Abstract: A structure for a micro-device is fabricated by forming: a first layer of sacrificial material, a layer of structural material over the first sacrificial material layer, a second layer of sacrificial material over the structural material layer and a protective layer over the second sacrificial material layer. A release etch is used to remove the first and second sacrificial material layers at approximately the same rate. A structural feature may also be fabricated by forming: a first layer of a first material; a layer of structural material over the first layer of the first material; at least one cut in the structural material layer; and, a first layer of a sacrificial material, different from the first material, over the structural material layer such that an interface is created between the first layer of the sacrificial material and the first layer of the first material at the at least one cut.

Abstract: A waveguide structure has a base having a base height (h) above a substrate and a rectangular waveguide having a waveguide height (H) above the substrate and a waveguide width (W) between opposing sides of the waveguide.

Abstract: A thermal actuator comprises a substantially straight beam. The beam has a beam length and a beam mid-point. The beam comprises a plurality of beam segments. Each beam segment has a beam segment width, the beam thus forming a corresponding plurality of beam segment widths. The beam segment widths vary along the beam length based on a predetermined pattern. As the beam is heated by an included heating means, the beam buckles. The buckling of the beam, in turn, causes the beam mid-point to translate or move in a predetermined direction. The beam mid-point movement, in turn, operates an included optical waveguide switch. The heating means comprises any of Joule heating, eddy current heating, conduction heating, convection heating and radiation heating.

Abstract: A thermal actuator comprises a substantially straight beam. The beam has a beam length and a beam mid-point. The beam comprises a plurality of beam segments with beam segment lengths. Each beam segment has a beam segment neutral axis, thus forming a corresponding plurality of beam segment neutral axes. The beam segment neutral axes are offset along the beam length based on a predetermined pattern. As the beam is heated by an included heating means, the beam buckles. The buckling of the beam, in turn, causes the beam mid-point to translate or move in the predetermined direction. The beam mid-point movement, in turn, operates an included optical waveguide switch. The heating means comprises any of Joule heating, eddy current heating, conduction heating, convection heating and radiation heating.

Abstract: A thermal actuator comprises a plurality of substantially straight and parallel beams arranged to form a beam array. The midpoint of each beam is attached or coupled to an orthogonal coupling beam. Each array beam has a beam heating parameter with a corresponding beam heating parameter value. The beam heating parameter values vary across the beam array based on a predetermined pattern. As the beams are heated by an included heating means, the distribution of beam temperatures in the beam array becomes asymmetric, thus causing the beam array to buckle. The buckling of the beams in the beam array, in turn, causes the attached coupling beam to move in a predetermined direction. The coupling beam motion, in turn, operates an included optical waveguide switch. The beams in the beam array are heated by any of Joule heating, eddy current heating, conduction heating, convection heating and radiation heating.

Abstract: An optical micro-electro-mechanical system (MEMS) switch is disclosed. In a preferred embodiment the optical MEMS switch is used as an M×N optical signal switching system. The optical MEMS switch comprises a plurality of optical waveguides formed on a shuttle for switching optical states wherein the state of the optical switch is changed by a system of drive and latch actuators. The optical MEMS switch utilizes a latching mechanism in association with a thermal drive actuator for aligning the waveguide shuttle. In use the optical MEMS switch may be integrated with other optical components to form planar light circuits (PLCs). When switches and PLCs are integrated together on a silicon chip, compact higher functionality devices, such as Reconfigurable Optical Add-Drop Multiplexers (ROADMs), may be fabricated.

Abstract: An optical micro-electro-mechanical system (MEMS) switch is disclosed. In a preferred embodiment the optical MEMS switch is used as an M×N optical signal switching system. The optical MEMS switch comprises a plurality of optical waveguides formed on a cantilever beam platform for switching optical states wherein the state of the optical switch is changed by a system of drive and latch actuators. The optical MEMS device utilizes a latching mechanism in association with a thermal drive actuator for aligning the cantilever beam platform. In use the optical MEMS device may be integrated with other optical components to form planar light circuits (PLCs). When switches and PLCs are integrated together on a silicon chip, compact higher functionality devices, such as Reconfigurable Optical Add-Drop Multiplexers (ROADMs), may be fabricated.

Abstract: A bistable microelectromechanical system (MEMS) based system comprises a micromachined beam having a first stable state, in which the beam is substantially stress-free and has a specified non-linear shape, and a second stable state. The curved shape may comprises a simple curve or a compound curve. In embodiments, the boundary conditions for the beam are fixed boundary conditions, bearing boundary conditions, spring boundary conditions, or a combination thereof. The system may further comprise an actuator arranged to move the beam between the first and second stable states and a movable element that is moved between a first position and a second position in accordance with the movement of the beam between the first and second stable states. The actuator may comprise one of a thermal actuator, an electrostatic actuator, a piezoelectric actuator and a magnetic actuator. The actuator may further comprise a thermal impact actuator or a zippering electrostatic actuator.

Abstract: An optical micro-electro-mechanical system (MEMS) switch is disclosed. In a preferred embodiment the optical MEMS switch is used as an M×N optical signal switching system. The optical MEMS switch comprises a plurality of optical waveguides formed on a cantilever beam platform for switching optical states wherein the state of the optical switch is changed by a system of drive and latch actuators. The optical MEMS device utilizes a latching mechanism in association with a thermal drive actuator for aligning the cantilever beam platform. In use the optical MEMS device may be integrated with other optical components to form planar light circuits (PLCs). When switches and PLCs are integrated together on a silicon chip, compact higher functionality devices, such as Reconfigurable Optical Add-Drop Multiplexers (ROADMs), may be fabricated.

