Abstract: A method for selective metallization includes: selectively adsorbing catalytic nanoparticles onto an imprint mold to form a selectively adsorbed catalytic nanoparticle (SACN) mold; using the SACN mold in an imprinting process to synchronously transfer a pattern and the catalytic nanoparticles onto a film; separating the film from the SACN mold; and selectively depositing metal onto the film based on the pattern transferred to the film.

Abstract: A method for manufacturing a semiconductor package structure includes providing a semiconductor chip, encapsulating the semiconductor chip via a package body, the package body having a first surface opposite to a second surface, and coating a first self-assembled monolayer (SAM) over the first surface and the second surface of the package body.

Abstract: A method for manufacturing a semiconductor package structure includes providing a semiconductor chip, encapsulating the semiconductor chip via a package body, the package body having a first surface opposite to a second surface, and coating a first self-assembled monolayer (SAM) over the first surface and the second surface of the package body.

Abstract: A method for selective metallization includes: selectively adsorbing catalytic nanoparticles onto an imprint mold to form a selectively adsorbed catalytic nanoparticle (SACN) mold; using the SACN mold in an imprinting process to synchronously transfer a pattern and the catalytic nanoparticles onto a film; separating the film from the SACN mold; and selectively depositing metal onto the film based on the pattern transferred to the film.

Abstract: A distributed feedback (DFB) semiconductor laser device includes an active layer, a first grating layer and a second grating. The first grating layer has a first grating structure with a first grating period. The second grating layer has a second grating structure with a second grating period substantially different from the first grating period. The active layer, the first grating layer and the second grating layer are vertically stacked, and the equivalent grating period of the DFB semiconductor laser device is (2×P1×P2)/(P1+P2), where P1 and P2 respectively represent the first grating period and the second grating period.

Abstract: A coach apparatus and a cooperative operation controlling method for a coach-driven multi-robot cooperative operation system are provided. The coach apparatus connects with a plurality of action robots and receives state space data from each action robot. The coach apparatus divides the action robots into a plurality of action group. The coach apparatus reduces the state space data of the action robots in each action group to generate reduced state space data of each action group, and trains and builds a cooperative model based on the reduced state space data. In addition, for each action group, the coach apparatus selects a group strategy based on the reduced state space data, and transmits the cooperative model and the group strategy to the action robots in the action group to make them carry out an action mission according to the cooperative model and the group strategy.

Abstract: A semiconductor device includes a semiconductor element, a trace disposed adjacent to a surface of the semiconductor element, a bonding pad disposed adjacent to the surface of the semiconductor element and connected to the trace, and a pillar disposed on the bonding pad. The pillar includes a first end wall, a second end wall opposite the first end wall, a first side wall, and a second side wall opposite the first side wall. The first side wall and the second side wall connect the first end wall to the second end wall. One or both of the first side wall and the second side wall incline inwardly from the first end wall to the second end wall. The pillar is disposed on the bonding pad such that the first end wall is closer to the trace than is the second end wall.

Abstract: A waterproof module includes a frame, a sliding member, a ring-shaped sealing member, a cover and an adjusting member. The frame has an accommodating recess. The sliding member is disposed in the accommodating recess and has a tapered structure. An end of the tapered structure is between the frame and the ring-shaped sealing member. The cover is disposed on the frame. The adjusting member is connected to the sliding member. When the adjusting member drives the sliding member to move within the accommodating recess towards a first direction, the tapered structure pushes the ring-shaped sealing member to move towards a second direction, wherein the first direction is different from the second direction.

Abstract: An episode mining method that includes the steps outlined below is provided. Real-time operation parameters are retrieved. At least one incremental candidate pattern in every incremental time period is generated, wherein the incremental candidate pattern is an incremental episode including a set of events of the real-time operation parameters and having an incremental occurrence frequency larger than an incremental threshold. At least one batch candidate pattern in every batch time period is generated, wherein the batch candidate pattern is a batch episode including a set of events of the real-time operation parameters within the batch time period and having a batch occurrence frequency larger than a batch threshold. At least one newly-add candidate episode is determined from the incremental candidate pattern and the batch candidate pattern having an occurrence frequency larger than a determine threshold. At least one detection rule is generated based on the newly-add candidate episode.

Abstract: A semiconductor package includes a filler composition, wherein the filler composition includes particles each including both carbon and silica, wherein the filler composition is substantially devoid of alumina or silicon carbide, and the filler composition has a weight ratio of carbon to silica of at least greater than 1.0.

Abstract: Provided is a display panel including a first substrate, a second substrate placed opposite to the first substrate, and at least one detector placed between the first substrate and the second substrate; each of the at least one detector includes a photosensitive portion located at a side of the first substrate facing the second substrate, and an accommodation portion located between the photosensitive portion and the second substrate, the accommodation portion includes an accommodation space and an opening facing the photosensitive portion; when distance between the first and second substrates changes, an proportion of the photosensitive portion accommodated in the accommodation portion changes so that light received by the photosensitive portion changes; when the photosensitive portion senses change of the light received, a resistance value of the photosensitive portion changes, and then the photosensitive portion outputs a different sensing signal.

