Abstract: This invention relates to a compound of formula (I) and the pharmaceutically acceptable salts thereof wherein R1, R2, R4. Ar and Het are as defined herein. The invention also relates to methods of using the compound of formula (I) to treat a diseases and disorders that are mediated or sustained through the activity of CCR10.

Abstract: The application relates to compounds of formula Ia and analogues thereof wherein R1 to R13 and X are as defined herein. The invention also relates to the use of the compounds of formula Ia as inhibitors of Mitogen-Activated Protein Kinase-Activated Protein kinase-2 (MAPKAP-k2), and also to a method for preventing or treating a disease or disorder that can be treated or prevented by modulating the activity of MAPKAP-K2 in a subject and to pharmaceutical compositions and kits that include these MAPKAP-K2 inhibitors.

Abstract: Herein is described a tokenless biometric method for processing electronic transmissions, using at least one user biometric sample, an electronic identicator and an electronic rule module clearinghouse. The steps for processing of the electronic transmissions comprise of a user registration step, wherein a user registers with an electronic identicator at least one registration biometric sample taken directly from the person of the user. A formation of a rule module customized to the user in a rule module clearinghouse, wherein at least one pattern data of a user is associated with at least one execution command of the user. A user identification step, wherein the electronic identicator compares a bid biometric sample taken directly from the person of the user with at least one previously registered biometric sample for producing either a successful or failed identification of the user.

Abstract: Herein is described a tokenless biometric method for processing electronic transmissions, using at least one user biometric sample, an electronic identicator and an electronic rule module clearinghouse. The steps for processing of the electronic transmissions comprise of a user registration step, wherein a user registers with an electronic identicator at least one registration biometric sample taken directly from the person of the user. A formation of a rule module customized to the user in a rule module clearinghouse, wherein at least one pattern data of a user is associated with at least one execution command of the user. A user identification step, wherein the electronic identicator compares a bid biometric sample taken directly from the person of the user with at least one previously registered biometric sample for producing either a successful or failed identification of the user.

Abstract: Herein is described a tokenless biometric method for processing electronic transmissions, using at least one user biometric sample, an electronic identicator and an electronic rule module clearinghouse. The steps for processing of the electronic transmissions comprise of a user registration step, wherein a user registers with an electronic identicator at least one registration biometric sample taken directly from the person of the user. A formation of a rule module customized to the user in a rule module clearinghouse, wherein at least one pattern data of a user is associated with at least one execution command of the user. A user identification step, wherein the electronic identicator compares a bid biometric sample taken directly from the person of the user with at least one previously registered biometric sample for producing either a successful or failed identification of the user.

Abstract: The present invention relates to an optical sub-assembly, i.e. a receiver optical subassembly or a transmitter optical sub-assembly, for use in an optical transceiver device. The optical sub-assembly according to the present invention includes a hermetic ceramic package with a multi-layer ceramic structure providing a unique RF signal and ground structure providing a controlled signal impedance to achieve high signal transmission quality.

Abstract: The present invention shows a method and a device system for tokenless authorization of commercial transactions between a user and a seller. The user registers at least one registration biometric sample, and at least one user financial account. The seller registers with the computer system at least one seller financial account. The seller offers a proposed commercial transaction to the user, which includes price information. The user accepts the seller's proposed commercial transaction by adding to the proposed commercial transaction the user's personal authentication information. The bid biometric sample is forwarded to the computer system. The computer system compares the bid biometric sample with registration biometric samples. Upon successful match, a financial account of the user is debited and a financial account of the seller is credited, wherein a commercial transaction is conducted without the user having to use any portable man-made memory devices such as smartcards or swipe cards.

Abstract: The invention relates to an optical sub-assembly package for use in receiver optical sub-assemblies or transmitter optical sub-assemblies in which the electrical connections between the transducer chip, e.g. photo-detector or light source, and the device printed circuit board is made by a single flexible circuit conductor extending through the wall of the package. The package is comprised of a housing and a stiffening plate, which encloses and end of the housing and forms a mechanical support for an end of the flexible circuit conductor.

Abstract: A method for purifying a spent acid catalyst from an acid catalyzed chemical reaction that generates a mixture of a product, spent add and tar, includes the steps of separating the mixture of product, spent acid, and tar into a product fraction and a spent acid fraction, said spent acid fraction comprising a mixture of spent acid and tar, and separating the spent acid fraction, by flotation separation, centrifugation, or liquid-liquid coalescence, into a tar fraction and a de-tarred spent acid fraction. The fluidized tar and the de-tarred spent acid can each be further processed to produce concentrated acid.

Abstract: A method for solder bonding a photodiode or an array of photodiodes to a substrate, the photodiode(s) tilted at a predetermined angle, uses a pair solder bumps placed on a photodiode chip opposite a corresponding pair of solder pads placed on the substrate. When the photodiode chip is placed on the substrate, with the solder bumps therebetween, the solder is melted and undergoes a reflow over the surface of the pads. The shape of the pads and the location of the solder bumps on the pads causes the surface tension of the solder to tilt the chip by pulling it to one side.

Abstract: Disclosed is a system and method for processing tokenless electronic consumer rewards between a reward provider and a recipient using an electronic identicator comparator and at least one recipient biometric data. The process uses apparatus for creating an electronic registry of a reward provider's products or services each having a predetermined rewards value, the rewards being disbursed to recipients based upon the occurrence of predetermined criteria; recipient registration, wherein the recipient registers with the electronic identicator comparator at least one registration biometric sample, and recipient specific data; recipient identification, wherein the identicator comparator compares a recipient bid biometric sample with previously registered biometric samples for producing either a successful or failed identification of the recipient; and recipient rewards issuance, wherein the rewards provider issues rewards to the recipient.

