Abstract: A current crowding reduction technique involving the uniform displacement of vias around a bump is provided. By uniformly arranging vias around the bump on an integrated circuit, current can uniformly flow to and from the bump, effectively leading to reduced current density around the bump. Further, a method for reducing current crowding around a bump using an uniform arrangement of vias around the bump is provided.

Abstract: An integrated circuit having a clock driver connected to a non-peripheral region of a clock grid is provided. Providing interconnect that connect a clock driver to non-peripheral regions the clock grid effectively leads to reduced clock skew due to reduced RC delays from clock grid connection points to components operatively connected to the clock grid. Further, a method for reducing clock skew on a clock grid using a wire tree architecture structure is provided.

Abstract: A lock detect indicator capable of dynamically determining whether a phase locked loop is in lock or out of lock is provided. The lock detect indicator uses pulses on the fast and slow signals generated by a phase-frequency detector of the phase locked loop to determine if the phase locked loop has been continuously trying to speed up or slow down itself for a predefined amount of time, in which case, the lock detect indicator indicates that the phase locked loop is out of lock. Further, a lock detect indicator capable of indicating whether a phase locked loop previously went out of lock is provided. Further, a method for detecting whether a phase locked loop is out of lock or in lock is provided.

Abstract: A 180 degree bump placement layout for an integrated circuit power grid is provided. This layout improves integrated circuit performance and reliability and gives an integrated circuit designer added flexibility and uniformity in designing the integrated circuit. Further, a patterned bump array for a top metal layer of an integrated circuit having a plurality of 180 degree bump placement structures is provided.

Abstract: A 150 degree bump placement layout for an integrated circuit power grid is provided. This layout improves integrated circuit performance and reliability and gives an integrated circuit designer added flexibility and uniformity in designing the integrated circuit. Further, a patterned bump array for a top metal layer of an integrated circuit having a plurality of 150 degree bump placement structures is provided.

Abstract: A phase locked loop design that uses a switch operatively connected to a loop filter capacitor to control a leakage current of the loop filter capacitor is provided. By positioning a switch in series with the loop filter capacitor, the leakage current of the loop filter capacitor may be controlled by switching the switch ‘on’ when a charge pump of the phase locked loop is ‘on’ and switching the switch ‘off’ when the charge pump is ‘off,’ thereby cumulatively reducing the leakage current of the loop filter capacitor throughput the operation of the phase locked loop. Control and reduction of the loop filter capacitor leakage current leads to more reliable and stable phase locked loop behavior.

Abstract: A current crowding reduction technique involving the uniform displacement of vias around a bump is provided. By uniformly arranging vias around the bump on an integrated circuit, current can uniformly flow to and from the bump, effectively leading to reduced current density around the bump. Further, a method for reducing current crowding around a bump using an uniform arrangement of vias around the bump is provided.

Abstract: A transmission gate immune to noise that selectively delivers/draws charge to/from a noisy input node in order to ensure that an output node is not adversely affected by the noise on the input node is provided. Further, an NMOS pass gate immune to noise that delivers charge to a noisy input node in order to ensure that an output node is not adversely affected by the noise on the input node is provided. Further, a PMOS pass gate immune to noise that draws charge from a noisy input node in order to ensure that an output node is not adversely affected by the noise on the input node is provided.

Abstract: A method and apparatus for performing logic operations using dual-edge triggered dynamic logic families is provided. Further, a method for performing logic operations using a self-resetting mechanism within dual-edge triggered dynamic logic blocks is provided. Further, a dual-edge triggered dynamic circuit that maintains a duty cycle of an input signal at its output is provided. Further, a method for providing a buffer mechanism for clock distribution purposes is provided.