Patents by Inventor Philip Joseph

Philip Joseph has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7158502
    Abstract: To address the need for a dispatch mobile (303, 305, 307) to more quickly make a call, in the preferred embodiment of the present invention those remote units operating in a dispatch mode (303, 305, 307) will receive a first slot cycle, while those remote units not operating in a dispatch mode (302, 304, 306, 308) will receive a second slot cycle. The second slot cycle is greater than the first slot cycle, so that those remote units operating in dispatch mode (303, 305, 307) will “wake up” during the slot cycle normally utilized for interconnect calls. Because shorter slot cycles are utilized for remote units operating in dispatch mode (303, 305, 307), the time it takes to make a dispatch call is greatly reduced. Additionally the minimum slot cycle duration typically used for standard calls remains unchanged, greatly conserving battery life.
    Type: Grant
    Filed: June 14, 2001
    Date of Patent: January 2, 2007
    Assignee: Motorola, Inc.
    Inventors: John M. Harris, Sean Kelley, Daniel De Clerck, Philip Joseph Fleming, Stephen Spear, Ronald Thomas Crocker
  • Patent number: 7034382
    Abstract: An improved leadframe-based CSP and a method of forming the leadframe-based CSP are provided. The leadframe-based CSP includes a leadframe including a die attach pad and a plurality of wire bonding pads, at least one aperture disposed in the die attach pad, at least one die on the die attach pad, at least one bonding wire for electrically connecting the die and the wire bonding pads, and a mold compound for encapsulating the die and the bonding wire to form a chip package, wherein the mold compound is formed in the aperture.
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: April 25, 2006
    Assignee: M/A-COM, Inc.
    Inventors: William James Palmteer, Philip Joseph Beucler
  • Patent number: 7007399
    Abstract: My invention described is an electronic and mechanical tool used to measure jet line or string for the purpose of measuring electrical conduit lengths. This new process eliminates the manual labor required before calculating how long the conduit is and how much feeder lengths are required. With the use of a permanent magnet and magnetic switch applied with a sheave that works together and timing to give input to a four decade up counter, the system senses the total number of feet measured by the jet line or string passing around the sheave and displays the total count on the foot meter.
    Type: Grant
    Filed: August 22, 2003
    Date of Patent: March 7, 2006
    Inventor: Philip Joseph Catalano
  • Publication number: 20040143344
    Abstract: An implantable tissue repair device has a cover and tissue regeneration material. The cover includes a top panel and a bottom panel joined together along a leading edge. The tissue regeneration material is positioned between the top and bottom panels. The cover includes a continuous sheet of biocompatible material extending across the edge and into the top panel and bottom panel. The cover is thicker along the leading edge than at least a portion of the top panel and thicker than at least a portion of the bottom panel. At least a portion of one of the panels covering the tissue regeneration material is thicker than a portion of the other panel covering the tissue regeneration material. A method of making the device is also disclosed.
    Type: Application
    Filed: December 29, 2003
    Publication date: July 22, 2004
    Inventors: Prasanna Malaviya, Herbert E. Schwartz, Anthony D. Zannis, Terrence David Whalen, Philip Joseph Jenks
  • Patent number: 6760959
    Abstract: A die and a method for forming a die to produce optically varying effects in a light reflective surface. A design generally formed as a plurality of parallel grooves of varying widths and depths are engraved in a soft metal foil adhered to a substrate. A hard metal coating is formed on the engraved soft metal foil in a metal plating bath. The hard metal coating, removed from the soft metal foil provides a die formed as a mirror image of the grooves engraved in the soft metal foil. The die is used to deform a reflective surface such that the surface produces optically varying effects. A die formed in the same manner with further processing is used to both deform a reflective surface and hot stamp it to a substrate.
    Type: Grant
    Filed: November 13, 2001
    Date of Patent: July 13, 2004
    Inventor: Philip Joseph Grear
  • Publication number: 20040127233
    Abstract: An interconnect communication system is provided that provides for dispatch-type services including Instant Access call set up, talkgroup creation and management, and in-band floor arbitration and mode switching that employ in-band signaling tones. By providing talkgroup creation and management and in-band floor arbitration that are transparent to the underlying network, the talkgroup creation and management and in-band floor arbitration may be implemented in a legacy system without the need to modify the network and regardless of the type of network employed. Furthermore, by providing Instant Access call set up procedures and mode switching procedures that are capable of utilizing modified versions of known messages, the procedures may be implemented in a legacy system in a simplified manner, minimizing the impact of an addition of such procedures to a legacy network.
    Type: Application
    Filed: December 31, 2002
    Publication date: July 1, 2004
    Inventors: John M. Harris, Jay Jayapalan, Philip Joseph Fleming
  • Publication number: 20040051173
    Abstract: A high frequency interconnect packaging and assembly system (FIG. 25).