Abstract: The present invention relates to an optical sub-assembly, i.e. a receiver optical subassembly or a transmitter optical sub-assembly, for use in an optical transceiver device. The optical sub-assembly according to the present invention includes a hermetic ceramic package with a multi-layer ceramic structure providing a unique RF signal and ground structure providing a controlled signal impedance to achieve high signal transmission quality.

Abstract: The invention relates to an optical sub-assembly package for use in receiver optical sub-assemblies or transmitter optical sub-assemblies in which the electrical connections between the transducer chip, e.g. photo-detector or light source, and the device printed circuit board is made by a single flexible circuit conductor extending through the wall of the package. The package is comprised of a housing and a stiffening plate, which encloses and end of the housing and forms a mechanical support for an end of the flexible circuit conductor.

Abstract: The invention discloses a tokenless biometric identification computer system, comprising at least a database containing registered biometric samples of users. A comparator compares a bid biometric sample of a user to at least one registered biometric sample, the bid biometric sample obtained directly from the user during an identification process for conducting an electronic transaction by the user. A stored audio signature is associated with a transaction processor entity, which the transaction processor entity is responsible for conducting the electronic transaction. A sound generator generates an analog or digital signal from the stored audio signature, and a transducer converts the analog or digital signal to a play back audio signature.

Abstract: The invention provides a method and device for tokenless authorization of an electronic payment between a payor and a payee using an electronic third party identicator and at least one payor bid biometric sample. In a payor registration step, the payor registers with an electronic third party identicator at least one registration biometric sample, and at least one payor financial account identifier. The payee registers a payee identification data with the electronic third party identicator. A payee bid identification data and a payor bid biometric sample collected from the payor's person are electronically forwarded to the third party electronic identicator. A comparator engine compares the bid biometric sample with at least one registered biometric sample for producing either a successful or failed identification of the payor.

Abstract: There is a process for removing by-product tar during the manufacture of isopropyl alcohol. The process comprises the following: a) reacting propylene with concentrated sulfuric acid and water to form isopropyl alcohol and a spent acid having a by-product tar; b) capturing at least a portion of the isopropyl alcohol; c) contacting the spent acid with a gas in bubble form; d) allowing a least a portion of the tar to separate from the remainder of the spent acid to form a layer of tar and a layer of cleaned acid solution; e) capturing the tar; and h) recycling the cleaned acid solution to step a) as a source of sulfuric acid. There is also a process for removing by-product tar during the manufacture of methyl ethyl ketone. The process is substantially the same except that 1-butene is substituted for propylene. There is also a process for removing tar from a spent acid.

Abstract: There is a process for removing by-product tar during the manufacture of isopropyl alcohol. The process comprises the following: a) reacting propylene with concentrated sulfuric acid and water to form isopropyl alcohol and a spent acid having a by-product tar; b) capturing at leas a portion of the isopropyl alcohol; c) contacting the spent acid with a gas in bubble form; d) allowing a least a portion of the tar to separate from the remainder of the spent acid to form a layer of tar and a layer of cleaned acid solution; e) capturing the tar; and h) recycling the cleaned acid solution to step a) as a source of sulfuric acid. There is also a process for removing by-product tar during the manufacture of methyl ethyl ketone. The process is substantially the same except that 1-butene is substituted for propylene. There is also a process for removing tar from a spent acid.

Abstract: A method for solder bonding a photodiode or an array of photodiodes to a substrate, the photodiode(s) tilted at a predetermined angle, uses a pair solder bumps placed on a photodiode chip opposite a corresponding pair of solder pads placed on the substrate. When the photodiode chip is placed on the substrate, with the solder bumps therebetween, the solder is melted and undergoes a reflow over the surface of the pads. The shape of the pads and the location of the solder bumps on the pads causes the surface tension of the solder to tilt the chip by pulling it to one side.

Abstract: The invention relates to a receiver optical sub-assembly (ROSA) for use in a high-speed small-form factor transceiver. The ROSA, according to the present invention, includes a stacked chip design in which a semiconductor micro-bench, upon which the photodiode and trans-impedance amplifier are mounted, is disposed perpendicular to the direction that the light travels. A flexible electrical connector is attached to the semiconductor micro-bench for electrically connecting the ROSA to a host a transceiver device. The flexible electrical connector is fixed to the surface of the semiconductor micro-bench with portions cut-out to receive the amplifier and other electrical components extending therefrom. To facilitate assembly, wells are etched from the semiconductor micro-bench corresponding to bumps extending from a mounting flange for the optical coupler.

Abstract: The invention relates to a receiver optical sub-assembly (ROSA) for use in a high-speed small-form factor transceiver. The ROSA, according to the present invention, includes a stacked chip design in which a semiconductor micro-bench, upon which the photodiode and trans-impedance amplifier are mounted, is disposed perpendicular to the direction that the light travels. A flexible electrical connector is attached to the semiconductor micro-bench for electrically connecting the ROSA to a host transceiver device. The flexible electrical connector is fixed to the surface of the semiconductor micro-bench with portions cut-out to receive the amplifier and other electrical components extending therefrom. To facilitate assembly, wells are etched from the semiconductor micro-bench corresponding to bumps extending from a mounting flange for the optical coupler.