Abstract: Circuits and methods for limiting cell current or throttling write operation, or both, in resistive random access memory (RRAM or ReRAM) cells are provided. An RRAM cell can include a select transistor and a programmable resistor that can change between a relatively high resistance and a relatively low resistance. The present circuits and methods can reduce or inhibit excess current from being applied to the programmable resistor, which potentially can regulate the resistance of the programmable resistor so as to reduce or inhibit decreases in the resistance of that resistor below the relatively low resistance. Such regulation potentially can improve reliability of the RRAM cell. Additionally, or alternatively, the present circuits and methods can throttle a write operation in an RRAM cell, e.g., can disable current flow through the RRAM cell based on the programmable resistor reaching a pre-defined target resistance, such as the relatively low resistance.

Abstract: The present disclosure provides a semiconductor structure which includes a conductive layer and a resistance configurable structure over the conductive layer. The resistance configurable structure includes a first electrode, a resistance configurable layer over the first electrode, and a second electrode over the resistance configurable layer. The first electrode has a first sidewall, a second sidewall, and a bottom surface on the conductive layer. A joint between the first sidewall and the second sidewall includes an electric field enhancement structure. The present disclosure also provides a method for manufacturing the above semiconductor structure, including patterning a hard mask on a conductive layer; forming a spacer around the hard mask; removing at least a portion of the hard mask; forming a conforming resistance configurable layer on the spacer; and forming a second conductive layer on the conforming resistance configurable layer.

Abstract: Circuits and methods for limiting cell current or throttling write operation, or both, in resistive random access memory (RRAM or ReRAM) cells are provided. An RRAM cell can include a select transistor and a programmable resistor that can change between a relatively high resistance and a relatively low resistance. The present circuits and methods can reduce or inhibit excess current from being applied to the programmable resistor, which potentially can regulate the resistance of the programmable resistor so as to reduce or inhibit decreases in the resistance of that resistor below the relatively low resistance. Such regulation potentially can improve reliability of the RRAM cell. Additionally, or alternatively, the present circuits and methods can throttle a write operation in an RRAM cell, e.g., can disable current flow through the RRAM cell based on the programmable resistor reaching a pre-defined target resistance, such as the relatively low resistance.

Abstract: Circuits and methods for detecting write operation and limiting cell current in resistive random access memory (RRAM or ReRAM) cells are provided. RRAM cells can include a select transistor and a programmable resistor. Current can flow through the programmable resistor responsive to word line voltage VWL applied to the gate of the select transistor and a bit line voltage VBL applied to the source of the select transistor. Responsive to the current, the programmable resistor can change between relatively high and low resistances (“SET”), or between relatively low and high resistances (“RESET”). It can be desirable to accurately characterize the resistance of the programmable resistor, that is, to accurately detect write operations such as SET or RESET. Additionally, it can be undesirable for the current to exceed a certain value (“over-SET”). The present circuits and methods can facilitate detecting write operations or limiting current, or both, in an RRAM cell.

Abstract: A device includes first and second current mirrors electrically connected to reference and cell current sources of a memory array. A first inverter is electrically connected to the first current mirror, and a second inverter is electrically connected to the second current mirror. The first and second inverters are cross-coupled.

Abstract: Circuits and methods for limiting cell current or throttling write operation, or both, in resistive random access memory (RRAM or ReRAM) cells are provided. An RRAM cell can include a select transistor and a programmable resistor that can change between a relatively high resistance and a relatively low resistance. The present circuits and methods can reduce or inhibit excess current from being applied to the programmable resistor, which potentially can regulate the resistance of the programmable resistor so as to reduce or inhibit decreases in the resistance of that resistor below the relatively low resistance. Such regulation potentially can improve reliability of the RRAM cell. Additionally, or alternatively, the present circuits and methods can throttle a write operation in an RRAM cell, e.g., can disable current flow through the RRAM cell based on the programmable resistor reaching a pre-defined target resistance, such as the relatively low resistance.

Abstract: Circuits and methods for limiting cell current or throttling write operation, or both, in resistive random access memory (RRAM or ReRAM) cells are provided. An RRAM cell can include a select transistor and a programmable resistor that can change between a relatively high resistance and a relatively low resistance. The present circuits and methods can reduce or inhibit excess current from being applied to the programmable resistor, which potentially can regulate the resistance of the programmable resistor so as to reduce or inhibit decreases in the resistance of that resistor below the relatively low resistance. Such regulation potentially can improve reliability of the RRAM cell. Additionally, or alternatively, the present circuits and methods can throttle a write operation in an RRAM cell, e.g., can disable current flow through the RRAM cell based on the programmable resistor reaching a pre-defined target resistance, such as the relatively low resistance.

Abstract: Circuits and methods for detecting write operation and limiting cell current in resistive random access memory (RRAM or ReRAM) cells are provided. RRAM cells can include a select transistor and a programmable resistor. Current can flow through the programmable resistor responsive to word line voltage VWL applied to the gate of the select transistor and a bit line voltage VBL applied to the source of the select transistor. Responsive to the current, the programmable resistor can change between relatively high and low resistances (“SET”), or between relatively low and high resistances (“RESET”). It can be desirable to accurately characterize the resistance of the programmable resistor, that is, to accurately detect write operations such as SET or RESET. Additionally, it can be undesirable for the current to exceed a certain value (“over-SET”). The present circuits and methods can facilitate detecting write operations or limiting current, or both, in an RRAM cell.