Abstract: Methods for applying electrical stimuli to optical micro-electro-mechanical system (MEMS) devices are disclosed. Electrical stimuli may be applied to one or more released current carrying elements mounted above a supporting substrate biased to minimize electrostatic force between the one or more current released current carrying elements and the supporting substrate. Additionally, the electrical stimuli bias minimizes electrical potential difference between the one or more released current carrying elements and one or more non-current carrying elements mounted above the supporting substrate that come in contact or close proximity during operation of the one or more released current carrying elements.

Abstract: An optical micro-electro-mechanical system (MEMS) switch is disclosed. In a preferred embodiment the optical MEMS switch is used as an M×N optical signal switching system. The optical MEMS switch comprises a plurality of optical waveguides formed on a shuttle for switching optical states wherein the state of the optical switch is changed by a system of drive and latch actuators. The optical MEMS switch utilizes a latching mechanism in association with a thermal drive actuator for aligning the waveguide shuttle. In use the optical MEMS switch may be integrated with other optical components to form planar light circuits (PLCs). When switches and PLCs are integrated together on a silicon chip, compact higher functionality devices, such as Reconfigurable Optical Add-Drop Multiplexers (ROADMs), may be fabricated.

Abstract: A bistable microelectromechanical system (MEMS) based system comprises a micromachined beam having a first stable state, in which the beam is substantially stress-free and has a specified non-linear shape, and a second stable state. The curved shape may comprises a simple curve or a compound curve. In embodiments, the boundary conditions for the beam are fixed boundary conditions, bearing boundary conditions, spring boundary conditions, or a combination thereof. The system may further comprise an actuator arranged to move the beam between the first and second stable states and a movable element that is moved between a first position and a second position in accordance with the movement of the beam between the first and second stable states. The actuator may comprise one of a thermal actuator, an electrostatic actuator, a piezoelectric actuator and a magnetic actuator. The actuator may further comprise a thermal impact actuator or a zippering electrostatic actuator.

Abstract: The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a structure on a single crystal silicon layer separated by an insulator layer from a substrate layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilcon forming mechanical or optical elements of the structure; exposing a selected area of the single crystal silicon layer; and releasing the formed structure.

Abstract: A bistable microelectromechanical system (MEMS) based system comprises a micromachined beam having a first stable state, in which the beam is substantially stress-free and has a specified non-linear shape, and a second stable state. The curved shape may comprises a simple curve or a compound curve. In embodiments, the boundary conditions for the beam are fixed boundary conditions, bearing boundary conditions, spring boundary conditions, or a combination thereof. The system may further comprise an actuator arranged to move the beam between the first and second stable states and a movable element that is moved between a first position and a second position in accordance with the movement of the beam between the first and second stable states. The actuator may comprise one of a thermal actuator, an electrostatic actuator, a piezoelectric actuator and a magnetic actuator. The actuator may further comprise a thermal impact actuator or a zippering electrostatic actuator.

Abstract: A micro-electromechanical fluid ejector including a substrate having an insulating layer thereon; a conductor formed on said insulating layer; a membrane adjacent to said conductor, said membrane having a corrugated, multi-layer structure for added rigidity; and an actuator chamber formed between said membrane and said conductor, said membrane flexing toward said conductor when a voltage bias is applied thereto.

Abstract: A structure for a micro-device is fabricated by forming: a first layer of sacrificial material, a layer of structural material over the first sacrificial material layer, a second layer of sacrificial material over the structural material layer and a protective layer over the second sacrificial material layer. A release etch is used to remove the first and second sacrificial material layers at approximately the same rate. A structural feature may also be fabricated by forming: a first layer of a first material; a layer of structural material over the first layer of the first material; at least one cut in the structural material layer; and, a first layer of a sacrificial material, different from the first material, over the structural material layer such that an interface is created between the first layer of the sacrificial material and the first layer of the first material at the at least one cut.

Abstract: A micromachined filter system comprises a micromachined filter integrated in a micro-device. In various embodiments, the micromachined filter system is fabricated along with the micro-device using the same or similar techniques. The micromachined filter may comprise a polysilicon filter. According to the micromachined filter system, the micromachined filter may be formed in one or more polysilicon layers of the micro-device. The micromachined filter may also comprise a polyimide filter. In various embodiments, the micromachined filter may be situated downstream of a fluid inlet of the micro-device. In various embodiments, a non-integrated, external pre-filter may be used in conjunction with an integrated micromachined filter.

Abstract: A method for fabricating a membrane having a corrugated, multi-layer structure, comprising the steps of: providing a substrate having an insulator layer on the top surface of the substrate, a conductive layer on the insulator layer, a sacrificial layer on said conductive layer, and a second conductive layer; patterning a series of holes the second conductive layer to allow release etchant to have access to a second sacrificial layer; depositing the second sacrificial layer onto said second conductive layer so that the series of holes are filled with the second sacrificial layer; patterning the second sacrificial layer with a radial and/or concentric grid pattern so that a third conductive layer when deposited will form the support structure and top portion of the corrugated structure; depositing the third conductive layer so that the grid pattern is filled in and is in contact with the second conductive layer; removing the first and second sacrificial layer by immersing the device in a release etchant.

Abstract: The present invention provides a micromechanical or microoptomechanical structure produced by a process comprising defining the structure in a single-crystal silicon layer separated by an insulator layer from a substrate layer; selectively etching the single crystal silicon layer; depositing and etching a polysilicon layer on the insulator layer, with remaining polysilicon forming mechanical elements of the structure; metalizing a backside of the structure; and releasing the formed structure.

Abstract: The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a structure on a single crystal silicon layer separated by an insulator layer from a substrate layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilcon forming mechanical or optical elements of the structure; exposing a selected area of the single crystal silicon layer; and releasing the formed structure.