Patents by Inventor Philip Michael
Philip Michael has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250226136Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: ApplicationFiled: March 31, 2025Publication date: July 10, 2025Applicants: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLCInventors: Brian LABOMBARD, Robert S. GRANETZ, James IRBY, Rui VIEIRA, William BECK, Daniel BRUNNER, Jeffrey DOODY, Martin GREENWALD, Zachary HARTWIG, Philip MICHAEL, Robert MUMGAARD, Alexey RADOVINSKY, Shunichi SHIRAIWA, Brandon N. SORBOM, John WRIGHT, Lihua ZHOU
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Patent number: 12293871Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: GrantFiled: September 28, 2023Date of Patent: May 6, 2025Assignees: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLCInventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Shunichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
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Publication number: 20250016958Abstract: A high capacity current lead (10) comprises components that are electrically coupled using indium joints. The current lead includes a heat exchanger having a portion at room temperature (100) and a portion (200) within a vacuum cryostat. The room-temperature portion is temperature controlled against both overheating and over-cooling. The cryogenic portion (200) of the heat exchanger is electrically coupled to a coolant boiling chamber (300) using indium joints. The boiling chamber (300) has a lid and a base that may be electrically coupled using indium joints, or they may be brazed. The boiling chamber (300) is surrounded by a vacuum lid that may be electrically coupled to the base using indium joints, or brazed. The base is electrically coupled to a superconductor module (400) having high-temperature superconductor (HTS) tapes for conveying current to a device, such as a superconducting electromagnet.Type: ApplicationFiled: November 10, 2022Publication date: January 9, 2025Applicants: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLCInventors: Vincent FRY, Alexander ZHUKOVSKY, Philip MICHAEL, Ernest IHLOFF, Michael WOLF, William BECK
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Publication number: 20240203628Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: ApplicationFiled: September 28, 2023Publication date: June 20, 2024Applicants: Massachusetts Institute of Technology, Commonwealth Fusion System LLCInventors: Brian LABOMBARD, Robert S. GRANETZ, James IRBY, Rui VIEIRA, William BECK, Daniel BRUNNER, Jeffrey DOODY, Martin GREENWALD, Zachary HARTWIG, Philip MICHAEL, Robert MUMGAARD, Alexey RADOVINSKY, Shunichi SHIRAIWA, Brandon N. SORBOM, John WRIGHT, Lihua ZHOU
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Publication number: 20230361549Abstract: Described are cable joints and related structures and techniques for coupling high temperature superconducting (HTS) cables. A cable joint includes a conductive member having a length which defines the length of the joint and having first and second mounting regions shaped to accept first and second HTS cable with an interface layer comprised of a malleable metal disposed between a surfaces of the first and second mounting regions and surfaces of the first and second HTS cables.Type: ApplicationFiled: December 2, 2020Publication date: November 9, 2023Applicants: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLCInventors: Zachary HARTWIG, Philip MICHAEL, Brandon N. SORBOM, James IRBY, Rui VIEIRA, William BECK, Erica SALAZAR, Vincent FRY
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Patent number: 11810712Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: GrantFiled: June 30, 2022Date of Patent: November 7, 2023Assignees: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLCInventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Shunichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
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Publication number: 20220336130Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: ApplicationFiled: June 30, 2022Publication date: October 20, 2022Applicants: Massachusetts Institute of Technology, Commonwealth Fusion System LLCInventors: Brian LABOMBARD, Robert S. GRANETZ, James IRBY, Rui VIEIRA, William BECK, Daniel BRUNNER, Jeffrey DOODY, Martin GREENWALD, Zachary HARTWIG, Philip MICHAEL, Robert MUMGAARD, Alexey RADOVINSKY, Syun'ichi SHIRAIWA, Brandon N. SORBOM, John WRIGHT, Lihua ZHOU
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Patent number: 11417464Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: GrantFiled: June 11, 2021Date of Patent: August 16, 2022Assignees: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLCInventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Syun'ichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
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Publication number: 20210313104Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: ApplicationFiled: June 11, 2021Publication date: October 7, 2021Inventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Syun'ichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
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Patent number: 11094439Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: GrantFiled: December 23, 2019Date of Patent: August 17, 2021Assignee: Massachusetts Institute of TechnologyInventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Syun'ichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
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Publication number: 20200402693Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: ApplicationFiled: December 23, 2019Publication date: December 24, 2020Inventors: Alexey RADOVINSKY, Brian LABOMBARD, Daniel BRUNNER, Robert S. GRANETZ, James IRBY, Rui VIEIRA, William BECK, Jeffrey DOODY, Martin GREENWALD, Zachary HARTWIG, Philip MICHAEL, Robert MUMGAARD, Syun'ichi SHIRAIWA, Brandon N. SORBOM, John WRIGHT, Lihua ZHOU
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Publication number: 20200211744Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: ApplicationFiled: December 27, 2018Publication date: July 2, 2020Inventors: Brian LABOMBARD, Robert GRANETZ, James IRBY, Rui VIEIRA, William BECK, Daniel BRUNNER, Jeffrey DOODY, Martin GREENWALD, Zachary HARTWIG, Philip MICHAEL, Robert MUMGAARD, Alexey RADOVINSKY, Syun'ichi SHIRAIWA, Brandon N. SORBOM, John WRIGHT, Lihua ZHOU
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Patent number: 10566121Abstract: A magnet for transporting a particle beam in a target magnet field may include a first set of coils and a second set of coils. According to some aspects, the first and second set of coils may be configured to generate a combined desired magnetic field within the bore and may be configured to generate a combined magnetic field weaker than the desired magnetic field outside the bore.Type: GrantFiled: November 16, 2016Date of Patent: February 18, 2020Assignees: Ion Beam Applications S.A., Massachusetts Institute of TechnologyInventors: Alexey Radovinsky, Leslie Bromberg, Joseph Minervini, Philip Michael, Emma Pearson, Eric Forton
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Publication number: 20180330857Abstract: A magnet for transporting a particle beam in a target magnet field may include a first set of coils and a second set of coils. According to some aspects, the first and second set of coils may be configured to generate a combined desired magnetic field within the bore and may be configured to generate a combined magnetic field weaker than the desired magnetic field outside the bore.Type: ApplicationFiled: November 16, 2016Publication date: November 15, 2018Inventors: Alexey RADOVINSKY, Leslie BROMBERG, Joseph MINERVINI, Philip MICHAEL, Emma PEARSON, Eric FORTON
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Publication number: 20140306369Abstract: A method of beneficiating fly ash to produce particulate material for use as a filler/extender in plastics manufacturing. The method includes removal of extraneous surface deposits from surfaces of the particulate material.Type: ApplicationFiled: October 19, 2012Publication date: October 16, 2014Inventors: Nigel Peter Smalley, Paul Anthony Shepheard, Philip Michael