Patents by Inventor PETER L. CHANG

PETER L. CHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10242892
    Abstract: Micro pick-and-bond heads, assembly methods, and device assemblies. In, embodiments, micro pick-and-bond heads transfer micro device elements, such as (micro) LEDs, en masse from a source substrate to a target substrate, such as a LED display substrate. Anchor and release structures on the source substrate enable device elements to be separated from a source substrate, while pressure sensitive adhesive (PSA) enables device elements to be temporarily affixed to pedestals of a micro pick-and-bond head. Once the device elements are permanently affixed to a target substrate, the PSA interface may be defeated through peeling and/or thermal decomposition of an interface layer.
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: March 26, 2019
    Assignee: Intel Corporation
    Inventors: Peter L. Chang, Chytra Pawashe, Michael C. Mayberry, Jia-Hung Tseng
  • Patent number: 10235471
    Abstract: Disclosed herein are embodiments of a system and method for the dynamic provisioning of static content. In one embodiment, information presented on a content delivery system can be refreshed based on information published on a content management system. One embodiment can interface the content delivery system and the content management system at the page level. More specifically, content dependencies across pages employing the same content or portion(s) thereof can be tracked in a timely, accurate manner. Upon receiving a notification of a change to the content or a portion thereof from the content management system, a content generation system may operate to determine, based on the dependencies, what pages are affected by the change and, based on the determination, dynamically regenerate any and all affected pages. The regenerated pages may then be stored and/or pushed to the web tier for delivery to end users.
    Type: Grant
    Filed: December 8, 2014
    Date of Patent: March 19, 2019
    Assignee: Open Text SA ULC
    Inventors: Newton Isaac Rajkumar, Mark McCalister, Expeditus Bolanos, Peter Hale, Mark Martin, Richard Nemec, Puhong You, Daun DeFrance, Ching-Fu Chang, Priya Reddy, Ladislav Kis, Robert L. Patterson, Tony Zgarba, Jeffrey M. Collins, Michael C. Tulkoff, Miles Chaston, Dean Moses, John Petersen, Ian Stahl, Lara Long
  • Patent number: 10204808
    Abstract: Micro pick-and-bond heads, assembly methods, and device assemblies. In, embodiments, micro pick-and-bond heads transfer micro device elements, such as (micro) LEDs, en masse from a source substrate to a target substrate, such as a LED display substrate. Anchor and release structures on the source substrate enable device elements to be separated from a source substrate, while pressure sensitive adhesive (PSA) enables device elements to be temporarily affixed to pedestals of a micro pick-and-bond head. Once the device elements are permanently affixed to a target substrate, the PSA interface may be defeated through peeling and/or thermal decomposition of an interface layer.
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: February 12, 2019
    Assignee: Intel Corporation
    Inventors: Peter L. Chang, Chytra Pawashe, Michael C. Mayberry, Jia-Hung Tseng
  • Patent number: 10177195
    Abstract: A micro-light emitting diode (LED) display panel and a method of forming the display panel, the micro-LED display panel having a monolithically grown micro-structure including a first color micro-LED that is a first color nanowire LED, and a second color micro-LED that is a second color nanowire LED.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: January 8, 2019
    Assignee: Intel Corporation
    Inventors: Khaled Ahmed, Kunjal Parikh, Peter L. Chang
  • Patent number: 10128307
    Abstract: Crystalline (micro)LED display assemblies, methods of fabricating such display assemblies, crystalline LED source substrates from which the (micro)LEDs may be transferred to the display assembly, and methods of fabricating such source substrates. LED elements may be prepared for transfer by pick-n-place or other means to a bonding substrate. Anchor and release structures enable LED elements to be affixed and electrically coupled to a bonding substrate with conductive polymer. LED elements may be prepared for transfer to a bonding substrate with self-aligned LED electrode metallization structures enabling the elements to be affixed to a bonding substrate with an adhesive and electrically coupled with a self-aligned local interconnect metallization. After affixing the LED elements, material may be built-up around the LED elements and the display assembly separated from the bonding substrate.
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: November 13, 2018
    Assignee: Intel Corporation
    Inventor: Peter L. Chang
  • Patent number: 10054737
    Abstract: Photonic components are placed on the processor package to bring the optical signal close to the processor die. The processor package includes a substrate to which the processor die is coupled, and which allows the processor die to connect to a printed circuit board. The processor package also includes transceiver logic, electrical-optical conversion circuits, and an optical coupler. The electrical-optical conversion circuits can include laser(s), modulator(s), and photodetector(s) to transmit and receive and optical signal. The coupler interfaces to a fiber that extends off the processor package. Multiple fibers can be brought to the processor package allowing for a scalable high-speed, high-bandwidth interconnection to the processor.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: August 21, 2018
    Assignee: INTEL CORPORATION
    Inventors: Mauro J Kobrinsky, Henning Braunisch, Shawna M. Liff, Peter L. Chang, Bruce A. Block, Johanna M. Swan
  • Publication number: 20180233536
    Abstract: Crystalline (micro) LED display assemblies, methods of fabricating such display assemblies, crystalline LED source substrates from which the (micro) LEDs may be transferred to the display assembly, and methods of fabricating such source substrates. LED elements may be prepared for transfer by pick-n-place or other means to a bonding substrate. Anchor and release structures enable LED elements to be affixed and electrically coupled to a bonding substrate with conductive polymer. LED elements may be prepared for transfer to a bonding substrate with self-aligned LED electrode metallization structures enabling the elements to be affixed to a bonding substrate with an adhesive and electrically coupled with a self-aligned local interconnect metallization. After affixing the LED elements, material may be built-up around the LED elements and the display assembly separated from the bonding substrate.
