electrical interconnect is electrically connected to the print head die along a major dimension of the die. In another implementation, a cross connect electrically connects a first column of a of nozzles to print a first color to a second column to print a second color. The cross connect connects the first and second columns between first and second ends of the first and second columns.

Abstract: A method and apparatus supply electrical current to a firing actuator of a printhead die across a high side switching transistor in a source follower arrangement and supply a regulated voltage, that is no greater than a concurrent voltage at a drain of the HSS transistor, to a gate of the high side switching transistor.

Abstract: A method and apparatus test a printed circuit assembly and a print head array with a low-power application to a printed circuit assembly having a power storage component disconnected from a power rail of the printed circuit assembly and test the printed circuit assembly and the print head array with a high-power application to the printed circuit assembly with the printed circuit assembly receiving electrical power from the power storage component.

Abstract: A print head die includes rows of nozzles. In one implementation, an electrical interconnect is electrically connected to the print head die along a major dimension of the die. In another implementation, a cross connect electrically connects a first column of a of nozzles to print a first color to a second column to print a second color. The cross connect connects the first and second columns between first and second ends of the first and second columns.

Abstract: Among various embodiments of the present disclosure, displaying electrophoretic particles can be performed by configuring an electrophoretic display for directed spreading of electrophoretic particles across a number of substantially planar display electrodes. Such a configuration can be accomplished by controlling planar spreading of the electrophoretic particles in an electrophoretic pixel with an electrical field between an in-plane storage electrode and an in-plane activation electrode. The in-plane activation electrode can be connected to an in-plane display electrode, which extends across a first area in the electrophoretic pixel adjacent to a display aperture having a second area that is substantially coextensive with the first area.

Abstract: Embodiments including a charge responsive optical material are disclosed.

Abstract: A memory array has a multiplicity of row conductors and a multiplicity of column conductors, the row conductors and column conductors being arranged to cross at cross-points, and has a memory cell disposed at each cross-point, each memory cell having a storage element and a control element coupled in series between a row conductor and a column conductor, and each control element including a silicon-rich insulator. Methods for fabricating the memory array are disclosed.

Abstract: A method and apparatus apply an electric field across active layer, wherein active layer is configured to change from a first light attenuating state to a second lesser light attenuating state in response to the applied the electric field and wherein the second lesser light attenuating state permits light to be reflected from a light reflective face.

Abstract: Devices, systems, mediums, and methods for providing a layered color display are disclosed. One method of displaying images includes configuring a reflective color display in a layered manner to display a first portion of an image in a lower layer and to display a second portion of an image in a number of upper layers by decoupling imaging functions of a number of upper layers of a reflective color display device from imaging functions of a lower layer of a reflective color device, driving the lower layer with an active matrix back plane thin film transistor (TFT), and addressing the number of upper layers passively.