Patents by Inventor Ping Chiang
Ping Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250141135Abstract: An electrical connector includes: an insulating housing comprising a mating slot; a row of lower terminals arranged along a first direction and located at a lower side of the mating slot, each of the lower terminals including a fixing portion, an elastic arm, a soldering portion, the row of lower terminals including plural pairs of first signal terminals, plural pairs of second signal terminals, and plural grounding terminals, the pairs of first signal terminals and the pairs of second signal terminals being arranged alternately with each other and being separated by the grounding terminals; and a row of upper terminals located at an upper side of the mating slot, wherein, viewed in the first direction, the first signal terminals are aligned with each other, the second signal terminals are aligned with each other, and the second signal terminals protrude deeper into the mating slot than the first signal terminals.Type: ApplicationFiled: October 25, 2024Publication date: May 1, 2025Inventors: QIN-XIN CAO, Hung-Cheng LIAO, Hsuan-Ping CHIANG
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Patent number: 12266847Abstract: Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure. The semiconductor chip has a sensing surface. The redistribution layer structure is arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.Type: GrantFiled: December 24, 2023Date of Patent: April 1, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yung-Ping Chiang, Chao-Wen Shih, Shou-Zen Chang, Albert Wan, Yu-Sheng Hsieh
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Patent number: 12205888Abstract: Semiconductor packages and methods of forming the same are disclosed. An semiconductor package includes two dies, an encapsulant, a first metal line and a plurality of dummy vias. The encapsulant is disposed between the two dies. The first metal line is disposed over the two dies and the encapsulant, and electrically connected to the two dies. The plurality of dummy vias is disposed over the encapsulant and aside the first metal line.Type: GrantFiled: August 1, 2023Date of Patent: January 21, 2025Assignee: Taiwan Semiconductor Manufacturing Company, LtdInventors: Ching-Yu Huang, Han-Ping Pu, Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang, Yu-Sheng Hsieh
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Patent number: 12183833Abstract: A flash memory device is provided. The flash memory device includes a substrate, a first dielectric layer, a second dielectric layer, a third dielectric layer, a first polycrystalline silicon layer and a second polycrystalline silicon layer. The first dielectric layer is formed on the substrate located in a first region of a peripheral region, the second dielectric layer is formed on the substrate located in a second region of the peripheral region, and the third dielectric layer is formed on the substrate located in an array region. A bottom surface of the third dielectric layer is lower than a bottom surface of the second dielectric layer. The first polycrystalline silicon layer is formed on the first and the second dielectric layers. The second polycrystalline silicon layer is formed on the third dielectric layer.Type: GrantFiled: February 4, 2022Date of Patent: December 31, 2024Assignee: Winbond Electronics Corp.Inventors: Cheng-Ta Yang, Lu-Ping Chiang
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Patent number: 12181495Abstract: A test device includes a power compensation module and a test module. The power compensation module receives AC power generated by a device under test to generate DC power to the device under test. The test module provides a plurality of test signals and a test mode to the device under test for testing the device under test.Type: GrantFiled: December 5, 2022Date of Patent: December 31, 2024Assignee: QUANTA COMPUTER INC.Inventors: Wei-Chih Hung, Ying-Ping Chiang, Yu-Ren Ruan, Chia-Hao Wu
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Publication number: 20240422912Abstract: An electronic device is provided. The electronic device includes a first substrate, a second substrate and a third substrate. The first substrate has a first trace layer, which defines a first trace width. The second substrate has a second trace layer and stacked under the first substrate. The second substrate defines a first surface connecting to the first substrate and a second surface opposite to the first surface. The second trace layer is formed on either or both of the first and second surfaces and defines a second trace width. The third substrate is stacked under the second substrate and connected to the second surface. The third substrate has a third trace layer, which defines a third trace width. At least a partial of the second trace width is no greater than both of the first trace width and the third trace width.Type: ApplicationFiled: June 14, 2024Publication date: December 19, 2024Inventor: Sheng-Ping CHIANG
