Abstract: A flexible circuit board designed for chip integration is provided. The flexible circuit board includes an insulating substrate, a conductive copper layer, a first tin layer, a second tin layer, and a first solder resist layer. The first tin layer has a first tin thickness, and the second tin layer has a greater second tin thickness. A first tin surface of the first tin layer and a second tin surface of the second tin layer are substantially level.

Abstract: A semiconductor structure and a manufacturing method are provided. The semiconductor structure includes a first substrate having a first side and a second side opposite to the first side, wherein the first side includes a recess recessed from the first side; a first semiconductor die arranged in the recess and bonded to the first side of the first substrate; a second semiconductor die bonded to the second side of the first substrate; a second substrate electrically bonded to the first side of the first substrate; a plurality of conductive vias positioned along the second substrate and extending through the second substrate; and a plurality of conductive lines positioned on the second substrate.

Abstract: Provided is a coil carrier board, including a base coil layer, a conductive layer stacked on and bonded to the base coil layer, at least one build-up coil layer stacked on and bonded to the conductive layer, and an opening connecting the base coil layer, the conductive layer and the build-up coil layer. The coil carrier board has thick copper, fine line spacing and appropriate rigidity by means of the build-up circuit process and the structural design of the insulating layer of a photosensitive dielectric material bonded with a thermosetting dielectric material. Accordingly, the high current-carrying efficiency of the coil carrier board is enhanced, and the overall structure of the coil carrier board has better flatness, rigidity and high interlayer alignment accuracy, thereby facilitating miniaturization and automated assembly production.

Abstract: The present application discloses a semiconductor device and a method for fabricating the same. The semiconductor device includes a first substrate including a front side and a back side; a first passivation layer over the front side; a second passivation layer over the back side and having a top surface; a conductive feature in the first passivation layer; a through substrate via (TSV) penetrating through the second passivation layer and the first substrate and electrically coupled to the conductive feature; and a polymer liner between the TSV and the first substrate, wherein the polymer liner has a top surface lower than the top surface of the second passivation layer; a barrier layer between the second passivation layer and the TSV, between the polymer liner and the TSV, and between the interconnect structure and the TSV; and an adhesion layer between the barrier layer and the TSV.

Abstract: The present application discloses a semiconductor device and a method for fabricating the same. The semiconductor device includes a first substrate including a front side and a back side; a first passivation layer over the front side; a second passivation layer over the back side and having a top surface; a conductive feature in the first passivation layer; a through substrate via (TSV) penetrating through the second passivation layer and the first substrate and electrically coupled to the conductive feature; and a polymer liner between the TSV and the first substrate, wherein the polymer liner has a top surface lower than the top surface of the second passivation layer; a barrier layer between the second passivation layer and the TSV, between the polymer liner and the TSV, and between the interconnect structure and the TSV; and an adhesion layer between the barrier layer and the TSV.

Abstract: A semiconductor structure and a manufacturing method are provided. The semiconductor structure includes a first substrate having a first side and a second side opposite to the first side, wherein the first side includes a recess recessed from the first side; a first semiconductor die arranged in the recess and bonded to the first side of the first substrate; a second semiconductor die bonded to the second side of the first substrate; a second substrate electrically bonded to the first side of the first substrate; a plurality of conductive vias positioned along the second substrate and extending through the second substrate; and a plurality of conductive lines positioned on the second substrate.

Abstract: A brush roller structure includes a foam body, a central channel, a microporous area, and through holes. The foam body comprises flow channels formed by interlaced pores, and the pores have an average pore diameter ranging from 300 ?m to 500 ?m. The central channel is arranged in the foam body and communicates with the flow channels. The microporous area is located on the surface of the foam body, and has micro pores, and the diameter of the micro pores is smaller than the average diameter of the pores in the foam body. The through holes are arranged on the outer surface of the foam body, wherein the depth of the through holes is between 50 ?m and 300 ?m, and the ratio of the total area of the through holes to the outer surface of the foam body is between 10% and 90%.

