Patents by Inventor Philip Deane
Philip Deane has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200224935Abstract: A thermoelectric heating/cooling device may include first and second thermally conductive headers. A plurality of thermoelectric elements thermally may be coupled in parallel between the first and second thermally conductive headers. In addition, a resistive heating element may be provided on the second header, and the second header may be between the resistive heating element and the plurality of thermoelectric elements.Type: ApplicationFiled: March 24, 2020Publication date: July 16, 2020Inventors: Paul CROCCO, Ramaswamy MAHADEVAN, Philip A. DEANE
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Patent number: 10634396Abstract: A thermoelectric heating/cooling device may include first and second thermally conductive headers. A plurality of thermoelectric elements thermally may be coupled in parallel between the first and second thermally conductive headers. In addition, a resistive heating element may be provided on the second header, and the second header may be between the resistive heating element and the plurality of thermoelectric elements.Type: GrantFiled: May 23, 2014Date of Patent: April 28, 2020Assignee: LAIRD THERMAL SYSTEMS, INC.Inventors: Paul Crocco, Ramaswamy Mahadevan, Philip A. Deane
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Patent number: 9190592Abstract: A method of fabricating a thermoelectric device includes providing a substrate having a plurality of inclined growth surfaces protruding from a surface thereof. Respective thermoelectric material layers are grown on the inclined growth surfaces, and the respective thermoelectric material layers coalesce to collectively define a continuous thermoelectric film. A surface of the thermoelectric film opposite the surface of the substrate may be substantially planar, and a crystallographic orientation of the thermoelectric film may be tilted at an angle of about 45 degrees or less relative to a direction along a thickness thereof. Related devices and fabrication methods are also discussed.Type: GrantFiled: March 15, 2013Date of Patent: November 17, 2015Assignee: Nextreme Thermal Solutions, Inc.Inventors: Robert P. Vaudo, Philip A. Deane, Thomas Peter Schneider, Christopher D. Holzworth, Joseph Robert Williamson
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Publication number: 20140124010Abstract: A method of fabricating a thermoelectric device includes providing a substrate having a plurality of inclined growth surfaces protruding from a surface thereof. Respective thermoelectric material layers are grown on the inclined growth surfaces, and the respective thermoelectric material layers coalesce to collectively define a continuous thermoelectric film. A surface of the thermoelectric film opposite the surface of the substrate may be substantially planar, and a crystallographic orientation of the thermoelectric film may be tilted at an angle of about 45 degrees or less relative to a direction along a thickness thereof. Related devices and fabrication methods are also discussed.Type: ApplicationFiled: March 15, 2013Publication date: May 8, 2014Inventors: Robert P. Vaudo, Philip A. Deane, Thomas Peter Schneider, Christopher D. Holzworth, Joseph Robert Williamson
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Patent number: 8525016Abstract: A thermoelectric device may include a thermoelectric element including a layer of a thermoelectric material and having opposing first and second surfaces. A first metal pad may be provided on the first surface of the thermoelectric element, and a second metal pad may be provided on the second surface of the thermoelectric element. In addition, the first and second metal pads may be off-set in a direction parallel with respect to the first and second surfaces of the thermoelectric element. Related methods are also discussed.Type: GrantFiled: March 25, 2010Date of Patent: September 3, 2013Assignee: Nextreme Thermal Solutions, Inc.Inventors: Philip A. Deane, Ramaswamy Mahadevan, Edward P. Siivola
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Publication number: 20110132000Abstract: A thermoelectric heating/cooling structure may include a heat exchanger and a heat spreader spaced apart from the heat exchanger. In addition, a plurality of spaced apart thermoelectric components may be thermally coupled in parallel between the heat exchanger and the heat spreader. More particularly, each of the thermoelectric components may include a first header adjacent the heat exchanger, a second header adjacent the heat spreader, and a plurality of thermoelectric elements thermally coupled in parallel between the first and second headers. The first headers of the thermoelectric components may be spaced apart adjacent the heat exchanger, and the second headers of the thermoelectric components may be spaced apart adjacent the heat spreader.Type: ApplicationFiled: December 9, 2010Publication date: June 9, 2011Inventors: Philip A. Deane, Edward P. Siivola, Paul Crocco, Ramaswamy Mahadevan