    Type: Application
    Filed: June 6, 2003
    Publication date: March 18, 2004
    Inventors: Philip Joseph Koh, Steven Michael Marazita, David Thompson Nemeth
  • Patent number: 6686630
    Abstract: The present invention provides a method for fabricating sub-0.05 &mgr;m double-gated MOSFET devices utilizing a damascene-gate process. The damascene-gate process provides sub-0.05 &mgr;m double-gated MOSFET devices which include a frontside poly gate electrode and a backside implant region. The two gates are separated by two gate dielectrics that include a thin (on the order of about 200 Å or less) Si layer which is sandwiched between the gate dielectrics. The Si layer serves as the channel region of the device. Short-channel effects are greatly suppressed in the present double-gate MOSFET device because the two gates terminate the drain filed lines, preventing the drain potential from being felt at the source end of the channel.
    Type: Grant
    Filed: February 7, 2001
    Date of Patent: February 3, 2004
    Assignee: International Business Machines Corporation
    Inventors: Hussein Ibrahim Hanafi, Erin C. Jones, Cheruvu Suryanarayana Murthy, Philip Joseph Oldiges, Leathen Shi
  • Publication number: 20040015408
    Abstract: The present invention provides a computer-based corporate content management and delivery (CCMD) system. The CCMD system provides efficient storage, management, and delivery of corporate content in response to orders for such content. The CCMD system includes a first module configured to create digital and/or acquire digital content for repurposing in a digital and/or a physical format. A second module, which is electronically coupled to the first module, manages data necessary to process and execute orders for such corporate content in one of digital format and physical format. A third CCMD system module integrates operations of the first module and the second module. The third module also coordinates these operations with internal and/or external third party content/product providers and customers.
    Type: Application
    Filed: October 11, 2002
    Publication date: January 22, 2004
    Inventors: Philip Joseph Rauen, Christopher W. Bjornson, David Miles Houck, Paul L. Keane, Frank B. Modruson, Lance Patrick Hartshorn, Kip Leonard Meyer
  • Publication number: 20030212629
    Abstract: Authent-eCard employs business rules, a business rule engine on a portable data device and an Internet portal to allow for automated, predefined controls on financial transactions. These business rules are the codification of policies and procedures for which the card-holder may obtain goods and services. By combining the portable data device, merchant or service provider interface, and portal, the rules may be dynamically applied and employ complex historical data logic for frequency and asset associated data. This pre-purchase verification and authorization of purchases replaces post-purchase audits, systems, and expense analysis as financial spending controls.
    Type: Application
    Filed: May 7, 2002
    Publication date: November 13, 2003
    Inventor: Philip Joseph Benton King
  • Patent number: 6624508
    Abstract: A direct attachment technique is described for silicon packages housing high frequency devices. A silicon package may be shaped as either a plug or a socket or the package may have both the plug and socket capability, thus enabling the package to be directly attached to other packages The plug is trapezoidal in cross section while the socket has a dovetail-joint-like aperture. The plug is inserted into the socket thereby directly attaching one package to another. The two packages are locked together when the slanted edges of the plug are fitted to the slanted edges of the socket.
    Type: Grant
    Filed: January 3, 2001
    Date of Patent: September 23, 2003
    Assignee: Sophia Wireless, Inc.
    Inventor: Philip Joseph Koh
  • Publication number: 20030042603
    Abstract: A direct attachment technique is described for silicon packages housing high frequency devices. A silicon package may be shaped as either a plug or a socket or the package may have both the plug and socket capability, thus enabling the package to be directly attached to other packages The plug is trapezoidal in cross section while the socket has a dovetail-joint-like aperture. The plug is inserted into the socket thereby directly attaching one package to another. The two packages are locked together when the slanted edges of the plug are fitted to the slanted edges of the socket.
    Type: Application
    Filed: October 24, 2002
    Publication date: March 6, 2003
    Applicant: SOPHIA WIRELESS, INC.
    Inventor: Philip Joseph Koh
  • Publication number: 20020191583
    Abstract: To address the need for a dispatch mobile (303, 305, 307) to more quickly make a call, in the preferred embodiment of the present invention those remote units operating in a dispatch mode (303, 305, 307) will receive a first slot cycle, while those remote units not operating in a dispatch mode (302, 304, 306, 308) will receive a second slot cycle. The second slot cycle is greater than the first slot cycle, so that those remote units operating in dispatch mode (303, 305, 307) will “wake up” during the slot cycle normally utilized for interconnect calls. Because shorter slot cycles are utilized for remote units operating in dispatch mode (303, 305, 307), the time it takes to make a dispatch call is greatly reduced. Additionally the minimum slot cycle duration typically used for standard calls remains unchanged, greatly conserving battery life.