Abstract: Disclosed is a central shaft of cleaning roller, including a shaft body and a hollow inner flow channel disposed in the shaft body, and a plurality of dispersed through holes fluidly-communicable with the hollow inner flow channel arranged on an outer wall of the shaft body, and a plurality of groove structures radially extending around the surface of the outer wall of the shaft body, and the groove structures have protruding end edges protruding from the surface of the outer wall. The central shaft of cleaning roller can be used to provide better adhesion for an interface between a foam material and the outer wall thereof.

Abstract: Printed circuit board assemblies (PCBAs) are a fundamental component used in nearly all electronics. PCBAs provide electrical connections and mechanical support to electronic components and are generally made of copper layers laminated onto, though, and/or between one or more non-conductive substrate layers. Press-fit pin connections are often driven through the non-conductive substrate layers to connect power or ground across multiple conductive copper layers within a PCBA and/or connect electronic components on opposing sides of the substrate layer(s). Some new PCBA designs utilize fewer, but larger contact pins (e.g., power pins) in place of a greater number of smaller contact pins. With larger contact pin sizes, press-fit pin connections become more difficult to achieve with repeatable reliability in electrical connection without damaging surrounding features in a PCBA.

Abstract: Compositions and methods for increasing recovery, or flowback, of hydrocarbon compounds from hydrocarbon-containing subterranean oil formations. Concentrates include a sulfonated and/or a sulfated surfactant, an alkoxylated alcohol surfactant, a coupling agent, a hydrotrope, an additional surfactant, and water. Injectate compositions for oil recovery include the concentrate and a water source such as a produced water and/or seawater. Inclusion of particular hydrotropes such as sodium xylene sulfonate and/or potassium toluene phosphate in the compositions provides higher yields of hydrocarbons recovered. Larger amounts of hydrotrope result in an increase in injectate interfacial tension, but also result, as judged by decreased turbidity, in improved compatibility of the surfactant system in injectates made with water sources comprising salts.

Abstract: An inner lead structure of a flexible circuit board includes a flexible substrate, a circuit layer and a dummy circuit layer. A chip mounting area defined on the flexible substrate is provided for a chip, contacting locations defined within the chip mounting area are provided for conductive elements of the chip. The circuit layer includes inner leads, ends of the inner leads are arranged on the contacting locations and provided to be electrically connected to the conductive elements. At least one of first dummy lines of the dummy circuit layer is arranged in a space between the adjacent inner leads. The space having a distance greater than 50 um is divided into multiple spaces having distances not greater than 50 um. Proportion of the spaces without the first dummy lines and having a distance greater than 50 um is less than 0.5% in all spaces.

Abstract: A flip-chip packaging substrate and a method for fabricating the same are disclosed. The method includes stacking a plurality of insulating layers having conductive posts in a manner that the conductive posts are stacked on and in contact with one another. The insulating layers and the conductive posts serve as a core layer structure of the flip-chip packaging substrate. As such, the conductive posts having small-sized end surfaces can be fabricated according to the practical need. Therefore, when the thickness of the core layer structure is increased, the present disclosure not only increases the rigidity of the flip-chip packaging substrate so as to avoid warping, but also ensures the design flexibility of the small-sized end surfaces of the conductive posts, allowing high-density electrical connection points and fine-pitch and high-density circuit layers to be fabricated on the core layer structure.

Abstract: A layout structure of a flexible circuit board includes a flexible substrate, a circuit layer and a dummy circuit layer which are arranged on the flexible substrate. The circuit layer includes first inner leads, second inner leads, an inverted U-shape connection line and a horizontal inner lead. A first distance between the first inner leads is less than a second distance between the second inner leads. One of dummy leads of the dummy circuit layer is located between the first and second inner leads, another dummy lead is located between the second inner leads. The dummy leads are provided to allow lead spaces on both sides of the inverted U-shape connection line is the same. Thus, etching solution will not flow laterally in an etching space between the inverted U-shape connection line and the horizontal inner lead.

