Abstract: A method for forming a resistive random access memory includes forming a layer stack, patterning the layer stack to form a plurality of stack structures, forming a protection layer along sidewalls of the plurality of stack structures, forming a first isolation structure between the plurality of stack structures, forming at least one recess in at least one stack structure to define a plurality of filament units, and forming a second isolation structure in the at least one recess. The layer stack includes a bottom electrode and a resistive switching layer on the bottom electrode.

Abstract: A resistive random access memory is provided. The resistive random access memory includes a bottom electrode over a substrate, a top electrode, a resistance-switching layer, an oxygen exchange layer, and a sidewall protective layer. The top electrode is disposed over the bottom electrode. The resistance-switching layer is disposed between the bottom electrode and the top electrode. The oxygen exchange layer is disposed between the resistance-switching layer and the top electrode. The sidewall protective layer containing metal or semiconductor is disposed at sidewalls of the resistance-switching layer, and the sidewalls of the resistance-switching layer is doped with the metal or semiconductor from the sidewall protective layer.

Abstract: A memory device including a plurality of memory units; at least one geometric mean operator coupled to at least two of the plurality of memory units; and a memory state reader coupled to the at least one geometric mean operator to read a memory state of the plurality of memory units.

Abstract: A resistive memory including a storage array, a storage circuit, a control circuit, a voltage generation circuit and an access circuit is provided. The storage array includes a plurality of blocks. Each block includes a plurality of memory cells. The storage circuit stores a plurality of count values. Each of the count values indicates the number of times that a corresponding block performs a write operation. The control circuit generates a control signal according to the count values when an external command is a write command. The voltage generation circuit provides an operation voltage group according to the control signal. The access circuit accesses the storage array according to the operation voltage group.

Abstract: A joint compound container includes a plurality of metal plates connected with each other to form a trench-shaped body having an opening facing upwardly. The trench-shaped body has an outer surface and an inner surface. Melted layer are formed on edges of connecting portions of each of the metal plates. A thickness of each of the melted layers is reduced from the outer surface toward the inner surface, and the melted layers are not exceeding out of the inner surface. The metal plates are connected with each other through the melted layers. Hence, the joint compound received in the container can be scraped out from the container smoothly along the inner surface of the container. Hence, the trench-shaped body of the joint compound container can have great sealing property, and the efficiency in performing the tasks can be greatly improved.

Abstract: A method of forming a one-time-programmable resistive random access memory bit includes forming a resistive switching layer on a bottom electrode layer. The method also includes forming a top electrode layer on the resistive switching layer. The method also includes applying a forming voltage to the resistive switching layer, such that the electric potential of the top electrode layer is lower than that of the bottom electrode layer. The method also includes performing a bake process on the resistive switching layer. The vacancies in the resistive switching layer are randomly distributed.

Abstract: A resistive memory and a resistance window recovery method for a resistive memory cell thereof are provided. During a first period, an over reset voltage difference is applied between a top electrode and a bottom electrode of the resistive memory cell, wherein the over reset voltage difference falls in a reset complementary switching (reset-CS) voltage range of the resistive memory cell. During a second period, a set voltage difference is applied between the top electrode and the bottom electrode of the resistive memory cell to increase a compliance current of the resistive memory cell. During a third period, a reset operation is performed on the resistive memory cell.

Abstract: A joint compound container includes a plurality of metal plates connected with each other to form a trench-shaped body having an opening facing upwardly. The trench-shaped body has an outer surface and an inner surface. Melted layer are formed on edges of connecting portions of each of the metal plates. A thickness of each of the melted layers is reduced from the outer surface toward the inner surface, and the melted layers are not exceeding out of the inner surface. The metal plates are connected with each other through the melted layers. Hence, the joint compound received in the container can be scraped out from the container smoothly along the inner surface of the container. Hence, the trench-shaped body of the joint compound container can have great sealing property, and the efficiency in performing the tasks can be greatly improved.

Abstract: A power on reset method for a resistive memory storage device is provided and includes performing a forming procedure on a memory cell of the resistive memory storage device. The forming procedure includes applying at least one forming voltage and at least one reset voltage to the memory cell. The forming procedure further includes a thermal step. The step of applying at least one reset voltage to the memory cell may be preformed before or after the thermal step. After one forming voltage is applied, if the memory cell passes verification, the next forming voltage is not applied to the memory cell. After the thermal step, if the memory cell passes verification, the next forming voltage is not applied to the memory cell. In addition, after one reset voltage is applied, if the memory cell passes verification, the next reset voltage is not applied to the memory cell.

Abstract: A method of forming a one-time-programmable resistive random access memory bit includes forming a resistive switching layer on a bottom electrode layer. The method also includes forming a top electrode layer on the resistive switching layer. The method also includes applying a forming voltage to the resistive switching layer, such that the electric potential of the top electrode layer is lower than that of the bottom electrode layer. The method also includes performing a bake process on the resistive switching layer. The vacancies in the resistive switching layer are randomly distributed.