Abstract: A semiconductor device includes a semiconductor element, a trace disposed adjacent to a surface of the semiconductor element, a bonding pad disposed adjacent to the surface of the semiconductor element and connected to the trace, and a pillar disposed on the bonding pad. The pillar includes a first end wall, a second end wall opposite the first end wall, a first side wall, and a second side wall opposite the first side wall. The first side wall and the second side wall connect the first end wall to the second end wall. One or both of the first side wall and the second side wall incline inwardly from the first end wall to the second end wall. The pillar is disposed on the bonding pad such that the first end wall is closer to the trace than is the second end wall.

Abstract: A therapy system includes an elastic cord extending from a first end to a second end; a first fastener secured to the first end; a second fastener secured to the second end, the second fastener is configured to secure to the first fastener; a first elastic ball having a first channel extending through a first thickness of the first elastic ball; and a second elastic ball having a second channel extending through a second thickness of the second elastic ball.

Abstract: Provided is a display panel including a first substrate, a second substrate placed opposite to the first substrate, and at least one detector placed between the first substrate and the second substrate; each of the at least one detector includes a photosensitive portion located at a side of the first substrate facing the second substrate, and an accommodation portion located between the photosensitive portion and the second substrate, the accommodation portion includes an accommodation space and an opening facing the photosensitive portion; when distance between the first and second substrates changes, an proportion of the photosensitive portion accommodated in the accommodation portion changes so that light received by the photosensitive portion changes; when the photosensitive portion senses change of the light received, a resistance value of the photosensitive portion changes, and then the photosensitive portion outputs a different sensing signal.

Abstract: A semiconductor device includes a semiconductor element, a trace disposed adjacent to a surface of the semiconductor element, a bonding pad disposed adjacent to the surface of the semiconductor element and connected to the trace, and a pillar disposed on the bonding pad. The pillar includes a first end wall, a second end wall opposite the first end wall, a first side wall, and a second side wall opposite the first side wall. The first side wall and the second side wall connect the first end wall to the second end wall. One or both of the first side wall and the second side wall incline inwardly from the first end wall to the second end wall. The pillar is disposed on the bonding pad such that the first end wall is closer to the trace than is the second end wall.

Abstract: The present disclosure provides a system and a method of adjusting data collection frequency. the system includes a server, a gateway and a sensor. The gateway is communicated with the server for data transmission. The sensor is configured to transmit the sensor data to the gateway, wherein the gateway transmits the sensor data to the server based on a first frequency, and is triggered to transmit the sensor data and a historical sensor data based on a second frequency in case the server or the gateway detects an alert event when processing the sensor data, wherein the historical sensor data is related to the alert event, so that the server analyzes the historical sensor data to get a diagnostics on the alert event, wherein the second frequency is higher than the first frequency.

Abstract: An electrical connecting assembly is provided, including a male connector and a female connector corresponding to the male connector. The male connector has a first insulating body and a conductive member protruding from the insulating body. The female connector has a second insulating body, a hollow conductive seat, a resilient element, and sliding unit. The second insulating body has an opening portion and a chamber for receiving the conductive member. The conductive seat is disposed in the chamber, the sliding unit is movably disposed in the conductive seat, and the resilient element connects the sliding unit to the conductive seat. Specifically, the internal diameter of the opening portion is shorter than the internal diameter of the conductive seat, and the resilient element forces the sliding unit to move to the opening portion, so that the sliding unit forms a seal with the opening portion.

Abstract: An assembled exercise device is provided and includes two or more detachable assembly units, the two assembly units are adjacent and combined to each other by their plug structure and socket structure, each assembly unit has an inner tube and one or more foam rings surrounded thereon, the edge of the inner tube forms a flange, so that the foam rings surrounding on each assembly unit can be positioned between two flanges, each of the outermost assembly units is assembled with a tube cap; while practicing the present invention, the length can be adjusted by changing the number of the assembly units, and the overall diameter can be adjusted as well by selecting the foam rings having different diameters to be used, so as to be applied to users with different body types. In addition, the inner space formed by the connected assembly units can be utilized for storing stuffs such as bottle waters or towels, thereby enhancing the convenience.

Abstract: A semiconductor package includes a substrate, a semiconductor chip and a heat dissipation structure. The semiconductor chip includes a first surface, a second surface opposite to the first surface, and at least one chip pad disposed adjacent to the first surface. The chip pad is electrically connected to the substrate. The heat dissipation structure is disposed adjacent to the second surface of the semiconductor chip and a portion of the substrate. An area of the heat dissipation structure is greater than an area of the semiconductor chip.

Abstract: An episode mining method that includes the steps outlined below is provided. Real-time operation parameters are retrieved. At least one incremental candidate pattern in every incremental time period is generated, wherein the incremental candidate pattern is an incremental episode including a set of events of the real-time operation parameters and having an incremental occurrence frequency larger than an incremental threshold. At least one batch candidate pattern in every batch time period is generated, wherein the batch candidate pattern is a batch episode including a set of events of the real-time operation parameters within the batch time period and having a batch occurrence frequency larger than a batch threshold. At least one newly-add candidate episode is determined from the incremental candidate pattern and the batch candidate pattern having an occurrence frequency larger than a determine threshold. At least one detection rule is generated based on the newly-add candidate episode.