Abstract: A key scanning method and an input device thereof are provided. The key scanning method for an input device with at least a first key group and a subsidiary key group comprises: triggering a first main scan line electrically connected to the first key group and reading electrical signals received via a plurality of signal sensing lines electrically connected to the first key group to determine whether any said key among the first key group is triggered; and triggering a non-triggered one of a plurality of subsidiary scan lines electrically connected to the subsidiary key group and reading electrical signals received via another plurality of signal sensing lines electrically connected to the subsidiary key group to determine whether any said key among the subsidiary key group is triggered, wherein the first main scan line and the subsidiary scan lines are triggered one after another for multiple times.

Abstract: A brush roller and its manufacturing method and brush roller mold is provided, the brush roller is manufactured by foaming a gaseous pore filler, while solving the problem of using a solid pore filler foaming method to manufacture the brush roller. In addition, the brush roller of the present invention has a plurality of fluid channels communicating between any adjacent two, and the plurality of fluid channels respectively extend to the surface of the brush roller to form pores to improve the fluid permeability of the brush roller, and in the brush roller manufacturing method of the present invention, after the PVA emulsified solution is cured, the compressive stress under the condition of the predetermined compression ratio can be formed to meet the expected brush roller, and it can be used to brush the circuit substrate.

Abstract: A coil winding machine is adapted for winding a conductive flat wire onto an iron core. The coil winding machine includes a base, a tension mechanism mounted on the base and adapted for delivering the flat wire and providing tension to the flat wire, a rotary mechanism mounted on the base and including a core base that is rotatable and that is adapted to be mounted with the iron core, and at least one clamping mechanism mounted on the base, being co-rotatable with the core base, and operable for abutting the flat wire tightly against the iron core. A tension provided by the tension mechanism, a pressure provided by the clamping mechanism, and a rotational speed of the core base correspond to one another such that rotation of the core base and the at least one clamping mechanism winds the flat wire onto the iron core.

Abstract: An inductance structure is provided and includes a plurality of inductance traces embedded in an insulating body and at least one shielding layer that is embedded in the insulating body and free from being electrically connected to the inductance traces. The shielding layer has a plurality of line segments that are free from being connected to one another. The shielding layer shields the inductance traces to improve the inductance value and quality factor.

Abstract: An inductor structure is provided. A plurality of first and second conductive posts have end surfaces corresponding in profile to ends of first conductive sheets, respectively. As such, the profiles of the end surfaces of the first and second conductive posts are non-cylindrical so as to increase the contact area between the first conductive sheets and the first and second conductive posts, thereby improving the conductive quality and performance of the inductor. Further, since the first and second conductive posts are formed by stacking a plurality of post bodies on one another, the number and cross-sectional area of loops are increased so as to increase the inductance value. A method for fabricating the inductor structure, an electronic package and a fabrication method thereof, and a method for fabricating a packaging carrier are further provided.

Abstract: An antenna module is provided, in which an antenna supporting substrate having a step-shaped hollow cavity is disposed on a circuit structure having an antenna part, so that the antenna part is exposed from the step-shaped hollow cavity, and an antenna structure is arranged on the steps of the step-shaped hollow cavity to cover the antenna part and is electromagnetically coupled with the antenna part, and there is no barrier but an air medium between the antenna structure and the antenna part.

Abstract: A chemical liquid supply equipment includes a casing, a connection module and a chemical drum rotating and conveying module. The casing has a chemical drum accommodating room, the connection module is installed in the chemical drum accommodating room of the casing, and the chemical drum rotating and conveying module is also installed in the chemical drum accommodating room of the casing to transport a chemical drum into the chemical drum accommodating room, and the chemical drum is rotated to align with the connecting module.