Abstract: A method includes forming a first transistor, a second transistor, a third transistor, and a fourth transistor over a substrate, wherein at least the second and third transistors include ferroelectric materials; forming an interlayer dielectric (ILD) layer over the first to fourth transistors; forming a first metal line over the ILD layer to interconnect drains of the second and third transistors and a gate of the fourth transistor; forming a second metal line over the ILD layer to interconnect a drain of the first transistor and gates of the second and third transistors; forming a write word line over the ILD layer and electrically connected to a gate of the first transistor but electrically isolated from the fourth transistor; forming a word line over the ILD layer and electrically connected to a source of the first transistor; and forming a bit line electrically connected to the fourth transistor.

Abstract: A method includes forming a first semiconductor layer and a second semiconductor layer vertically above the first semiconductor layer over a substrate; forming a first ferroelectric layer and a second ferroelectric layer wrapping around the first semiconductor layer and the second semiconductor layer, respectively; forming a first gate structure and a second gate structure over the first ferroelectric layer and the second ferroelectric layer, respectively, wherein the first gate structure is in contact with the second gate structure; and forming a conductive feature electrically connecting a drain region of the first semiconductor layer with a drain region of the second semiconductor layer.

Abstract: A memory circuit includes a memory cell and a source line transistor. The memory cell includes a first transistor, a second transistor, a third transistor, and a fourth transistor. The second transistor and the third transistor form an inverter electrically connected to a drain of the first transistor. The inverter is configured to store two states with different applied voltages. The fourth transistor is electrically connected to a node of the inverter. The source line transistor is electrically connected to the fourth transistor.

Abstract: A method includes forming a first transistor, a second transistor, a third transistor, and a fourth transistor over a substrate, wherein at least the second and third transistors include ferroelectric materials; forming an interlayer dielectric (ILD) layer over the first to fourth transistors; forming a first metal line over the ILD layer to interconnect drains of the second and third transistors and a gate of the fourth transistor; forming a second metal line over the ILD layer to interconnect a drain of the first transistor and gates of the second and third transistors; forming a write word line over the ILD layer and electrically connected to a gate of the first transistor but electrically isolated from the fourth transistor; forming a word line over the ILD layer and electrically connected to a source of the first transistor; and forming a bit line electrically connected to the fourth transistor.

Abstract: The invention discloses an exopolysaccharide from Rhodopseudomonas palustris and a method for preparing and use thereof, and the method for preparing comprises the steps of: 1) keeping a seed solution from Rhodopseudomonas palustris GJ-22 in a fermentation medium for fermentation culture to obtain a fermentation broth; 2) centrifuging the fermentation broth to take the supernatant, which is treated by alcohol precipitation after filtration, and then collecting the pellet from alcohol precipitation by centrifugation to obtain crude polysaccharide; 3) removing proteins from the rude polysaccharide using protease enzymolysis method and Sevag method, followed by dialysis treatment with distilled water to remove small molecules and organic solvent to obtain a polysaccharide sample; 4) purifying the polysaccharide sample through an anion exchange column and a molecular exclusion chromatography column obtain the exopolysaccharide from Rhodopseudomonas palustris.

Abstract: The invention discloses an exopolysaccharide from Rhodopseudomonas palustris and a method for preparing and use thereof, and the method for preparing comprises the steps of: 1) keeping a seed solution from Rhodopseudomonas palustris GJ-22 in a fermentation medium for fermentation culture to obtain a fermentation broth; 2) centrifuging the fermentation broth to take the supernatant, which is treated by alcohol precipitation after filtration, and then collecting the pellet from alcohol precipitation by centrifugation to obtain crude polysaccharide; 3) removing proteins from the rude polysaccharide using protease enzymolysis method and Sevag method, followed by dialysis treatment with distilled water to remove small molecules and organic solvent to obtain a polysaccharide sample; 4) purifying the polysaccharide sample through an anion exchange column and a molecular exclusion chromatography column obtain the exopolysaccharide from Rhodopseudomonas palustris.

Abstract: A memory circuit includes a memory cell and a source line transistor. The memory cell includes a first transistor, a second transistor, a third transistor, and a fourth transistor. The second transistor and the third transistor form an inverter electrically connected to a drain of the first transistor. The inverter is configured to store two states with different applied voltages. The fourth transistor is electrically connected to a node of the inverter. The source line transistor is electrically connected to the fourth transistor.

Abstract: A circuit includes a hybrid switch, which includes a Tunnel Field-Effect Transistor (TFET) having a first source, a first drain, and a first gate. The hybrid switch further includes a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) connected to the TFET in parallel, with the MOSFET including a second source connected to the first source, a second drain connected to the first drain, and a second gate connected to the first gate.

Abstract: A circuit includes a hybrid switch, which includes a Tunnel Field-Effect Transistor (TFET) having a first source, a first drain, and a first gate. The hybrid switch further includes a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) connected to the TFET in parallel, with the MOSFET including a second source connected to the first source, a second drain connected to the first drain, and a second gate connected to the first gate.

Abstract: The present invention provides an IG 7T FinFET SRAM, which adopts independently-controlled-gate super-high-VT FinFETs to achieve a stacking-like property, whereby to eliminate the read disturb and half-select disturb. Further, the present invention uses keeper circuits and read control voltage to reduce leakage current of the bit lines during read. Furthermore, the present invention can effectively overcome the problem of the conventional 6T SRAM that is likely to have read errors at low operation voltage.

Abstract: The present invention provides an IG 7T FinFET SRAM, which adopts independently-controlled-gate super-high-VT FinFETs to achieve a stacking-like property, whereby to eliminate the read disturb and half-select disturb. Further, the present invention uses keeper circuits and read control voltage to reduce leakage current of the bit lines during read. Furthermore, the present invention can effectively overcome the problem of the conventional 6T SRAM that is likely to have read errors at low operation voltage.

Abstract: The present invention provides a Schmitt trigger-based FinFET static random access memory (SRAM) cell, which is an 8-FinFET structure. A FinFET has the functions of two independent gates. The new SRAM cell uses only 8 FinFET per cell, compared with the 10-FinFET structure in previous works. As a result, the cell structure of the present invention can save chip area and raise chip density. Furthermore, this new SRAM cell can effectively solve the conventional problem that the 6T SRAM cell is likely to have read errors at a low operating voltage.

Abstract: The present invention provides a Schmitt trigger-based FinFET static random access memory (SRAM) cell, which is an 8-FinFET structure. A FinFET has the functions of two independent gates. The new SRAM cell uses only 8 FinFET per cell, compared with the 10-FinFET structure in previous works. As a result, the cell structure of the present invention can save chip area and raise chip density. Furthermore, this new SRAM cell can effectively solve the conventional problem that the 6T SRAM cell is likely to have read errors at a low operating voltage.

Abstract: A method of controlling gate formation of semiconductor devices includes determining the correlation between the step heights of isolation structures and the over-etching time by measuring step heights of isolation structures, determining an over-etching time based on the step heights, and etching gates using the over-etching time. The method may include an after-etching-inspection to measure the gate profile and fine-tune the gate formation control. Within-wafer uniformity can also be improved by measuring the step height uniformity on a wafer and adjusting gate formation processes.

Abstract: A method for controlling a critical dimension in an etched structure comprises the steps of: forming a hard mask above a substrate, measuring a critical dimension of the hard mask, and using the measured hard mask critical dimension to control a critical dimension trim operation performed on a circuit trace above the substrate.