Patents by Inventor Pradeep Srinivasan

Pradeep Srinivasan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240410999
    Abstract: A frequency-modulated continuous-wave (FMCW) light detection and ranging (LiDAR) system includes an optical source to direct optical beams towards a target object, and a plurality of return signals are returned to the LiDAR system. The LiDAR system includes a reflective optical component to return a portion of the plurality of optical beams along a return path as a local oscillator (LO) signal, a rotating scanning mirror between the optical source and the target object, and a plurality of optical detectors. The plurality of optical detectors receives and consumes the plurality of return signals. The LiDAR system also includes an optical circuit implemented on a photonics chip that include a plurality of photonics couplers. The plurality of photonics couplers produces a plurality of outputs that are combined by the optical circuit. A signal processing system consumes the outputs.
    Type: Application
    Filed: June 8, 2023
    Publication date: December 12, 2024
    Inventors: Ryan Going, Bing Shen, Pradeep Srinivasan
  • Publication number: 20240353544
    Abstract: A LiDAR system includes an optical source to emit an optical beam along a target path towards a target and a reference path and a coherent receiver disposed in the reference path to produce a first mixed signal comprising a first portion of a reference beat signal and a second mixed signal comprising a second portion of the reference beat signal. The LiDAR system further includes a processor to combine the first mixed signal and the second mixed signal to generate a combined reference signal, wherein a negative image of a reference beat frequency signal produced by the optical beam and a local oscillator (LO) signal is suppressed to estimate a phase noise of the optical source to determine at least one of range or velocity information of the target.
    Type: Application
    Filed: July 1, 2024
    Publication date: October 24, 2024
    Inventors: Ryan Wayne Going, Kumar Bhargav Viswanatha, Pradeep Srinivasan, Srikanth Kuthuru
  • Patent number: 12113331
    Abstract: Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes “selective” intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.
    Type: Grant
    Filed: June 16, 2023
    Date of Patent: October 8, 2024
    Assignee: Aeva, Inc.
    Inventors: Zhizhong Tang, Pradeep Srinivasan, Kevin Masuda, Wenjing Liang
  • Publication number: 20240241237
    Abstract: A polarization splitter-rotator (PSR) is described. The PSR having a silicon nitride based waveguide including a first silicon nitride segment comprising a tapered width in a longitudinal direction and a ridge extending in a transverse direction and an adiabatic coupler coupled with the first silicon nitride segment.
    Type: Application
    Filed: March 25, 2024
    Publication date: July 18, 2024
    Inventors: Bing Shen, Kevin Masuda, Brett E. Huff, Pradeep Srinivasan
  • Patent number: 12025750
    Abstract: The LiDAR system includes a coherent receiver disposed in a reference path. The coherent receiver includes a 90° optical hybrid to receive a portion of an optical beam along the reference path and a local oscillator (LO) signal to generate multiple output signals. The coherent receiver includes a first photodetector to receive a first and a second output signal to generate a first mixed signal, and a second photodetector to receive a third and a fourth output signal to generate a second mixed signal. The LiDAR system further includes a processor to combine the first mixed signal and the second mixed signal to generate a combined reference signal. A negative image of a reference beat frequency signal produced by the optical beam and the LO signal is suppressed to estimate a phase noise of the optical source to determine at least one of range or velocity information of the target.
    Type: Grant
    Filed: April 25, 2023
    Date of Patent: July 2, 2024
    Assignee: Aeva, Inc.
    Inventors: Ryan Wayne Going, Kumar Bhargav Viswanatha, Pradeep Srinivasan, Srikanth Kuthuru
  • Patent number: 11940572
    Abstract: A polarization splitter-rotator (PSR) is described. The PSR having a silicon nitride based waveguide to split and rotate an optical beam. The silicon nitride based waveguide having a first silicon nitride segment including a first layer and a second layer coupled with the first layer.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: March 26, 2024
    Assignee: Aeva, Inc.
    Inventors: Bing Shen, Kevin Masuda, Brett E. Huff, Pradeep Srinivasan
  • Patent number: 11921363
    Abstract: An interferometer comprises a plurality of waveguide branches comprising a plurality of bus waveguides and a plurality of photonic resonators. A first waveguide branch of the plurality of waveguide branches comprises a first photonic resonator coupled to a first bus waveguide. The first photonic resonator is disposed to couple and circle a first portion of an optical beam at the first photonic resonator to generate a first phase shift of the first portion of the optical beam, where the first phase shift is the same as a second phase shift of a second photonic resonator coupled to a second bus waveguide. The interferometer forms at least a portion of an in-phase and quadrature (IQ) modulator.
