Abstract: A liquid air assisted cooling system for cooling a component of an information handling system includes a liquid air assisted cooling module and a baseboard management controller. The baseboard management controller determines a quantity of coolant loss in the liquid air assisted cooling module.

Abstract: A method of repairing a rail wheel including removing a selected segment of a rim of the rail wheel to provide a remaining segment having a first engagement surface, and providing a replacement workpiece including a replacement body element having a second engagement surface formed to mate with the first engagement surface. The replacement workpiece is positioned to define a predetermined gap between the first and second engagement surfaces. One or more heating elements are positioned in the predetermined gap, for induction heating, in a non-oxidizing atmosphere, of first and second heated portions of the remaining segment and the replacement workpiece, and the first and second engagement surfaces, to a hot working temperature, for plastic deformation thereof. The heating elements are removed, and the first and second engagement surfaces are engaged for plastic deformation of at least part of the first and second heated portions and the engagement surfaces.

Abstract: A method for manufacturing an extra low-k (ELK) inter-metal dielectric (IMD) layer includes forming a first IMD layer including a plurality of dielectric material layers over a substrate. An adhesion layer is formed over the first IMD layer. An ELK dielectric layer is formed over the adhesion layer. A protection layer is formed over the ELK dielectric layer. A hard mask is formed over the protection layer and is patterned to create a window. Layers underneath the window are removed to create an opening. The removed layers include the protection layer, the ELK dielectric layer, the adhesion layer, and the first IMD layer. A metal layer is formed in the opening.

Abstract: A system for processing a semiconductor wafer is provided. The system includes a processing tool. The system also includes gas handling housing having a gas inlet and a gas outlet. The system further includes an exhaust conduit fluidly communicating with the processing tool and the gas inlet of the gas handling housing. In addition, the system includes at least one first filtering assembly and at least one second filtering assembly. The first filtering assembly and the second filtering assembly are positioned in the gas handling housing and arranged in a series along a flowing path that extends from the gas inlet to the gas outlet of the gas handling housing. Each of the first filtering assembly and the second filtering assembly comprises a plurality of wire meshes stacked on top of another.

Abstract: The present disclosure describes a semiconductor device with a rare earth metal oxide layer and a method for forming the same. The method includes forming fin structures on a substrate and forming superlattice structures on the fin structures, where each of the superlattice structures includes a first-type nanostructured layer and a second-type nanostructured layer. The method further includes forming an isolation layer between the superlattice structures, implanting a rare earth metal into a top portion of the isolation layer to form a rare earth metal oxide layer, and forming a polysilicon structure over the superlattice structures. The method further includes etching portions of the superlattice structures adjacent to the polysilicon structure to form a source/drain (S/D) opening and forming an S/D region in the S/D opening.

Abstract: A liquid-tight structure includes a stepped fastener having a first shank and a second shank. The stepped fastener is threadingly engaged with an opening that includes a first step and a second step. A first diameter of the first shank is larger than a second diameter of the second shank. The liquid-tight structure includes a first seal seated on and in physical communication with a first top surface of the first step of the opening. The first seal is compressed between a first side of the opening and the first shank. The liquid-tight structure includes a second seal seated on and in physical communication with a second top surface of the second step of the opening. The second seal is compressed between a second side of the opening and the second shank.

Abstract: A method and a system of forming a workpiece assembly including an intermediate element between first and second workpieces. A ring element is included in or on the intermediate element. The ring element is for rotating the intermediate element about the intermediate elements axis. With heating elements positioned between the intermediate element and the first and second ends of the first and second workpieces, portions of the intermediate element and the first and second workpieces are heated to a predetermined hot working temperature, in an inert (non-oxidizing) atmosphere. While the heated portions are at the predetermined hot working temperature, and while the intermediate element is rotated about its axis, one or both of the first and second workpieces are moved axially, to engage the first and second ends with the intermediate element.

Abstract: A representative method includes forming a photo-sensitive material over a substrate, and forming a cap layer over the photo-sensitive material, and patterning the cap layer. Using the patterned cap layer, a first portion of the photo-sensitive material is selectively exposed to a pre-selected light wavelength to change at least one material property of the first portion of the photo-sensitive material, while preventing a second portion of the photo-sensitive material from being exposed to the pre-selected light wavelength. One, but not both of the following steps is then conducted: removing the first portion of the photo-sensitive material and forming in its place a conductive element at least partially surrounded by the second portion of the photo-sensitive material, or removing the second portion of the photo-sensitive material and forming from the first portion of the photo-sensitive material a conductive element electrically connecting two or more portions of a circuit.

Abstract: An example device includes a wireless charging circuit to wirelessly charge a portable electronic device. The device further includes a first photosensor positioned within an effective charging range of the wireless charging circuit, the first photosensor to output a first signal, and a second photosensor positioned outside the effective charging range, the second photosensor to output a second signal. The device further includes a control circuit connected to the wireless charging circuit, the first photosensor, and the second photosensor. The control circuit detects the portable electronic device positioned within the effective charging range of the wireless charging circuit by detecting a difference between the first signal and the second signal. The control circuit turns on the wireless charging circuit in response to detecting the difference. The control circuit turns off the wireless charging circuit in response to detecting that the first signal matches the second signal.

Abstract: A decoding method, a memory storage device, and a memory control circuit unit are disclosed. The method includes: sending at least one read command sequence instructing to read a first physical unit in a rewritable non-volatile memory module; receiving response data from the rewritable non-volatile memory module, wherein the response data includes a plurality of identification bits, and the plurality of identification bits reflect a voltage variation of a first bit line where a first memory cell in the first physical unit is located during a discharge process; determining a decoding parameter corresponding to the first memory cell according to the plurality of identification bits; and decoding data read from the first memory cell according to the decoding parameter.

