Abstract: A semiconductor device includes a first circuit layer, a copper pillar disposed adjacent to the first circuit layer, a second circuit layer and a solder layer. The second circuit layer includes an electrical contact and a surface finish layer disposed on the electrical contact, wherein a material of the surface finish layer is a combination of at least two of nickel, gold, and palladium. The solder layer is disposed between the copper pillar and the surface finish layer. The solder layer includes a first intermetallic compound (IMC) and a second IMC, wherein the first IMC includes a combination of two or more of copper, nickel and tin, and the second IMC includes a combination of gold and tin, a combination of palladium and tin, or both.

Abstract: A semiconductor package structure includes a substrate, a semiconductor element, an encapsulant, an adhesion layer and a metal cap. The semiconductor element is disposed on the substrate. The encapsulant covers the semiconductor element. The adhesion layer is disposed on the encapsulant. The metal cap is attached to the encapsulant by the adhesion layer, and the metal cap is conformal with the encapsulant.

Abstract: A semiconductor package structure includes a substrate, a semiconductor element, an encapsulant, an adhesion layer and a metal cap. The semiconductor element is disposed on the substrate. The encapsulant covers the semiconductor element. The adhesion layer is disposed on the encapsulant. The metal cap is attached to the encapsulant by the adhesion layer, and the metal cap is conformal with the encapsulant.

Abstract: An output terminal for a vehicle AC generator is provided. The output terminal comprises: a bolt and a cylinder nut. The bolt has outer threads and is inserted through a through hole of a rectifier unit. The cylinder nut has inner threads, which engage with the outer threads of the bolt so that the cylinder nut surrounds the outer circumference of the bolt and fixes the bolt to the rectifier unit. The cylinder nut has a recess in its outer circumference. An insulating sleeve may be provided on the output terminal. The insulating sleeve has at least an internal protrusion for being received in and engaged with the recess of the cylinder nut.

Abstract: A method for coating a non-metal object with a metallic layer may include steps of manufacturing a polyurethane (PU) leather with a metallic surface; attaching a composite material to a surface of the PU leather with the metallic surface; and molding. Comparing with conventional coating techniques such as oil injection and electroplating, the present invention is advantageous because the manufacturing process is simple to lower the manufacturing cost, and also the manufactured product is abrasive and bending-resistance, as well as crease-resistant. Furthermore, since each of the upper cavity and the lower cavity communicates with the gas vent, the pressure inside the mold can be well-maintained during the molding process thereby preventing the molding product from defect causing by excessive pressure.

Abstract: A plugging structure applied to an electronic device for detachably electrically connecting to a main unit is disclosed. The electronic device comprises a housing. The plugging structure comprises a cover and a circuit board. The cover plate has two transfer ports, and two transmitting ports are listed in the cover. The circuit board is disposed between the cover and the housing, and the circuit board connects to these transmitting ports.

Abstract: A semiconductor device includes a semiconductor element, a trace disposed adjacent to a surface of the semiconductor element, a bonding pad disposed adjacent to the surface of the semiconductor element and connected to the trace, and a pillar disposed on the bonding pad. The pillar includes a first end wall, a second end wall opposite the first end wall, a first side wall, and a second side wall opposite the first side wall. The first side wall and the second side wall connect the first end wall to the second end wall. One or both of the first side wall and the second side wall incline inwardly from the first end wall to the second end wall. The pillar is disposed on the bonding pad such that the first end wall is closer to the trace than is the second end wall.

Abstract: An output terminal for a vehicle AC generator is provided. The output terminal comprises: a bolt and a cylinder nut. The bolt has outer threads and is inserted through a through hole of a rectifier unit. The cylinder nut has inner threads, which engage with the outer threads of the bolt so that the cylinder nut surrounds the outer circumference of the bolt and fixes the bolt to the rectifier unit. The cylinder nut has a recess in its outer circumference. An insulating sleeve may be provided on the output terminal. The insulating sleeve has at least an internal protrusion for being received in and engaged with the recess of the cylinder nut.

Abstract: The present invention relates to a rectifier unit of an AC generator for a vehicle. The rectifier unit comprises: a connection unit, a positive cooling fin and a negative cooling fin. The positive cooling fin is coupled to a first portion of the connection unit. The negative cooling fin comprises two separate negative cooling members. Each of the two negative cooling members is coupled to a second portion of the connection unit. The first portion of the connection unit and the second portion of the connection unit are of a different height. The connection unit is disposed above the positive cooling fin, and the positive cooling fin is disposed above the negative cooling fin.

Abstract: A supporting module includes a frame, a support and a rod. The frame includes a main portion, a first fastening portion and an elastic arm. The main portion has a groove. The first fastening portion and the elastic arm are disposed close to an end of the groove, and the first fastening portion and the elastic arm are disposed in the groove, wherein the first side and the second side are opposite to each other. The support has a first connection portion pivoted on the frame, and a second connection portion. The rod includes a bar portion, a pivotal portion and a movable portion. The pivotal portion and the movable portion are disposed on the bar portion. The pivotal portion is pivoted on the second connection portion. The movable portion is slidable in the groove, and the movable portion includes a second fastening portion.