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Publication number: 20240413171Abstract: An electronic device includes a flexible substrate, a conductive pattern layer, at least one transistor and at least one guarding portion. The transistor electrically connects the conductive pattern layer. The transistor includes an active layer, a source electrode and a drain electrode electrically connected to the active layer, at least one gate electrode, and an insulation layer disposed between the active layer and the gate electrode. The active layer defines a channel portion, which defines a gated channel overlapped with the gate electrode in a projection direction perpendicular to the flexible substrate. The gated channel defines a plurality of edges coherent to the first direction. The guarding portion is arranged under the transistor and overlaps at least one of the edges of the gated channel in the projection direction perpendicular to the flexible substrate. The Young's modulus of the flexible substrate is less than that of the guarding portion.Type: ApplicationFiled: June 7, 2024Publication date: December 12, 2024Inventor: Sheng-Ping CHIANG
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Publication number: 20240400986Abstract: This disclosure relates generally to membrane-bound compositions, in particular exophers having a diameter between 1 and 20 microns induced from human cells, and uses thereof.Type: ApplicationFiled: September 15, 2022Publication date: December 5, 2024Inventors: Michael Ka Chun Wong, Anna Pensalfini, David Barry Kolesky, Kyle Ping Chiang, Rakshita Anilkanth Charan
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Patent number: 12159092Abstract: Implementations of the present disclosure provide coloring methods that sort and pre-color nodes of G0-linked networks in a multiple-patterning technology (MPT)-compliant layout design by coordinate. In one embodiment, a method includes identifying target networks in a circuit layout, each target network having two or more linked nodes representing circuit patterns, and each target network being presented in an imaginary X-Y coordinate plane, assigning a first feature to a first node in each target network, the first node is determined using a coordinate-based method, and assigning the first feature and a second feature to remaining nodes in each target network in an alternating manner so that any two immediately adjacent linked nodes in each target network have different features.Type: GrantFiled: July 26, 2023Date of Patent: December 3, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chia-Ping Chiang, Ming-Hui Chih, Chih-Wei Hsu, Ping-Chieh Wu, Ya-Ting Chang, Tsung-Yu Wang, Wen-Li Cheng, Hui En Yin, Wen-Chun Huang, Ru-Gun Liu, Tsai-Sheng Gau
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Publication number: 20240387359Abstract: Semiconductor packages and methods of forming the same are disclosed. An semiconductor package includes two dies, an encapsulant, a first metal line and a plurality of dummy vias. The encapsulant is disposed between the two dies. The first metal line is disposed over the two dies and the encapsulant, and electrically connected to the two dies. The plurality of dummy vias is disposed over the encapsulant and aside the first metal line.Type: ApplicationFiled: July 28, 2024Publication date: November 21, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ching-Yu Huang, Han-Ping Pu, Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang, Yu-Sheng Hsieh
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Publication number: 20240387454Abstract: A memory device including a first semiconductor die and a memory cube mounted on and connected with the first semiconductor die is described. The memory cube includes multiple stacked tiers, and each tier of the multiple stacked tiers includes second semiconductor dies laterally wrapped by an encapsulant and a redistribution structure disposed on the second semiconductor dies and the encapsulant. The second semiconductor dies of the multiple stacked tiers are electrically connected with the first semiconductor die through the redistribution structures in the multiple stacked tiers.Type: ApplicationFiled: July 26, 2024Publication date: November 21, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ching-Yu Huang, Han-Ping Pu, Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang, Yu-Sheng Hsieh
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Patent number: 12148735Abstract: A memory device including a first semiconductor die and a memory cube mounted on and connected with the first semiconductor die is described. The memory cube includes multiple stacked tiers, and each tier of the multiple stacked tiers includes second semiconductor dies laterally wrapped by an encapsulant and a redistribution structure disposed on the second semiconductor dies and the encapsulant. The second semiconductor dies of the multiple stacked tiers are electrically connected with the first semiconductor die through the redistribution structures in the multiple stacked tiers.Type: GrantFiled: April 19, 2022Date of Patent: November 19, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ching-Yu Huang, Han-Ping Pu, Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang, Yu-Sheng Hsieh
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Publication number: 20240128635Abstract: Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure. The semiconductor chip has a sensing surface. The redistribution layer structure is arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.Type: ApplicationFiled: December 24, 2023Publication date: April 18, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yung-Ping Chiang, Chao-Wen Shih, Shou-Zen Chang, Albert Wan, Yu-Sheng Hsieh