    Type: Grant
    Filed: January 9, 2023
    Date of Patent: March 5, 2024
    Assignee: Aeva, Inc.
    Inventors: Brian J. Roxworthy, Pradeep Srinivasan
  • Publication number: 20240036178
    Abstract: The LiDAR system includes a coherent receiver disposed in a reference path. The coherent receiver includes a 90° optical hybrid to receive a portion of an optical beam along the reference path and a local oscillator (LO) signal to generate multiple output signals. The coherent receiver includes a first photodetector to receive a first and a second output signal to generate a first mixed signal, and a second photodetector to receive a third and a fourth output signal to generate a second mixed signal. The LiDAR system further includes a processor to combine the first mixed signal and the second mixed signal to generate a combined reference signal. A negative image of a reference beat frequency signal produced by the optical beam and the LO signal is suppressed to estimate a phase noise of the optical source to determine at least one of range or velocity information of the target.
    Type: Application
    Filed: April 25, 2023
    Publication date: February 1, 2024
    Inventors: Ryan Wayne Going, Kumar Bhargav Viswanatha, Pradeep Srinivasan, Srikanth Kuthuru
  • Patent number: 11808851
    Abstract: A system including one or more waveguides to receive a first returned reflection having a first lag angle and generate a first waveguide signal, receive a second returned reflection having a second lag angle different from the first lag angle, and generate a second waveguide signal. The system includes one or more photodetectors to generate a first output signal within a first frequency range, and generate, based on the second waveguide signal and a second LO signal, a second output signal within a second frequency range. The system includes an optical frequency shifter (OFS) to shift a frequency of the second LO signal to cause the second output signal to shift from within the second frequency range to within the first frequency range to generate a shifted signal. The system includes a processor to receive the shifted signal to produce one or more points in a point set.
    Type: Grant
    Filed: June 20, 2022
    Date of Patent: November 7, 2023
    Assignee: Aeva, Inc.
    Inventors: Brian J. Roxworthy, Pradeep Srinivasan, Ashwin Samarao
  • Patent number: 11788929
    Abstract: A method of testing a photonics die at the wafer level includes providing a sacrificial waveguide and a grating coupler at least partially in a scribe line between dies of a wafer, performing one or more tests on the dies of the wafer via the sacrificial waveguide and grating coupler in the scribe line, and removing the sacrificial waveguide during separation of the dies of the wafer.
    Type: Grant
    Filed: September 29, 2022
    Date of Patent: October 17, 2023
    Assignee: Aeva, Inc.
    Inventors: Brett E. Huff, Pradeep Srinivasan
  • Patent number: 11789221
    Abstract: An optical sub-assembly includes a diode submount structure, a diode mounted to the diode submount, and a thermoelectric cooler (TEC). The TEC is in thermal contact with the diode, and the diode is positioned between the diode submount structure and the TEC.
    Type: Grant
    Filed: October 5, 2021
    Date of Patent: October 17, 2023
    Assignee: Aeva, Inc.
    Inventors: Zhizhong Tang, Wenjing Liang, Kevin Kinichi Masuda, Pradeep Srinivasan
  • Publication number: 20230327395
    Abstract: Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes “selective” intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.
    Type: Application
    Filed: June 16, 2023
    Publication date: October 12, 2023
    Inventors: Zhizhong Tang, Pradeep Srinivasan, Kevin Masuda, Wenjing Liang
  • Publication number: 20230305245
    Abstract: A method of cooling an optical sub-assembly includes operating a diode mounted to a diode submount structure and cooling the diode with a thermoelectric cooler (TEC) in thermal contact with the diode, wherein the diode is positioned between the diode submount structure and the TEC.
    Type: Application
    Filed: May 22, 2023
    Publication date: September 28, 2023
    Inventors: Zhizhong TANG, Wenjing LIANG, Kevin Kinichi MASUDA, Pradeep SRINIVASAN
  • Patent number: 11768279
    Abstract: A light detection and ranging (LIDAR) system and apparatus including a photonics chip mounted to a substrate, the photonics chip including one or more optical components and one or more electrical components and one or more integrated circuit (IC) chips mounted to the photonics chip to process an electrical signal generated by the one or more optical components and the one or more electrical components, wherein the one or more IC chips are physically separated from the substrate to reduce crosstalk on the LIDAR apparatus.