Abstract: A synapse system is provided which includes three transistors and a resistance-switching element arranged between two neurons. The resistance-switching element has a resistance value and it is arranged between two neurons. A first transistor is connected between the resistance-switching element and one of the neurons. A second transistor and a third transistor are arranged between the two neurons, and are connected in series which interconnects with the gate of the first transistor. A first input signal is transmitted from one of the neurons to the other neuron through the first transistor. A second input signal is transmitted from one of the neurons to the other neuron through the second transistor and the third transistor. The resistance value of the resistance-switching element is changed based on the time difference between the first input signal and the second input signal.

Abstract: A forming method of a resistive memory device is provided. The forming method includes: conducting a forming procedure to apply a forming voltage to the resistive memory device such that the resistive memory device changes from a high resistive state to a low resistive state and measuring a first current of the resistive memory device; performing a thermal step on the resistive memory device and measuring a second current of the resistive memory device; and comparing the second current to the first current and determining to apply a first voltage signal or a second voltage signal to the resistive memory device or to finish the forming procedure according to a comparison result of the first current and the second current. In addition, a memory storage apparatus including a resistive memory device is also provided.

Abstract: A resistive memory apparatus and a setting method for a resistive memory cell thereof are provided. The setting method includes: performing a first setting operation on the resistive memory cell, and performing a first verifying operation on the resistive memory cell after the first setting operation is finished; determining whether to perform a first resetting operation on the resistive memory cell according to a verifying result of the first verifying operation, and performing a second verifying operation on the resistive memory cell after the first resetting operation is determined to be performed and is finished; and determining whether to perform a second resetting operation on the resistive memory cell according to a verifying result of the second verifying operation, and performing a third verifying operation on the resistive memory cell after the second resetting operation is determined to be performed and is finished.

Abstract: A resistive memory apparatus and a setting method for a resistive memory cell thereof are provided. The setting method includes: performing a first setting operation on the resistive memory cell, and performing a first verifying operation on the resistive memory cell after the first setting operation is finished; determining whether to perform a first resetting operation on the resistive memory cell according to a verifying result of the first verifying operation, and performing a second verifying operation on the resistive memory cell after the first resetting operation is determined to be performed and is finished; and determining whether to perform a second resetting operation on the resistive memory cell according to a verifying result of the second verifying operation, and performing a third verifying operation on the resistive memory cell after the second resetting operation is determined to be performed and is finished.

Abstract: A resistive memory and a resistance window recovery method for a resistive memory cell thereof are provided. During a first period, an over reset voltage difference is applied between a top electrode and a bottom electrode of the resistive memory cell, wherein the over reset voltage difference falls in a reset complementary switching (reset-CS) voltage range of the resistive memory cell. During a second period, a set voltage difference is applied between the top electrode and the bottom electrode of the resistive memory cell to increase a compliance current of the resistive memory cell. During a third period, a reset operation is performed on the resistive memory cell.

Abstract: A resistive random access memory is provided. The resistive memory cell includes a substrate, a transistor on the substrate, a bottom electrode on the substrate and electrically connected to the transistor source/drain, several top electrodes on the bottom electrode, several resistance-switching layers between the top and bottom electrode, and several current limiting layers between the resistance-switching layer and top electrodes. The cell could improve the difficulty on recognizing 1/0 signal by current at high temperature environment and save the area on the substrate by generating several conductive filaments at one transistor location.

Abstract: A data read method and a non-volatile memory apparatus using the same are provided. The data read method includes: obtaining a first read current and a second read current from a memory cell pair of the non-volatile memory; performing a calculation operation according to the first read current and the second read current to obtain a calculation result; and determining a logical state of the memory cell pair according to the calculation result. The calculation operation includes at least a signal addition operation and a signal multiplying operation.

Abstract: A resistive random access memory is provided. The resistive random access memory includes a bottom electrode over a substrate, a top electrode, a resistance-switching layer, an oxygen exchange layer, and a sidewall protective layer. The top electrode is disposed over the bottom electrode. The resistance-switching layer is disposed between the bottom electrode and the top electrode. The oxygen exchange layer is disposed between the resistance-switching layer and the top electrode. The sidewall protective layer containing metal or semiconductor is disposed at sidewalls of the resistance-switching layer, and the sidewalls of the resistance-switching layer is doped with the metal or semiconductor from the sidewall protective layer.

Abstract: A resistive random access memory is provided. The resistive random access memory includes a bottom electrode, a top electrode, a resistance-switching layer, an oxygen exchange layer, and a sidewall protective layer. The bottom electrode is disposed over a substrate. The top electrode is disposed over the bottom electrode. The resistance-switching layer is disposed between the bottom electrode and the top electrode. The oxygen exchange layer is disposed between the resistance-switching layer and the top electrode. The sidewall protective layer as an oxygen supply layer is at least disposed at sidewalls of the oxygen exchange layer.