    Type: Application
    Filed: October 17, 2014
    Publication date: August 16, 2018
    Inventor: Peter L. Chang
  • Publication number: 20180097033
    Abstract: A micro-light emitting diode (LED) display panel and a method of forming the display panel, the micro-LED display panel having a monolithically grown micro-structure including a first color micro-LED that is a first color nanowire LED, and a second color micro-LED that is a second color nanowire LED.
    Type: Application
    Filed: September 30, 2016
    Publication date: April 5, 2018
    Inventors: Khaled Ahmed, Kunjal Parikh, Peter L. Chang
  • Patent number: 9922592
    Abstract: In one example, a method for controlling a display with a digital signal includes detecting a binary value from a timing controller, the binary value corresponding to a portion of an image to be displayed. The method can also include determining a previous binary value from the timing controller and calculating a difference between the binary value from the timing controller and the previous binary value from the timing controller. Furthermore, the method can include generating an encoded signal based on the difference and transmitting the encoded signal to a display panel.
    Type: Grant
    Filed: December 23, 2015
    Date of Patent: March 20, 2018
    Assignee: INTEL CORPORATION
    Inventors: Kunjal Parikh, Khaled Ahmed, Prakash K. Radhakrishnan, Peter L. Chang, Ravi Ranganathan
  • Publication number: 20170278733
    Abstract: Micro pick-and-bond heads, assembly methods, and device assemblies. In, embodiments, micro pick-and-bond heads transfer micro device elements, such as (micro) LEDs, en masse from a source substrate to a target substrate, such as a LED display substrate. Anchor and release structures on the source substrate enable device elements to be separated from a source substrate, while pressure sensitive adhesive (PSA) enables device elements to be temporarily affixed to pedestals of a micro pick-and-bond head. Once the device elements are permanently affixed to a target substrate, the PSA interface may be defeated through peeling and/or thermal decomposition of an interface layer.
    Type: Application
    Filed: October 17, 2014
    Publication date: September 28, 2017
    Inventors: Peter L. Chang, Chytra Pawashe, Michael C. Mayberry, Jia-Hung Tseng
  • Publication number: 20170186366
    Abstract: In one example, a method for controlling a display with a digital signal includes detecting a binary value from a timing controller, the binary value corresponding to a portion of an image to be displayed. The method can also include determining a previous binary value from the timing controller and calculating a difference between the binary value from the timing controller and the previous binary value from the timing controller. Furthermore, the method can include generating an encoded signal based on the difference and transmitting the encoded signal to a display panel.
    Type: Application
    Filed: December 23, 2015
    Publication date: June 29, 2017
    Applicant: Intel Corporation
    Inventors: Kunjal Parikh, Khaled Ahmed, Prakash K. Radhakrishnan, Peter L. Chang, Ravi Ranganathan
  • Patent number: 9664858
    Abstract: Systems and methods may couple on-chip optical circuits to external fibers. An SOI waveguide structure may include mirror structures and tapered waveguides to optically couple optical circuits to fibers in a vertically oriented external connector. The mirror structure(s) may be angularly disposed at the ends of the silicon waveguide structure. An oxide layer may cover a buried oxide layer and the silicon waveguide structure. The tapered waveguide(s) may have a narrow end and a wide end. The narrow end of the tapered waveguide(s) may be disposed above the mirror structures. The tapered waveguide(s) may extend through the oxide layer from the narrow end in a direction perpendicular to the silicon waveguide structure. An external connector may fit over the tapered waveguide(s) and uses a fiber array traveling through a connector body to optically couple to the external fiber.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: May 30, 2017
    Assignee: Intel Corporation
    Inventors: Edris M. Mohammed, Peter L. Chang, Ibrahim Ban
  • Publication number: 20170131469
    Abstract: Photonic components are placed on the processor package to bring the optical signal close to the processor die. The processor package includes a substrate to which the processor die is coupled, and which allows the processor die to connect to a printed circuit board. The processor package also includes transceiver logic, electrical-optical conversion circuits, and an optical coupler. The electrical-optical conversion circuits can include laser(s), modulator(s), and photodetector(s) to transmit and receive and optical signal. The coupler interfaces to a fiber that extends off the processor package. Multiple fibers can be brought to the processor package allowing for a scalable high-speed, high-bandwidth interconnection to the processor.
