Abstract: The invention relates to wearable devices for sensing gestures. A watch, which is a wearable device, includes an ultrasonic system that has an ultrasonic transducer and one or more sensors and measures the location of a finger on the back of the user's hand. Using the ultrasonic system, it is possible to use the back of the hand as an extension to the screen display of the watch. The watch can be used as a motion detector and interface with various types of mobile devices, such as computerized eyeglass. The watch can also function as a generic input mechanism for various types of devices, such as tablet, TV, or laptop computer, where these devices are coupled to the watch via a suitable communication system, such as Bluetooth® interconnection system.

Abstract: A communications control system is disclosed that includes a serial communications interface and a parallel communications interface for coupling a plurality of input/output modules with a control module. The serial communications interface is configured for connecting the plurality of input/output modules to the control module in parallel to transmit information between the plurality of input/output modules and the control module, and the parallel communications interface is configured for separately connecting the plurality of input/output modules to the control module to transmit information between the plurality of input/output modules and the control module, and to transmit information between individual ones of the plurality of input/output modules. The serial communications interface may comprise a multidrop bus, and the parallel communications interface may comprise a cross switch.

Abstract: A multimedia method comprises establishing a peer connection and data channel between a local browser running on a local user device and a remote browser running on a remote user device, performing a series of remote object handling cycles, and performing a series of local object handling cycles. The local user device includes a display screen showing a conference webpage according to the local browser, the conference webpage including an object viewing window and an object tracking window. The remote object handling cycles deal with remote file objects, such as text documents and images, received from the remote user device. The local object handling cycles deal with local file objects, such as other text documents and images, sent to the remote user device.

Abstract: A nanopore cell may include a well having a working electrode at a bottom of the well. The well may be formed within a dielectric layer, where the sidewalls of the well may be formed of the dielectric or other materials coating the walls of the dielectric layer. Various materials having different hydrophobicity and hydrophilicity can be used to provide desired properties of the cell. The nanopore in the nanopore cell can be inserted in a membrane formed over the well. Various techniques can be used for providing a desired shape and other properties e.g., of materials and processes for forming the well.

Abstract: A communications control system is disclosed that includes a serial communications interface and a parallel communications interface for coupling a plurality of in modules with a control module. The serial communications interface is configured for connecting the plurality of input/output modules to the control module in parallel to transmit information between the plurality of input/output modules and the control module, and the parallel communications interface is configured for separately connecting the plurality of input/output modules to the control module to transmit information between the plurality of input/output modules and the control module, and to transmit information between individual ones of the plurality of input/output modules. The serial communications interface may comprise a multidrop bus, and the parallel communications interface may comprise across switch.

Abstract: Light sensors are described that include a trench structure integrated therein. In an implementation, the light sensor includes a substrate having a dopant material of a first conductivity type and multiple trenches disposed therein. The light sensor also includes a diffusion region formed proximate to the multiple trenches. The diffusion region includes a dopant material of a second conductivity type. A depletion region is created at the interface of the dopant material of the first conductivity type and the dopant material of the second conductivity type. The depletion region is configured to attract charge carriers to the depletion region, at least substantially a majority of the charge carriers generated due to light incident upon the substrate.

Abstract: A sensor package can have a reference thermopile sensor and a reference temperature sensor disposed therein to determine an ambient temperature. In one or more implementations, the sensor package includes a substrate having a substrate surface, a reference thermopile sensor disposed over the substrate surface, a reference temperature sensor disposed over the substrate surface, and a lid assembly disposed over the thermopile sensor and the reference thermopile sensor. The lid assembly includes a structure having a transparent portion that passes electromagnetic radiation occurring in a limited spectrum of wavelengths. The reference thermopile sensor generates a reference thermopile sensor signal representing a difference between a temperature of the substrate surface and a temperature of a lid assembly surface. An external ambient temperature can be determined based upon the reference thermopile sensor signal.

Abstract: A communications control system is disclosed that includes a serial communications interface and a parallel communications interface for coupling a plurality of in modules with a control module. The serial communications interface is configured for connecting the plurality of input/output modules to the control module in parallel to transmit information between the plurality of input/output modules and the control module, and the parallel communications interface is configured for separately connecting the plurality of input/output modules to the control module to transmit information between the plurality of input/output modules and the control module, and to transmit information between individual ones of the plurality of input/output modules. The serial communications interface may comprise a multidrop bus, and the parallel communications interface may comprise across switch.

Abstract: Aspects of the disclosure pertain to a packaging structure configured for providing heterogeneous packaging of electronic components and a process for making same. The packaging structure includes a carrier substrate having a plurality of cavities formed therein. The packaging structure further includes a first die and a second die. The first die is at least substantially contained within a first cavity included in the plurality of cavities. The second die is at least substantially contained within a second cavity included in the plurality of cavities. The first die is fabricated via a first fabrication technology, and the second die is fabricated via a second fabrication technology, the second fabrication technology being different than the first fabrication technology. The packaging structure also includes electrical interconnect circuitry connected to (e.g., for electrically connecting) the first die, the second die and/or the carrier substrate.

Abstract: A communications control system is disclosed that includes a serial communications interface and a parallel communications interface for coupling a plurality of input/output modules with a control module. The serial communications interface is configured for connecting the plurality of input/output modules to the control module in parallel to transmit information between the plurality of input/output modules and the control module, and the parallel communications interface is configured for separately connecting the plurality of input/output modules to the control module to transmit information between the plurality of input/output modules and the control module, and to transmit information between individual ones of the plurality of input/output modules. The serial communications interface may comprise a multidrop bus, and the parallel communications interface may comprise a cross switch.