Abstract: A device is configured to provide low dropout regulation. An amplifier stage includes a first transistor electrically connected to an output of the device, and a second transistor. A current mirror includes a third transistor electrically connected to the second transistor, and a fourth transistor electrically connected to the third transistor. The auxiliary current source has a control terminal electrically connected to a gate electrode of the fourth transistor. The pull down stage includes a fifth transistor having a gate electrode electrically connected to a drain electrode of the first transistor, and a sixth transistor having a gate electrode electrically connected to the gate electrode of the fourth transistor. The pull up transistor has a gate electrode electrically connected to a drain electrode of the fifth transistor. The first capacitor has a first terminal electrically connected to the gate electrode of the first transistor.

Abstract: A device is configured to provide low dropout regulation. An amplifier stage includes a first transistor electrically connected to an output of the device, and a second transistor. A current mirror includes a third transistor electrically connected to the second transistor, and a fourth transistor electrically connected to the third transistor. The auxiliary current source has a control terminal electrically connected to a gate electrode of the fourth transistor. The pull down stage includes a fifth transistor having a gate electrode electrically connected to a drain electrode of the first transistor, and a sixth transistor having a gate electrode electrically connected to the gate electrode of the fourth transistor. The pull up transistor has a gate electrode electrically connected to a drain electrode of the fifth transistor. The first capacitor has a first terminal electrically connected to the gate electrode of the first transistor.

Abstract: A device includes a memory bit cell, a first current source, and a current comparator electrically connected to the memory bit cell and the first current source. A first transistor has a first terminal electrically connected to a first voltage supply node, a control terminal electrically connected to a controller, and a second terminal electrically connected to the memory bit cell and the current comparator. A sense amplifier is electrically connected to the current comparator and a reference current generator.

Abstract: A device includes a memory bit cell, a first current source, and a current comparator electrically connected to the memory bit cell and the first current source. A first transistor has a first terminal electrically connected to a first voltage supply node, a control terminal electrically connected to a controller, and a second terminal electrically connected to the memory bit cell and the current comparator. A sense amplifier is electrically connected to the current comparator and a reference current generator.

Abstract: A device includes first and second current mirrors electrically connected to reference and cell current sources of a memory array. A first inverter is electrically connected to the first current mirror, and a second inverter is electrically connected to the second current mirror. The first and second inverters are cross-coupled.

Abstract: The present disclosure provides resistive random access memory (RRAM) structures and methods of making the same. The RRAM structures include a bottom electrode having protruded step portion that allows formation of a self-aligned conductive path with a top electrode during operation. The protruded step portion may have an inclination angle of about 30 degrees to 150 degrees. Multiple RRAM structures may be formed by etching through a RRAM stack.

Abstract: A device is configured to provide low dropout regulation. An amplifier stage includes a first transistor electrically connected to an output of the device, and a second transistor. A current mirror includes a third transistor electrically connected to the second transistor, and a fourth transistor electrically connected to the third transistor. The auxiliary current source has a control terminal electrically connected to a gate electrode of the fourth transistor. The pull down stage includes a fifth transistor having a gate electrode electrically connected to a drain electrode of the first transistor, and a sixth transistor having a gate electrode electrically connected to the gate electrode of the fourth transistor. The pull up transistor has a gate electrode electrically connected to a drain electrode of the fifth transistor. The first capacitor has a first terminal electrically connected to the gate electrode of the first transistor.

Abstract: The present disclosure provides a semiconductor structure which includes a conductive layer and a resistance configurable structure over the conductive layer. The resistance configurable structure includes a first electrode, a resistance configurable layer over the first electrode, and a second electrode over the resistance configurable layer. The first electrode has a first sidewall, a second sidewall, and a bottom surface on the conductive layer. A joint between the first sidewall and the second sidewall includes an electric field enhancement structure. The present disclosure also provides a method for manufacturing the above semiconductor structure, including patterning a hard mask on a conductive layer; forming a spacer around the hard mask; removing at least a portion of the hard mask; forming a conforming resistance configurable layer on the spacer; and forming a second conductive layer on the conforming resistance configurable layer.

Abstract: A system and method of cooling a three dimensional integrated circuit (3D IC) using at least one thermoelectric cooler which is connected to the 3D IC by a plurality of conductive pillars. In some embodiments a controller controls power supply to the thermoelectric cooler, and a temperature monitor provides a temperature input to the controller. In some embodiments the controller maintains a temperature of a 3D IC within a predetermined range by cycling power to the thermoelectric cooler.

Abstract: A word line boost circuit including a first address transfer detector, a second address transfer detector and a boost operation unit is provided. The first address transfer detector generates a first detection pulse in response to variation of a row address signal. The second address transfer detector generates a second detection pulse in response to variation of a column address signal. Moreover, the boost operation unit generates a selection voltage by using a boost voltage according to the first detection pulse, and determines whether or not to use the boost voltage to generate the selection voltage according to a delay time between the first detection pulse and the second detection pulse.

Abstract: A word line boost circuit including a first address transfer detector, a second address transfer detector and a boost operation unit is provided. The first address transfer detector generates a first detection pulse in response to variation of a row address signal. The second address transfer detector generates a second detection pulse in response to variation of a column address signal. Moreover, the boost operation unit generates a selection voltage by using a boost voltage according to the first detection pulse, and determines whether or not to use the boost voltage to generate the selection voltage according to a delay time between the first detection pulse and the second detection pulse.