Abstract: A flash memory cell includes a rectifying device and a transistor. The rectifying device has an input end coupled to a bit line. The transistor has a charge storage structure. The transistor has a first end coupled to an output end of the rectifying device, the transistor has a second end coupled to a source line, and a control end of the transistor is coupled to a word line.

Abstract: A data recognition apparatus and a recognition method are provided. The data recognition apparatus includes a data augmentation device, a feature extractor, and a comparator. The data augmentation device receives a plurality of target information and performs augmentation on each of the target information to generate a plurality of augmented target information. The feature extractor receives queried information and the augmented target information to extract features of the augmented target information and the queried information to respectively generate a plurality of augmented target feature values and a queried feature value. The comparator generates a recognition result according to the queried feature value and the augmented target feature values.

Abstract: An in-memory computation device and computation method are provided. The in-memory computation device, including a memory cell array, an input buffer, and a sense amplifier, is provided. The memory cell array includes a memory cell block. The memory cell block corresponds to at least one word line, and stores multiple weight values. Memory cells on the memory cell block respectively store multiple bits of each weight value. The input buffer is coupled to multiple bit lines, and respectively transmits multiple input signals to the bit lines. The memory cell array performs a multiply-add operation on the input signals and the weight values to generate multiple first operation results corresponding to multiple bit orders. The sense amplifier adds the first operation results to generate a second operation result according to the bit orders corresponding to the first operation results.

Abstract: A multiplication and addition operation device and a control method thereof are provided. The multiplication and addition operation device includes a feature information filter and an in-memory calculator. The feature information filter records a plurality of designated bits of a plurality of feature information, compares received input information with the designated bits to generate a comparison result, and generates a selected address according to the comparison result. The in-memory calculator records all bits of the feature information, and generates an operation result by performing a multiplication and addition operation on the feature information and the input information according to the selected address.

Abstract: A memory device includes a first bottom electrode, a first memory stack, and a second memory stack. The first bottom electrode has a first portion and a second portion connected to the first portion. The first memory stack is over the first portion of the first bottom electrode. The first memory stack includes a first resistive switching element and a first top electrode over the first resistive switching element. The second memory stack is over the second portion of the first bottom electrode. The second memory stack comprises a second resistive switching element and a second top electrode over the second resistive switching element.

Abstract: A ternary content addressable memory and a memory cell thereof are provided. The ternary content addressable memory cell includes a first transistor and a second transistor. The first transistor has a gate to receive a selection signal. A first end of the first transistor is coupled to a match line. A second end of the first transistor is coupled to a source line. The second transistor has a gate to receive an inverted selection signal. A first end of the second transistor is coupled to the match line. A second end of the second transistor is coupled to the source line. The first and second transistors have charge storage structures.

Abstract: A ternary content addressable memory and a memory cell thereof are provided. The ternary content addressable memory cell includes a first transistor and a second transistor. The first transistor has a gate to receive a selection signal. A first end of the first transistor is coupled to a match line. A second end of the first transistor is coupled to a source line. The second transistor has a gate to receive an inverted selection signal. A first end of the second transistor is coupled to the match line. A second end of the second transistor is coupled to the source line. The first and second transistors have charge storage structures.

Abstract: A memory device includes a first bottom electrode, a first memory stack, and a second memory stack. The first bottom electrode has a first portion and a second portion connected to the first portion. The first memory stack is over the first portion of the first bottom electrode. The first memory stack includes a first resistive switching element and a first top electrode over the first resistive switching element. The second memory stack is over the second portion of the first bottom electrode. The second memory stack comprises a second resistive switching element and a second top electrode over the second resistive switching element.

Abstract: A TCAM comprises a plurality of first search lines, a plurality of second search lines, a plurality of memory cell strings and one or more current sensing units. The memory cell strings comprise a plurality of memory cells. Each of the memory cells is coupled to one of the first search lines and one of the second search lines. The current sensing units, coupled to the memory cell strings. In a search operation, a determination that whether any of the data stored in the memory cell strings matches a data string to be searched is made according to whether the one or more current sensing units detect current from the memory cell strings, or according to the magnitude of the current flowing out from the memory cell strings detected by the one or more current sensing units.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a memory device arranged over an etch stop material over a substrate. The memory device includes a data storage structure disposed between a bottom electrode and a top electrode. A first interconnect via contacts an upper surface of the bottom electrode and a second interconnect via contacts an upper surface of the top electrode. An interconnect wire contacts a top of the first interconnect via. A third interconnect via contacts a bottom of the interconnect wire and extends through the etch stop material to a plurality of lower interconnects below the etch stop material.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a lower inter-level dielectric (ILD) structure surrounding a plurality of lower interconnect layers over a substrate. An etch stop material is disposed over the lower ILD structure. A bottom electrode is arranged over an upper surface of the etch stop material, a data storage structure is disposed on an upper surface of the bottom electrode and is configured to store a data state, and a top electrode is disposed on an upper surface of the data storage structure. A first interconnect via contacts the upper surface the bottom electrode and a second interconnect via contacts the top electrode.