Abstract: A digital input circuit includes a series connection of a current limiter and a switch having a switch control input coupled between a signal input and ground, and a logic level shifter coupled to the signal input and having a switch control output coupled to the switch control input and a signal output, where a maximum amplitude at the signal input is greater than a maximum amplitude at the signal output. A digital input method includes coupling an input signal to ground with a current limiter by closing an electronic switch, providing an output signal responsive to the input signal, where a maximum amplitude of the input signal is greater than a maximum amplitude of the output signal, by latching the output signal while the input signal is above a threshold voltage and opening the electronic switch after the output signal is latched.

Abstract: A communications control system is disclosed that includes a serial communications interface and a parallel communications interface for coupling a plurality of input/output modules with a control module. The serial communications interface is configured for connecting the plurality of input/output modules to the control module in parallel to transmit information between the plurality of input/output modules and the control module, and the parallel communications interface is configured for separately connecting the plurality of input/output modules to the control module to transmit information between the plurality of input/output modules and the control module, and to transmit information between individual ones of the plurality of input/output modules. The serial communications interface may comprise a multidrop bus, and the parallel communications interface may comprise a cross switch.

Abstract: A temperature measuring device includes a heat plate exposed to the ambient, one or more sensor chips, and one or more device electronics that include a power transmitter, a wireless communication receiving block, and a processor. Each sensor chip includes a wireless communication transmitting block, a temperature sensor, a signal processing block, and an energy harvesting circuit. The heat plate and the sensor chips are positioned within an indent formed in an exposed surface of a device cover, such as a glass cover. The energy harvesting circuit harvests energy from an electromagnetic signal transmitted by the power transmitter. Temperature data sensed by each temperature sensor is wirelessly transmitted by the wireless communication transmitting block to the wireless communication receiving block. The processor determines an ambient temperature corrected for heat influences on the temperature sensors by internal device electronics.

Abstract: A physical unclonable function device, an encryptable electronic device, and a process for fabricating the physical unclonable function device are described. In an implementation, a physical unclonable function device includes an integrated circuit device including an active layer, the active layer including an electrode array with multiple electrodes; and a physical unclonable function coating disposed on the active layer, wherein the physical unclonable function coating includes a physical unclonable material arranged in a random configuration.

Abstract: Various embodiments of the invention allow to take advantage of the natural statistical variation of physical properties in a semiconductor device in order to create truly random, repeatable, and hard to detect cryptographic bits. In certain embodiments, this is accomplished by pairing mismatch values of PUF elements so as to ensure that PUF key bits generated thereform remain insensitive to environmental errors, without affecting the utilization rate of available PUF elements.

Abstract: A communications control system is disclosed that includes a serial communications interface and a parallel communications interface for coupling a plurality of input/output modules with a control module. The serial communications interface is configured for connecting the plurality of input/output modules to the control module in parallel to transmit information between the plurality of input/output modules and the control module, and the parallel communications interface is configured for separately connecting the plurality of input/output modules to the control module to transmit information between the plurality of input/output modules and the control module, and to transmit information between individual ones of the plurality of input/output modules. The serial communications interface may comprise a multidrop bus, and the parallel communications interface may comprise a cross switch.

Abstract: The invention relates to semiconductor devices, and more particularly, to systems, devices and methods of utilizing inherent differences among physical elements in an electrical component to generate unique and non-duplicable numbers that are statistically random and repeatable. These bits may be applied as identifications, random number seeds or encryption keys in many security applications, e.g., a financial terminal. An integrator is coupled to a plurality of physical elements, selects two physical elements or element sets, and generates an integrated difference signal according to a difference between these two physical elements or element sets. A comparison-decision logic further determines whether the difference between the selected two physical elements is associated with a bit of “1” or “0”. In some embodiments, a multi-bit number constitutes multiple bits each of which may be derived from a difference between two randomly selected physical elements or element sets.

Abstract: A temperature measurement footprint device, a mobile temperature measurement device, and a method for determining a temperature measurement footprint are described. In an implementation, a temperature measurement footprint device includes a thermopile configured to measure a temperature of an object; a camera configured to capture an image of the object, the camera disposed proximate to and in communication with the thermopile; and a light source configured to illuminate the object, the light source disposed proximate to and in communication with the thermopile and the camera.

Abstract: The present disclosure is directed to a sensor package having a reference thermopile sensor, and a reference temperature sensor disposed therein to determine an ambient temperature. In one or more implementations, the sensor package includes a substrate having a substrate surface, a reference thermopile sensor disposed over the substrate surface, a reference temperature sensor disposed over the substrate surface, and a lid assembly disposed over the thermopile sensor and the reference thermopile sensor. The lid assembly includes a structure having a transparent portion that passes electromagnetic radiation occurring in a limited spectrum of wavelengths. The reference thermopile sensor generates a reference thermopile sensor signal representing a difference between a temperature of the substrate surface and a temperature of a lid assembly surface. An external ambient temperature can be determined based upon the reference thermopile sensor signal.

Abstract: An assembly process properly positions and align a plurality of first die within a carrier substrate. The first die are positioned within cavities formed in the carrier substrate. The carrier substrate is then aligned with a second substrate having a plurality of second die fabricated therein. The first die and the second die are fabricated using different technologies. Aligning the carrier substrate and the second substrate aligns the first die with the second die. One or more first die can be aligned with each second die. Once aligned, a wafer bonding process is performed to bond the first die to the second die. In some cases, the carrier substrate is removed, leaving behind the first die bonded to the second die of the second substrate. In other cases, the carrier substrate is left in place as a cap. The second substrate is then cut to form die stacks.