Abstract: The present disclosure relates to bump structures and a semiconductor device and semiconductor device package having the same. The semiconductor device includes a body, at least one conductive metal pad and at least one metal pillar. The body includes a first surface. The at least one conductive metal pad is disposed on the first surface. Each metal pillar is formed on a corresponding conductive metal pad. Each metal pillar has a concave side wall and a convex side wall opposite the first concave side wall, and the concave side wall and the convex side wall are orthogonal to the corresponding conductive metal pad.

Abstract: The present disclosure provides a system and a method of adjusting data collection frequency. the system includes a server, a gateway and a sensor. The gateway is communicated with the server for data transmission. The sensor is configured to transmit the sensor data to the gateway, wherein the gateway transmits the sensor data to the server based on a first frequency, and is triggered to transmit the sensor data and a historical sensor data based on a second frequency in case the server or the gateway detects an alert event when processing the sensor data, wherein the historical sensor data is related to the alert event, so that the server analyzes the historical sensor data to get a diagnostics on the alert event, wherein the second frequency is higher than the first frequency.

Abstract: A conductive base for illuminating building blocks has a base plate, an anode conductive component, and a cathode conductive component. The base plate further has a plurality of hollow studs. The anode conductive component and the cathode conductive component electrically connect to an external power supply. The anode conductive component and the cathode conductive component are projected out of recesses of the hollow studs to contact circuit boards of illuminating building blocks stacked on the base plate and then build electric connections. The neighboring illuminating building blocks stacked on the base plate can emit light together by the above base plate without intricate circuits.

Abstract: The present disclosure relates to a filler composition for a semiconductor package. The filler composition comprises carbon and silica.

Abstract: An electronic device with a flexible assembly, comprising a housing, a positioning assembly and a flexible display, is provided. The housing comprises a first cover plate, a second cover plate and a flexible assembly. The flexible assembly is bendably connected to the first and second cover plates, so that the first cover plate closes on the second cover plate or opens to a limit angle with respect to the second cover plate and then stops. The positioning assembly is disposed on the housing for positioning the first cover plate, the flexible assembly and the second cover plate in an open state or a closed state. When the first cover plate opens to the limit angle with respect to the second cover plate, the positioning assembly prevents the first cover plate from rotating in a reverse direction with respect to the second cover plate.

Abstract: A plugging structure applied to an electronic device for detachably electrically connecting to a main unit is disclosed. The electronic device comprises a housing. The plugging structure comprises a cover and a circuit board. The cover plate has two transfer ports, and two transmitting ports are listed in the cover. The circuit board is disposed between the cover and the housing, and the circuit board connects to these transmitting ports.

Abstract: A 2D/3D switchable display device including a display panel and a switch unit is provided. The display panel includes a first substrate, a second substrate and a display unit located between the first and second substrates. The first substrate includes a first surface and a second surface opposite to the first surface, and the display unit is located above the first surface. The switch unit located on the second surface includes a third substrate, a first electrode layer, a second electrode layer and a switchable medium layer between the first and second electrode layers. The second electrode layer is located on the second surface, the first electrode layer is located on the third substrate, and the switchable medium layer and the third substrate are respectively located on two opposite surfaces of the first electrode layer. A manufacturing method of a 2D/3D switchable display device is also provided.

Abstract: A semiconductor device includes a first circuit layer, a copper pillar disposed adjacent to the first circuit layer, a second circuit layer and a solder layer. The second circuit layer includes an electrical contact and a surface finish layer disposed on the electrical contact, wherein a material of the surface finish layer is a combination of at least two of nickel, gold, and palladium. The solder layer is disposed between the copper pillar and the surface finish layer. The solder layer includes a first intermetallic compound (IMC) and a second IMC, wherein the first IMC includes a combination of two or more of copper, nickel and tin, and the second IMC includes a combination of gold and tin, a combination of palladium and tin, or both.

Abstract: According to various aspects, exemplary embodiments are disclosed of shielding apparatus or assemblies including electrically-conductive foam. Also disclosed are exemplary embodiments of methods relating to making shielding apparatus or assemblies including electrically-conductive foam. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate.

Abstract: The present disclosure relates to a semiconductor device and a method for manufacturing the same. The semiconductor device includes a semiconductor die, a semiconductor element and a solder layer. The semiconductor die includes a copper pillar. The semiconductor element includes a surface finish layer, wherein the material of the surface finish layer is a combination of at least two of nickel, gold, and palladium. The solder layer is disposed between the copper pillar and the surface finish layer. The solder layer includes a first intermetallic compound (IMC) and a second IMC, wherein the first IMC includes a combination of at least two of copper, nickel and tin. The second IMC is a combination of gold and tin, a combination of palladium and tin, or both.