Abstract: A device and method for blending image data and the alpha channel and reconstructing to obtain the image again after transmission. An encoder blends the alpha channel and the red-green-blue (RGB) image data through a layer blending method that is supported by the general application processor (AP). Transporter image data, such as a checkerboard pattern, is blended with 1-alpha channel data to obtain a transporter. The blended image data (RGB+alpha) is mixed with the transporter to obtain mixed image data. The mixed image data is then transmitted through the existing transmission interface. After receiving the mixed image data, reconstruction processing is performed by a decoder to obtain the original RGB image data and the alpha channel again.

Abstract: A dust-proof telecommunication system is disclosed. The dust-proof telecommunication system includes a chassis, critical components located within the chassis, and a filter module located within the chassis near at least some of the critical components that need to be cooled. For example, the critical components include a central processing unit (CPU), a system on chip (SoC), a memory module, a PCIe card, and/or a chipset. The filter module has a filter cover that surrounds at least in part the critical components, a first air filter located at an inlet of an airflow, and a second air filter located at an outlet. The critical components located at a protective space within the chassis receive and are cooled by the airflow passing through the air filter.

Abstract: A heart rhythm detection method and system by using radar sensor is capable of collecting an original signal using a radar sensor toward at least one subject, and converting the original signal to a two dimensional image information (i.e., spectrogram) using the concept of image vision. Then, the neural network automatically learns which heartbeat frequency should be focused on and which heartbeat frequency should be filtered out in the two dimensional image information through deep learning, so that the heartbeat frequencies can be extracted effectively.

Abstract: An accuracy measurement method of an autonomous mobile vehicle, a calculating device, and an autonomous mobile vehicle are provided. The accuracy measurement method includes a distance calculating step, a regression center calculating step, and an average calculating step. The distance calculating step includes a controlling step, a light beam emitting step, an image capturing step, an image analyzing step, and a converting step. The regression center calculating step is performed after the distance calculating step is repeatedly performed by at least two times. The accuracy measurement method is performed to obtain an X-axis offset in an X-axis direction, a Y-axis offset in a Y-axis direction, and an angle deflection of an autonomous mobile vehicle.

Abstract: An accuracy measurement kit is provided and includes a marker, at least one light beam device, an image capture device, and a processing device. The marker is disposed on an autonomous mobile vehicle, and at least partially includes a reference pattern. The light beam device is configured to emit a light beam to the autonomous mobile vehicle located at a predetermined position so as to form a light spot on the marker. The processing device is configured to capture the light spot the marker on the autonomous mobile vehicle for generating a to-be-analyzed image. The processing device is configured to obtain an offset of the autonomous mobile vehicle in an X-axis direction and a Y-axis direction by calculating images of the to-be-analyzed image corresponding to the reference pattern and the light spot.

Abstract: A device includes a semiconductor fin, and a gate stack on sidewalls and a top surface of the semiconductor fin. The gate stack includes a high-k dielectric layer, a work-function layer overlapping a bottom portion of the high-k dielectric layer, and a blocking layer overlapping a second bottom portion of the work-function layer. A low-resistance metal layer overlaps and contacts the work-function layer and the blocking layer. The low-resistance metal layer has a resistivity value lower than second resistivity values of both of the work-function layer and the blocking layer. A gate spacer contacts a sidewall of the gate stack.

Abstract: A method for manufacturing a semiconductor device includes forming a first fin structure and a second fin structure, wherein an isolation region is located between the fin structures, and wherein a space is located between the fin structures and above the isolation region; depositing a blocking layer over the first fin structure, the isolation region, and the second fin structure, wherein an upper portion of the blocking layer is located above the first fin structure and the second fin structure, and wherein a lower portion of the blocking layer fills the space located between the first fin structure and the second fin structure; removing the upper portion of the blocking layer; and while the lower portion of the blocking layer remains over the isolation region, performing an etch process to recess the first fin structure and the second fin structure.

Abstract: A method of forming a fused rail assembly in which one or more heating elements are positioned in a gap between first and second end faces of aligned first and second rails. The end faces are covered by a non-oxidizing atmosphere, and the heating elements are energized, to heat portions of the first and second rails to a predetermined hot working temperature. While one or more of the first end faces is moving transversely relative to center lines of the rails, and while the heated portions are at the predetermined hot working temperature, the first and second end faces are engaged with each other, to fuse together, forming the fused rail assembly. The transverse motion of the first end face or the second end face or both may commence before or after the first and second end faces are engaged.

Abstract: A method includes forming a stack of channel layers and sacrificial layers over a substrate, patterning the stack to form a fin-shape structure, and recessing a portion of the fin-shape structure to form a recess. A top surface of the substrate under the recess is covered at least by a bottommost sacrificial layer of the stack. The method also includes forming inner spacers on terminal ends of the sacrificial layers that are above the bottommost sacrificial layer, depositing an undoped layer in the recess, and forming a doped epitaxial feature over the undoped layer. The undoped layer covers terminal ends of a bottommost channel layer of the stack. The doped epitaxial feature covers terminal ends of the channel layers that are above the bottommost channel layer.

Abstract: A method and a system of forming a workpiece assembly including an intermediate element between first and second workpieces. A ring element is included in or on the intermediate element. The ring element is for rotating the intermediate element about the intermediate elements axis. With heating elements positioned between the intermediate element and the first and second ends of the first and second workpieces, portions of the intermediate element and the first and second workpieces are heated to a predetermined hot working temperature, in an inert (non-oxidizing) atmosphere. While the heated portions are at the predetermined hot working temperature, and while the intermediate element is rotated about its axis, one or both of the first and second workpieces are moved axially, to engage the first and second ends with the intermediate element.