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Patent number: 7855397Abstract: An electronic assembly may include a packaging substrate, an integrated circuit (IC) semiconductor chip, a plurality of metal interconnection structures, and a thermoelectric heat pump. The integrated circuit (IC) semiconductor chip may have an active side including input/output pads thereon and a back side opposite the active side, and the IC semiconductor chip may be arranged with the active side facing the first surface of the packaging substrate. The plurality of metal interconnection structures may be between the active side of the IC semiconductor chip and the first surface of the packaging substrate, and the plurality of metal interconnection structures may provide mechanical connection between the active side of the IC semiconductor chip and the first surface of the packaging substrate. The thermoelectric heat pump may be coupled to the packaging substrate with the thermoelectric heat pump being configured to actively pump heat between the IC semiconductor chip and the packaging substrate.Type: GrantFiled: January 18, 2008Date of Patent: December 21, 2010Assignee: Nextreme Thermal Solutions, Inc.Inventors: Randall G. Alley, Philip A. Deane, David A. Koester, Thomas Peter Schneider, Jesko von Windheim
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Publication number: 20100252087Abstract: A thermoelectric device may include a thermoelectric element including a layer of a thermoelectric material and having opposing first and second surfaces. A first metal pad may be provided on the first surface of the thermoelectric element, and a second metal pad may be provided on the second surface of the thermoelectric element. In addition, the first and second metal pads may be off-set in a direction parallel with respect to the first and second surfaces of the thermoelectric element. Related methods are also discussed.Type: ApplicationFiled: March 25, 2010Publication date: October 7, 2010Inventors: Philip A. Deane, Ramaswamy Mahadevan, Edward P. Siivola
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Publication number: 20090072385Abstract: An electronic assembly may include a packaging substrate, an integrated circuit (IC) semiconductor chip, a plurality of metal interconnection structures, and a thermoelectric heat pump. The integrated circuit (IC) semiconductor chip may have an active side including input/output pads thereon and a back side opposite the active side, and the IC semiconductor chip may be arranged with the active side facing the first surface of the packaging substrate. The plurality of metal interconnection structures may be between the active side of the IC semiconductor chip and the first surface of the packaging substrate, and the plurality of metal interconnection structures may provide mechanical connection between the active side of the IC semiconductor chip and the first surface of the packaging substrate. The thermoelectric heat pump may be coupled to the packaging substrate with the thermoelectric heat pump being configured to actively pump heat between the IC semiconductor chip and the packaging substrate.Type: ApplicationFiled: January 18, 2008Publication date: March 19, 2009Inventors: Randall G. Alley, Philip A. Deane, David A. Koester, Thomas Peter Schneider, Jesko Von Windheim
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Patent number: 7476040Abstract: The present invention relates to an optical sub-assembly, i.e. a receiver optical subassembly or a transmitter optical sub-assembly, for use in an optical transceiver device. The optical sub-assembly according to the present invention includes a hermetic ceramic package with a multi-layer ceramic structure providing a unique RF signal and ground structure providing a controlled signal impedance to achieve high signal transmission quality.Type: GrantFiled: January 31, 2005Date of Patent: January 13, 2009Assignee: JDS Uniphase CorporationInventors: Jeffrey Zack, Craig A. Young, Anand Shukla, Wei Xu, William K. Hogan, David Peter Gaio, Chris Hart, Philip Deane, Mark J. Bailey, Martin A. Helfand