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: September 26, 2023
    Assignee: Aeva, Inc.
    Inventors: Zhizhong Tang, Pradeep Srinivasan, Bing Shen
  • Patent number: 11720975
    Abstract: Systems and methods for distributing transaction files among accounts corresponding to a physical card. The method includes receiving a transaction file from a transaction processing entity. The transaction file is associated with a physical card. The method also includes identifying at least one purse segment in the transaction file. Each purse segment corresponds to a transaction associated with the physical card. The method further includes, for each of the at least one purse segments, identifying a purse ID corresponding to at least one account associated with the physical card and extracting transaction data from the transaction file corresponding to the purse ID. The method also includes, for each of the at least one purse segments, storing the transaction data corresponding to the purse ID into a distribution file and transmitting the distribution file to an account processing system.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: August 8, 2023
    Assignee: FMR LLC
    Inventors: Thejaswini Srikanta, Jayesh Parab, Pradeep Srinivasan Madhu
  • Patent number: 11715929
    Abstract: Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes “selective” intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.
    Type: Grant
    Filed: May 2, 2022
    Date of Patent: August 1, 2023
    Assignee: Aeva, Inc.
    Inventors: Zhizhong Tang, Pradeep Srinivasan, Kevin Masuda, Wenjing Liang
  • Patent number: 11662444
    Abstract: The LiDAR system includes a coherent receiver disposed in a reference path. The coherent receiver includes a 90° optical hybrid to receive a portion of an optical beam along the reference path and a local oscillator (LO) signal to generate multiple output signals. The coherent receiver includes a first photodetector to receive a first and a second output signal to generate a first mixed signal, and a second photodetector to receive a third and a fourth output signal to generate a second mixed signal. The LiDAR system further includes a processor to combine the first mixed signal and the second mixed signal to generate a combined reference signal to suppress a negative image of a reference beat frequency signal to estimate a phase noise of the optical source to determine range and velocity information of the target.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: May 30, 2023
    Assignee: Aeva, Inc.
    Inventors: Ryan Wayne Going, Kumar Bhargav Viswanatha, Pradeep Srinivasan, Srikanth Kuthuru
  • Publication number: 20230161183
    Abstract: An interferometer comprises a plurality of waveguide branches comprising a plurality of bus waveguides and a plurality of photonic resonators. A first waveguide branch of the plurality of waveguide branches comprises a first photonic resonator coupled to a first bus waveguide. The first photonic resonator is disposed to couple and circle a first portion of an optical beam at the first photonic resonator to generate a first phase shift of the first portion of the optical beam, where the first phase shift is the same as a second phase shift of a second photonic resonator coupled to a second bus waveguide. The interferometer forms at least a portion of an in-phase and quadrature (IQ) modulator.
    Type: Application
    Filed: January 9, 2023
    Publication date: May 25, 2023
    Inventors: Brian J. Roxworthy, Pradeep Srinivasan
  • Publication number: 20230138571
    Abstract: A system including one or more waveguides to receive a first returned reflection having a first lag angle and generate a first waveguide signal, receive a second returned reflection having a second lag angle different from the first lag angle, and generate a second waveguide signal. The system includes one or more photodetectors to generate a first output signal within a first frequency range, and generate, based on the second waveguide signal and a second LO signal, a second output signal within a second frequency range. The system includes an optical frequency shifter (OFS) to shift a frequency of the second LO signal to cause the second output signal to shift from within the second frequency range to within the first frequency range to generate a shifted signal. The system includes a processor to receive the shifted signal to produce one or more points in a point set.
    Type: Application
    Filed: June 20, 2022
    Publication date: May 4, 2023
    Inventors: Brian J. Roxworthy, Pradeep Srinivasan, Ashwin Samarao
  • Publication number: 20230123042
    Abstract: Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes “selective” intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.
    Type: Application
    Filed: May 2, 2022
    Publication date: April 20, 2023
    Inventors: Zhizhong Tang, Pradeep Srinivasan, Kevin Masuda, Wenjing Liang