    Type: Application
    Filed: November 15, 2016
    Publication date: May 11, 2017
    Inventors: Mauro J. Kobrinsky, Henning Braunisch, Shawna M. Liff, Peter L. Chang, Bruce A. Block, Johanna M. Swan
  • Patent number: 9507086
    Abstract: Photonic components are placed on the processor package to bring the optical signal close to the processor die. The processor package includes a substrate to which the processor die is coupled, and which allows the processor die to connect to a printed circuit board. The processor package also includes transceiver logic, electrical-optical conversion circuits, and an optical coupler. The electrical-optical conversion circuits can include laser(s), modulator(s), and photodetector(s) to transmit and receive and optical signal. The coupler interfaces to a fiber that extends off the processor package. Multiple fibers can be brought to the processor package allowing for a scalable high-speed, high-bandwidth interconnection to the processor.
    Type: Grant
    Filed: December 30, 2011
    Date of Patent: November 29, 2016
    Inventors: Mauro J. Kobrinsky, Henning Braunisch, Shawna M. Liff, Peter L. Chang, Bruce A. Block, Johanna M. Swan
  • Patent number: 9484332
    Abstract: Micro LEDs may be placed on a substrate in regularly spaced rows with an empty row between at least two successive rows of micro LED. A micro solar cell may then be placed in the empty row.
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: November 1, 2016
    Assignee: Intel Corporation
    Inventors: Kumaran Natarajan, Prakash K. Radhakrishnan, Peter L. Chang, Kunjal Parikh
  • Publication number: 20160276326
    Abstract: Micro LEDs may be placed on a substrate in regularly spaced rows with an empty row between at least two successive rows of micro LED. A micro solar cell may then be placed in the empty row.
    Type: Application
    Filed: March 18, 2015
    Publication date: September 22, 2016
    Inventors: Kumaran Natarajan, Prakash K. Radhakrishnan, Peter L. Chang, Kunjal Parikh
  • Patent number: 9435967
    Abstract: Embodiments of the present disclosure provide optical connection techniques and configurations. In one embodiment, an apparatus includes a receptacle for mounting on a surface of a package substrate, the receptacle having a pluggable surface to receive an optical coupler plug such that the optical coupler plug is optically aligned with one or more optical apertures of an optoelectronic assembly that is configured to emit and/or receive light using the one or more optical apertures in a direction that is substantially perpendicular to the surface of the package substrate when the optoelectronic assembly is affixed to the package substrate. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: January 11, 2016
    Date of Patent: September 6, 2016
    Assignee: INTEL CORPORATION
    Inventors: Henning Braunisch, Shawna M. Liff, Peter L. Chang
  • Patent number: 9420700
    Abstract: An optical touchscreen assembly may employ a photonic chip packaged with a chip surface at an angle inclined between horizontal and vertical orientations. An inclined paddle sawn flat no-leads (IPSFN) package may be affixed to a cover glass surface along a perimeter of a display. IPSFN packages may incorporate a photo-emitter chip and a photo-detector chip that may be inclined for a desired angle of incidence relative to the cover glass. A CMOS integrated optical transceiver package may include inclined photonic chips and a non-inclined CMOS chip having at least one of a photo-emitter driver, or a photo-detector TIA and/or ADC. A chip package lead frame may include cantilevered paddle tabs amenable to controlled deflection during package assembly. An inclined packaging assembly method may include attaching a chip to a lead frame paddle and form pressing the lead frame to incline the chip to a desired angle before encapsulation.
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: August 16, 2016
    Assignee: Intel Corporation
    Inventors: Gerrit J Vreman, Tom E Pearson, Peter L Chang, Jia-Hung Tseng
  • Publication number: 20160180821
    Abstract: A distributed memory panel including a panel, a light emitter of a pixel on the panel, and integrated circuit on the panel. The integrated circuit to include a memory wherein the memory is exclusively associated with the light emitter and a driver to drive the light emitter of the pixel.
    Type: Application
    Filed: September 25, 2015
    Publication date: June 23, 2016
    Applicant: INTEL CORPORATION
    Inventors: Peter L. Chang, Kunjal Parikh, Kumaran Natarajan, Prakash K. Radhakrishnan
  • Publication number: 20160124166
    Abstract: Embodiments of the present disclosure provide optical connection techniques and configurations. In one embodiment, an apparatus includes a receptacle for mounting on a surface of a package substrate, the receptacle having a pluggable surface to receive an optical coupler plug such that the optical coupler plug is optically aligned with one or more optical apertures of an optoelectronic assembly that is configured to emit and/or receive light using the one or more optical apertures in a direction that is substantially perpendicular to the surface of the package substrate when the optoelectronic assembly is affixed to the package substrate. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: January 11, 2016
    Publication date: May 5, 2016
    Inventors: Henning Braunisch, Shawna M. Liff, Peter L. Chang