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Patent number: 7160039Abstract: The invention relates to an optical sub-assembly package for use in receiver optical sub-assemblies or transmitter optical sub-assemblies in which the electrical connections between the transducer chip, e.g. photo-detector or light source, and the device printed circuit board is made by a single flexible circuit conductor extending through the wall of the package. The package is comprised of a housing and a stiffening plate, which encloses and end of the housing and forms a mechanical support for an end of the flexible circuit conductor.Type: GrantFiled: January 25, 2005Date of Patent: January 9, 2007Assignee: JDS Uniphase CorporationInventors: Marian C. Hargis, David Peter Gaio, Roger T. Lindquist, William K. Hogan, James Walling, Sundeep Nangalia, Philip Deane, Miles F. Swain, Christopher M. Gabel
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Patent number: 7042306Abstract: Three dimensional electronic and optical coupling devices that are capable of providing high speed coupling over a large frequency range while limiting the amount of space consumption in the communications network. An optical or electrical coupling device comprises a first substrate and a second substrate adjacent to the first substrate having one or more optical waveguides or microstrips formed thereon. The substrates will have disposed thereon conductive microstrips and/or dielectric elements. The one or more optical waveguides or microstrips formed on the first substrate correspond to at least one optical waveguides or microstrips formed on the second substrate so as to facilitate optical coupling between the corresponding waveguides. Precise spacing between the substrates and precise spacing between the optical waveguides or microstrips facilitate the requisite optical/RF coupling.Type: GrantFiled: July 7, 2004Date of Patent: May 9, 2006Assignee: Research Triangle InstituteInventors: Mark W. Roberson, Philip A. Deane, Charles Kenneth Williams
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Patent number: 7007835Abstract: A method for solder bonding a photodiode or an array of photodiodes to a substrate, the photodiode(s) tilted at a predetermined angle, uses a pair solder bumps placed on a photodiode chip opposite a corresponding pair of solder pads placed on the substrate. When the photodiode chip is placed on the substrate, with the solder bumps therebetween, the solder is melted and undergoes a reflow over the surface of the pads. The shape of the pads and the location of the solder bumps on the pads causes the surface tension of the solder to tilt the chip by pulling it to one side.Type: GrantFiled: February 10, 2004Date of Patent: March 7, 2006Assignees: JDS Uniphase Corporation, JDS Uniphase Inc.Inventors: Philip Deane, Neil Teitelbaum
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Publication number: 20050185882Abstract: The present invention relates to an optical sub-assembly, i.e. a receiver optical subassembly or a transmitter optical sub-assembly, for use in an optical transceiver device. The optical sub-assembly according to the present invention includes a hermetic ceramic package with a multi-layer ceramic structure providing a unique RF signal and ground structure providing a controlled signal impedance to achieve high signal transmission quality.Type: ApplicationFiled: January 31, 2005Publication date: August 25, 2005Applicant: JDS Uniphase CorporationInventors: Jeffrey Zack, Craig Young, Anand Shukla, Wei Xu, William Hogan, David Gaio, Chris Hart, Philip Deane, Mark Bailey, Martin Helfand
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Publication number: 20050175299Abstract: The invention relates to an optical sub-assembly package for use in receiver optical sub-assemblies or transmitter optical sub-assemblies in which the electrical connections between the transducer chip, e.g. photo-detector or light source, and the device printed circuit board is made by a single flexible circuit conductor extending through the wall of the package. The package is comprised of a housing and a stiffening plate, which encloses and end of the housing and forms a mechanical support for an end of the flexible circuit conductor.Type: ApplicationFiled: January 25, 2005Publication date: August 11, 2005Applicant: JDS Uniphase CorporationInventors: Marian Hargis, David Gaio, Roger Lindquist, William Hogan, James Walling, Sundeep Nangalia, Philip Deane, Miles Swain, Christopher Gabel
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Patent number: 6906598Abstract: Three dimensional electronic and optical coupling devices that are capable of providing high speed coupling over a large frequency range while limiting the amount of space consumption in the communications network. An optical or electrical coupling device comprises a first substrate and a second substrate adjacent to the first substrate having one or more optical waveguides or microstrips formed thereon. The substrates will have disposed thereon conductive microstrips and/or dielectric elements. The one or more optical waveguides or microstrips formed on the first substrate correspond to at least one optical waveguides or microstrips formed on the second substrate so as to facilitate optical coupling between the corresponding waveguides. Precise spacing between the substrates and precise spacing between the optical waveguides or microstrips facilitate the requisite optical/RF coupling.Type: GrantFiled: December 31, 2002Date of Patent: June 14, 2005Assignee: MCNCInventors: Mark W. Roberson, Philip A. Deane, Charles Kenneth Williams
