Abstract: A method includes retrieving a first component information of a secured portion of a package, wherein the first component information is encrypted. The step of retrieving includes decrypting the first component information. A thermal resistance-network (R-network) is generated from the decrypted first component information. A temperature map of the package is generated using the thermal R-network and a second component information of an unsecured portion of the package, wherein the secured portion and the unsecured portion are bonded to each other.

Abstract: A copper interconnect includes a copper layer formed in a dielectric layer, having a first portion and a second portion. A first barrier layer is formed between the first portion of the copper layer and the dielectric layer. A second barrier layer is formed at the boundary between the second portion of the copper layer and the dielectric layer. The first barrier layer is a dielectric layer, and the second barrier layer is a metal oxide layer.

Abstract: A chip-to-chip multi-signaling communication system with common conductive layer, which comprises a first chip, a second chip, and a common conductive layer, is disclosed. The first chip has at least a first metal pad and a second metal pad. The second chip has at least a first metal pad and a second metal pad. The common conductive layer is to a conductive material and glued directly to the first chip and the second chip. Wherein, the first metal pad of the second chip is aligned with the first metal pad of the first chip for receiving the signal from the first metal pad of the first chip through the common conductive layer. The interference generated by other pads of the first and the second chips is suppressed by the design of the pads and the common conductive layer.

Abstract: A chip-to-chip multi-signaling communication system with common conductive layer, which comprises a first chip, a second chip, and a common conductive layer, is disclosed. The first chip has at least a first metal pad and a second metal pad. The second chip has at least a first metal pad and a second metal pad. The common conductive layer is to a conductive material and glued directly to the first chip and the second chip. Wherein, the first metal pad of the second chip is aligned with the first metal pad of the first chip for receiving the signal from the first metal pad of the first chip through the common conductive layer. The interference generated by other pads of the first and the second chips is suppressed by the design of the pads and the common conductive layer.

Abstract: An optical disc drive includes a housing, a disc tray, a connector, a spindle motor, an OPU, a motor drive, and a control circuit. The disc tray may slide into or out of the housing through its opening. The connector is installed on the housing for transmitting host signals to the disc tray. The control circuit is installed on the disc tray for processing the host signals, thereby operating the spindle motor and the OPU accordingly.

Abstract: A copper interconnect includes a copper layer formed in a dielectric layer, having a first portion and a second portion. A first barrier layer is formed between the first portion of the copper layer and the dielectric layer. A second barrier layer is formed at the boundary between the second portion of the copper layer and the dielectric layer. The first barrier layer is a dielectric layer, and the second barrier layer is a metal oxide layer.

Abstract: A driving method includes setting resistances of resistors in three driving circuits according to maximum tolerable currents corresponding to RGB LEDs respectively, using a PWM module to drive the RGB LEDs respectively in turn with a frequency higher than a visual persistence frequency, using a light sensor to detect light generated by the RGB LEDs and to output a detecting signal, and controlling the PWM module to adjust a luminous intensity of at least one LED in the RGB LEDs according to the detecting signal.

Abstract: A projection apparatus comprising a projection module, a driver module, a power circuitry and a casing is provided. The driver module is electrically connected to the projection module. The power circuitry is electrically connected to the driver module and has a first port for connecting to a universal serial bus (USB) port of a computer through a transmission cable. The casing encloses the projection module, the driver module and the power circuitry but exposes a portion of the first port. The projection apparatus is electrically connected to the USB port of the computer, and the power of the projection apparatus is provided through the computer so that an adapter is no longer required. Therefore, the projection apparatus is more convenient to users.

Abstract: A projection device includes a light source for providing a light beam, a light valve device installed on an optical path of the light beam, and a projection lens. The light valve device includes a light valve having an incident surface and a dust-off device. The light beam projects to the incident surface, and the incident surface reflects the light beam to form an image light beam. The dust-off device is installed on the light valve for sealing the incident surface for preventing dust from falling on the light valve. The dust-off device includes a vibrator for removing dust thereon by vibration for preventing dust from affecting the quality of projection images. The projection lens is used for projecting the image light beam out of the projection device.