Abstract: The present invention provides a micromechanical or microoptomechanical structure produced by a process comprising defining the structure in a single-crystal silicon layer separated by an insulator layer from a substrate layer; selectively etching the single crystal silicon layer; depositing and etching a polysilicon layer on the insulator layer, with remaining polysilicon forming mechanical elements of the structure; metalizing a backside of the structure; and releasing the formed structure.

Abstract: The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a structure on a single crystal silicon layer separated by an insulator layer from a substrate layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilicon forming mechanical or optical elements of the structure; exposing a selected area of the single crystal silicon layer; and releasing the formed structure.

Abstract: The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a pattern on a single crystal silicon layer separated by an insulator layer from a substrate layer; defining a structure in the single-crystal silicon layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilcon forming mechanical or optical elements of the structure; and releasing the formed structure.

Abstract: A micro-electromechanical fluid ejector having an inner structure on the bottom of the top of the membrane for isolating the conductor, and an outer structure, away from the center of the membrane, on the bottom of the top of the membrane to stop excessive flexing of the membrane leading to inter-electrode contact.

Abstract: A microstructure that may be used as an electrical connection in a microfabricated electro-mechanical system (MEMS) apparatus. The microstructure may have one or more isolatable electrical connections for signal transmission. The microstructure allows a MEMS apparatus to shield signal transmissions from the effects of electromagnetic interference or conductive fluids.

Abstract: A microstructure that may be used as an electrical connection in a microfabricated electro-mechanical system (MEMS) apparatus. The microstructure may have one or more isolatable electrical connections for signal transmission. The microstructure allows a MEMS apparatus to shield signal transmissions from the effects of electromagnetic interference or conductive fluids.

Abstract: A micro-electromechanical fluid ejector including a substrate having an insulating layer thereon; a conductor formed on said insulating layer; a membrane adjacent to said conductor, said membrane having a corrugated, multi-layer structure for added rigidity; and an actuator chamber formed between said membrane and said conductor, said membrane flexing toward said conductor when a voltage bias is applied thereto.

Abstract: A method for fabricating a membrane having a corrugated, multi-layer structure, comprising the steps of: providing a substrate having an insulator layer on the top surface of the substrate, a conductive layer on the insulator layer, a sacrificial layer on said conductive layer, and a second conductive layer; patterning a series of holes the second conductive layer to allow release etchant to have access to a second sacrificial layer; depositing the second sacrificial layer onto said second conductive layer so that the series of holes are filled with the second sacrificial layer; patterning the second sacrificial layer with a radial and/or concentric grid pattern so that a third conductive layer when deposited will form the support structure and top portion of the corrugated structure; depositing the third conductive layer so that the grid pattern is filled in and is in contact with the second conductive layer; removing the first and second sacrificial layer by immersing the device in a release etchant.

Abstract: A semiconductor structure includes a substrate, a sacrificial layer formed on or over the substrate, and a structural layer formed on or over the sacrificial layer. At least one opening is formed in the structural layer. At least one opening is formed in the sacrificial layer below the at least one opening in the structural layer. The at least one opening in the structural layer and the at least one opening in the sacrificial layer are at least partially filled with a filler material. At least one portion of the structural layer is removed to define at least one microstructure. The sacrificial layer is removed such that the at least one microstructure is released from the substrate and the filler material forms one or more protrusions on the at least one microstructure, and/or one or more anchors anchoring the at least one microstructure to the substrate.