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Publication number: 20040246065Abstract: Three dimensional electronic and optical coupling devices that are capable of providing high speed coupling over a large frequency range while limiting the amount of space consumption in the communications network. An optical or electrical coupling device comprises a first substrate and a second substrate adjacent to the first substrate having one or more optical waveguides or microstrips formed thereon. The substrates will have disposed thereon conductive microstrips and/or dielectric elements. The one or more optical waveguides or microstrips formed on the first substrate correspond to at least one optical waveguides or microstrips formed on the second substrate so as to facilitate optical coupling between the corresponding waveguides. Precise spacing between the substrates and precise spacing between the optical waveguides or microstrips facilitate the requisite optical/RF coupling.Type: ApplicationFiled: July 7, 2004Publication date: December 9, 2004Applicant: MCNCInventors: Mark W. Roberson, Philip A. Deane, Charles Kenneth Williams
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Publication number: 20040182913Abstract: A method for solder bonding a photodiode or an array of photodiodes to a substrate, the photodiode(s) tilted at a predetermined angle, uses a pair solder bumps placed on a photodiode chip opposite a corresponding pair of solder pads placed on the substrate. When the photodiode chip is placed on the substrate, with the solder bumps therebetween, the solder is melted and undergoes a reflow over the surface of the pads. The shape of the pads and the location of the solder bumps on the pads causes the surface tension of the solder to tilt the chip by pulling it to one side.Type: ApplicationFiled: February 10, 2004Publication date: September 23, 2004Applicants: JDS Uniphase Corporation, JDS Uniphase Inc.Inventors: Philip Deane, Neil Teitelbaum
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Patent number: 6792171Abstract: The invention relates to a receiver optical sub-assembly (ROSA) for use in a high-speed small-form factor transceiver. The ROSA, according to the present invention, includes a stacked chip design in which a semiconductor micro-bench, upon which the photodiode and trans-impedance amplifier are mounted, is disposed perpendicular to the direction that the light travels. A flexible electrical connector is attached to the semiconductor micro-bench for electrically connecting the ROSA to a host a transceiver device. The flexible electrical connector is fixed to the surface of the semiconductor micro-bench with portions cut-out to receive the amplifier and other electrical components extending therefrom. To facilitate assembly, wells are etched from the semiconductor micro-bench corresponding to bumps extending from a mounting flange for the optical coupler.Type: GrantFiled: November 14, 2003Date of Patent: September 14, 2004Assignee: JDS Uniphase CorporationInventors: Marian C. Hargis, David Peter Gaio, Christopher M. Gabel, Sundeep NandNangalia, James Walling, Philip Deane, William K Hogan
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Publication number: 20040124943Abstract: Three dimensional electronic and optical coupling devices that are capable of providing high speed coupling over a large frequency range while limiting the amount of space consumption in the communications network. An optical or electrical coupling device comprises a first substrate and a second substrate adjacent to the first substrate having one or more optical waveguides or microstrips formed thereon. The substrates will have disposed thereon conductive microstrips and/or dielectric elements. The one or more optical waveguides or microstrips formed on the first substrate correspond to at least one optical waveguides or microstrips formed on the second substrate so as to facilitate optical coupling between the corresponding waveguides. Precise spacing between the substrates and precise spacing between the optical waveguides or microstrips facilitate the requisite optical/RF coupling.Type: ApplicationFiled: December 31, 2002Publication date: July 1, 2004Applicant: MCNCInventors: Mark W. Roberson, Philip A. Deane, Charles Kenneth Williams