Abstract: A random number generator, a random number generating circuit, and a random number generating method are provided. The random number generating circuit includes the random number generator and executes the random number generating method. The random number generator includes a shift register having N storage elements and a combinational logic circuit. The N storage elements receive a random seed in a static state and repetitively perform a bit shift operation in a plurality of clock cycles. The combinational logic circuit generates an output sequence based on the random seed and a random bitstream received from an external source.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a lower inter-level dielectric (ILD) structure surrounding a plurality of lower interconnect layers over a substrate. An etch stop material is disposed over the lower ILD structure. A bottom electrode is arranged over an upper surface of the etch stop material, a data storage structure is disposed on an upper surface of the bottom electrode and is configured to store a data state, and a top electrode is disposed on an upper surface of the data storage structure. A first interconnect via contacts the upper surface the bottom electrode and a second interconnect via contacts the top electrode.

Abstract: Structures, devices and methods are provided for forming nanowires on a substrate. A first protruding structure is formed on a substrate. The first protruding structure is placed in an electrolytic solution. Anodic oxidation is performed using the substrate as part of an anode electrode. One or more nanowires are formed in the protruding structure. The nanowires are surrounded by a first dielectric material formed during the anodic oxidation.

Abstract: A memory device includes a first bottom electrode, a first memory stack, and a second memory stack. The first bottom electrode has a first portion and a second portion connected to the first portion. The first memory stack is over the first portion of the first bottom electrode. The first memory stack includes a first resistive switching element and a first top electrode over the first resistive switching element. The second memory stack is over the second portion of the first bottom electrode. The second memory stack comprises a second resistive switching element and a second top electrode over the second resistive switching element.

Abstract: A resistive memory includes a semiconductor substrate, a dielectric layer, an insulating layer and a metal electrode layer. The semiconductor substrate has a top surface and a recess extending downwards into the semiconductor substrate from the top surface. The dielectric layer is disposed on the semiconductor substrate and has a first through-hole aligning the recess. The insulating layer is disposed in the first through-hole and the recess. The metal electrode layer is disposed on the insulating layer by which the metal electrode layer is isolated from the semiconductor substrate.

Abstract: Structures, devices and methods are provided for forming nanowires on a substrate. A first protruding structure is formed on a substrate. The first protruding structure is placed in an electrolytic solution. Anodic oxidation is performed using the substrate as part of an anode electrode. One or more nanowires are formed in the protruding structure. The nanowires are surrounded by a first dielectric material formed during the anodic oxidation.

Abstract: Structures, devices and methods are provided for forming nanowires on a substrate. A first protruding structure is formed on a substrate. The first protruding structure is placed in an electrolytic solution. Anodic oxidation is performed using the substrate as part of an anode electrode. One or more nanowires are formed in the protruding structure. The nanowires are surrounded by a first dielectric material formed during the anodic oxidation.

Abstract: A contact hole structure includes a substrate, an interlayer dielectric (ILD), a conductive layer and an insulating capping layer. The ILD is disposed on the substrate and has a first opening. The conductive layer is disposed in the ILD and aligns the first opening. The insulating capping layer has a spacer disposed on a first sidewall of the first opening, wherein the spacer contacts to the conductive layer and defines a second opening in the first opening, so as to expose a portion of the conductive layer.

Abstract: A multi-state memory device includes a first memory element, a second memory element, a first controlling element and a second controlling element. The second memory element has a memory cell structure identical to that of the first memory element and connects to the first memory element in series. The first controlling element is connected to the first memory element either in series or in parallel. The second controlling element has a characteristic value identical to that of the first controlling element and is connected to the second memory element by a connection structure identical to that of the first controlling element. When the first memory element receives a first signal and a second signal through the first controlling element, a first state value and a second state value are generated correspondingly, and the characteristic value is greater than the first state value and less than the second state value.