    Type: Application
    Filed: June 14, 2001
    Publication date: December 19, 2002
    Inventors: John M. Harris, Sean Kelley, Daniel De Clerck, Philip Joseph Fleming, Stephen Spear, Ronald Thomas Crocker
  • Publication number: 20020149091
    Abstract: An improved leadframe-based CSP and a method of forming the leadframe-based CSP are provided. The leadframe-based CSP includes a leadframe including a die attach pad and a plurality of wire bonding pads, at least one aperture disposed in the die attach pad, at least one die on the die attach pad, at least one bonding wire for electrically connecting the die and the wire bonding pads, and a mold compound for encapsulating the die and the bonding wire to form a chip package, wherein the mold compound is formed in the aperture.
    Type: Application
    Filed: September 28, 2001
    Publication date: October 17, 2002
    Inventors: William James Palmteer, Philip Joseph Beucler
  • Publication number: 20020105620
    Abstract: Projection systems are known to display images of all kind. The invention proposes to use of a ceiling of a room, for example the bedroom can be used to display all kind of images. Further the invention makes the projection system very much user-interactive.
    Type: Application
    Filed: December 18, 2001
    Publication date: August 8, 2002
    Inventors: Lorna Goulden, Paul Denis MacGroary, Fiona Rees, Alex Wee Kar Tan, Joanna Martina Cornelia Van Gestel, Philip Joseph Phelan
  • Publication number: 20020105039
    Abstract: The present invention provides a method for fabricating sub-0.05 &mgr;m double-gated MOSFET devices utilizing a damascene-gate process. The damascene-gate process provides sub-0.05 &mgr;m double-gated MOSFET devices which include a frontside poly gate electrode and a backside implant region. The two gates are separated by two gate dielectrics that include a thin (on the order of about 200 Å or less) Si layer which is sandwiched between the gate dielectrics. The Si layer serves as the channel region of the device. Short-channel effects are greatly suppressed in the present double-gate MOSFET device because the two gates terminate the drain filed lines, preventing the drain potential from being felt at the source end of the channel.
    Type: Application
    Filed: February 7, 2001
    Publication date: August 8, 2002
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION ARMONK, NEW YORK
    Inventors: Hussein Ibrahim Hanafi, Erin C. Jones, Cheruvu Suryanarayana Murthy, Philip Joseph Oldiges, Leathen Shi
  • Publication number: 20020075613
    Abstract: An arc fault detection circuit includes a first resistance and an arc sensing circuit configured to sense a voltage level indicative of a voltage drop across the first resistance. The arc fault detection circuit detects an arc in the distribution circuit in response to the voltage level. A power drop out compensation circuit is configured to reduce the voltage level for a period of time after operating power is applied to the power drop out compensation circuit.
    Type: Application
    Filed: December 20, 2000
    Publication date: June 20, 2002
    Inventors: Henry Hall Mason, Philip Joseph Klemas
  • Publication number: 20020038789
    Abstract: A die and a method for forming a die to produce optically varying effects in a light reflective surface. A design generally formed as a plurality of parallel grooves of varying widths and depths are engraved in a soft metal foil adhered to a substrate. A hard metal coating is formed on the engraved soft metal foil in a metal plating bath. The hard metal coating, removed from the soft metal foil provides a die formed as a mirror image of the grooves engraved in the soft metal foil. The die is used to deform a reflective surface such that the surface produces optically varying effects. A die formed in the same manner with further processing is used to both deform a reflective surface and hot stamp it to a substrate.
    Type: Application
    Filed: November 13, 2001
    Publication date: April 4, 2002
    Inventor: Philip Joseph Grear
  • Publication number: 20020037598
    Abstract: A direct attachment technique is described for silicon packages housing high frequency devices. A silicon package may be shaped as either a plug or a socket or the package may have both the plug and socket capability, thus enabling the package to be directly attached to other packages The plug is trapezoidal in cross section while the socket has a dovetail-joint-like aperture. The plug is inserted into the socket thereby directly attaching one package to another. The two packages are locked together when the slanted edges of the plug are fitted to the slanted edges of the socket.
    Type: Application
    Filed: December 3, 2001
    Publication date: March 28, 2002
    Applicant: Sophia Wireless, Inc.
    Inventor: Philip Joseph Koh
  • Patent number: 6361702
    Abstract: A die and a method for forming a die to produce optically varying effects in a light reflective surface. A design generally formed as a plurality of parallel grooves of varying widths and depths are engraved in a soft metal foil adhered to a substrate. A hard metal coating is formed on the engraved soft metal foil in a metal plating bath. The hard metal coating, removed from the soft metal foil provides a die formed as a mirror image of the grooves engraved in the soft metal foil. The die is used to deform a reflective surface such that the surface produces optically varying effects. A die formed in the same manner with further processing is used to both deform a reflective surface and hot stamp it to a substrate.
    Type: Grant
    Filed: January 28, 1999
    Date of Patent: March 26, 2002
    Inventor: Philip Joseph Grear