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Patent number: 11929319Abstract: Integrated fan-out packages and methods of forming the same are disclosed. An integrated fan-out package includes two dies, an encapsulant, a first metal line and a plurality of dummy vias. The encapsulant is disposed between the two dies. The first metal line is disposed over the two dies and the encapsulant, and electrically connected to the two dies. The plurality of dummy vias is disposed over the encapsulant and aside the first metal line.Type: GrantFiled: July 22, 2021Date of Patent: March 12, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ching-Yu Huang, Han-Ping Pu, Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang, Yu-Sheng Hsieh
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Publication number: 20240069067Abstract: A test device includes a power compensation module and a test module. The power compensation module receives AC power generated by a device under test to generate DC power to the device under test. The test module provides a plurality of test signals and a test mode to the device under test for testing the device under test.Type: ApplicationFiled: December 5, 2022Publication date: February 29, 2024Inventors: Wei-Chih HUNG, Ying-Ping CHIANG, Yu-Ren RUAN, Chia-Hao WU
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Patent number: 11855333Abstract: Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure. The semiconductor chip has a sensing surface. The redistribution layer structure is arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.Type: GrantFiled: July 26, 2022Date of Patent: December 26, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yung-Ping Chiang, Chao-Wen Shih, Shou-Zen Chang, Albert Wan, Yu-Sheng Hsieh
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Publication number: 20230378058Abstract: Semiconductor packages and methods of forming the same are disclosed. An semiconductor package includes two dies, an encapsulant, a first metal line and a plurality of dummy vias. The encapsulant is disposed between the two dies. The first metal line is disposed over the two dies and the encapsulant, and electrically connected to the two dies. The plurality of dummy vias is disposed over the encapsulant and aside the first metal line.Type: ApplicationFiled: August 1, 2023Publication date: November 23, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ching-Yu Huang, Han-Ping Pu, Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang, Yu-Sheng Hsieh
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Publication number: 20230367942Abstract: Implementations of the present disclosure provide coloring methods that sort and pre-color nodes of G0-linked networks in a multiple-patterning technology (MPT)-compliant layout design by coordinate. In one embodiment, a method includes identifying target networks in a circuit layout, each target network having two or more linked nodes representing circuit patterns, and each target network being presented in an imaginary X-Y coordinate plane, assigning a first feature to a first node in each target network, the first node is determined using a coordinate-based method, and assigning the first feature and a second feature to remaining nodes in each target network in an alternating manner so that any two immediately adjacent linked nodes in each target network have different features.Type: ApplicationFiled: July 26, 2023Publication date: November 16, 2023Inventors: Chia-Ping CHIANG, Ming-Hui CHIH, Chih-Wei HSU, Ping-Chieh WU, Ya-Ting CHANG, Tsung-Yu WANG, Wen-Li CHENG, Hui En YIN, Wen-Chun HUANG, Ru-Gun LIU, Tsai-Sheng GAU
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Patent number: 11790145Abstract: Implementations of the present disclosure provide coloring methods that sort and pre-color nodes of G0-linked networks in a multiple-patterning technology (MPT)-compliant layout design by coordinate. In one embodiment, a method includes identifying target networks in a circuit layout, each target network having two or more linked nodes representing circuit patterns, and each target network being presented in an imaginary X-Y coordinate plane, assigning a first feature to a first node in each target network, the first node is determined using a coordinate-based method, and assigning the first feature and a second feature to remaining nodes in each target network in an alternating manner so that any two immediately adjacent linked nodes in each target network have different features.Type: GrantFiled: June 29, 2022Date of Patent: October 17, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chia-Ping Chiang, Ming-Hui Chih, Chih-Wei Hsu, Ping-Chieh Wu, Ya-Ting Chang, Tsung-Yu Wang, Wen-Li Cheng, Hui En Yin, Wen-Chun Huang, Ru-Gun Liu, Tsai-Sheng Gau
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Publication number: 20230317645Abstract: A package structure is provided. The package structure includes a dielectric structure and an antenna structure disposed in the dielectric structure. The package structure also includes a semiconductor device disposed on the dielectric structure and a protective layer surrounding the semiconductor device. The package structure further includes a conductive feature electrically connecting the semiconductor device and the antenna structure. A portion of the antenna structure is between the conductive feature and the dielectric structure.Type: ApplicationFiled: June 5, 2023Publication date: October 5, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yung-Ping CHIANG, Yi-Che CHIANG, Nien-Fang WU, Min-Chien HSIAO, Chao-Wen SHIH, Shou-Zen CHANG, Chung-Shi LIU, Chen-Hua YU