Patents by Inventor Pu Wang

Pu Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10928324
    Abstract: A microsecond-scale stimulated Raman spectroscopic imaging system having a light source, such as a laser output that provides two femtosecond laser beams and a modulator to modulate the laser intensity at frequency between about 1 and about 100 megahertz. The system can further include a medium that chirps the two femtosecond beams to generate a spectral focus in a specimen, and a galvo mirror or resonant mirror pair to scan the two femtosecond beams in two dimension on the specimen. An objective lens can focus the two laser beams into a specimen or sample and a resonant delay scanner configured to produce an optical delay to the pair of chirped beams in said specimen and a tuned amplifier or lock-in amplifier can be used to extract the stimulated Raman-signal shift at the aforementioned modulation frequency.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: February 23, 2021
    Inventors: Chien-Sheng Liao, Pu Wang, Ji-Xin Cheng
  • Publication number: 20210043191
    Abstract: Text independent speaker recognition models can be utilized by an automated assistant to verify a particular user spoke a spoken utterance and/or to identify the user who spoke a spoken utterance. Implementations can include automatically updating a speaker embedding for a particular user based on previous utterances by the particular user. Additionally or alternatively, implementations can include verifying a particular user spoke a spoken utterance using output generated by both a text independent speaker recognition model as well as a text dependent speaker recognition model. Furthermore, implementations can additionally or alternatively include prefetching content for several users associated with a spoken utterance prior to determining which user spoke the spoken utterance.
    Type: Application
    Filed: December 2, 2019
    Publication date: February 11, 2021
    Inventors: Pu-sen Chao, Diego Melendo Casado, Ignacio Lopez Moreno, Quan Wang
  • Patent number: 10916450
    Abstract: A method includes forming a release film over a carrier, forming a metal post on the release film, encapsulating the metal post in an encapsulating material, performing a planarization on the encapsulating material to expose the metal post, forming a redistribution structure over the encapsulating material and the metal post, decomposing a first portion of the release film to separate a second portion of the release film from the carrier, and forming an opening in the release film to expose the metal post.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: February 9, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsien-Ju Tsou, Chih-Wei Wu, Pu Wang, Szu-Wei Lu, Ying-Ching Shih, Jing-Cheng Lin
  • Publication number: 20210035977
    Abstract: A semiconductor device is provided in the disclosure, including a substrate, multiple parallel fins protruding from the substrate and isolated by trenches, and a device insulating layer on the trenches between two fins, wherein the trench is provided with a central first trench and two second trenches at both sides of the first trench, and a depth of the first trench is deeper than a depth of the second trench, and the device insulating layer is provided with a top plane, a first trench and a second trench, and the fins protrude from the top plane, and the bottom surface of the second trench is lower than the bottom surface of the first trench.
    Type: Application
    Filed: October 21, 2020
    Publication date: February 4, 2021
    Inventors: Chih-Yi Wang, Tien-Shan Hsu, Cheng-Pu Chiu, Yao-Jhan Wang
  • Publication number: 20210033663
    Abstract: A method of testing an integrated circuit includes connecting a conductive line to a ground voltage. The method further includes directly physically contacting the conductive line with a first conductive structure. The method further includes contacting the conductive line with a second conductive structure different from the first conductive structure. The method further includes supplying a first test voltage to the conductive line through the first conductive structure. The method further includes supplying a second test voltage to the conductive line through the second conductive structure. The method further includes generating a report indicating whether the first conductive structure is capable of carrying the first test voltage based on feedback from a first test circuit connected to the first conductive structure.
    Type: Application
    Filed: October 21, 2020
    Publication date: February 4, 2021
    Inventors: Chewn-Pu JOU, Min-Jer WANG
  • Publication number: 20210013748
    Abstract: An integrated circuit (IC) includes a first circuit layer that includes a first wireless power transfer (WPT) device, a first chip electrically connected to the first circuit layer, and a first tracking circuit disposed in the first chip. The first WPT device may be configured to extract energy from an electromagnetic signal and provide an output voltage. The first tracking circuit may be powered by the output voltage of the first WPT device and may output tracking data in response to an instruction extracted from the electromagnetic signal.
    Type: Application
    Filed: September 9, 2020
    Publication date: January 14, 2021
    Inventors: MIN-JER WANG, CHING-NEN PENG, CHEWN-PU JOU, FENG WEI KUO, HAO CHEN, HUNG-CHIH LIN, HUAN-NENG CHEN, KUANG-KAI YEN, MING-CHIEH LIU, TSUNG-HSIUNG LEE
  • Publication number: 20210008792
    Abstract: An additive manufacturing (AM) system and method configured to fabricate a 3D printed object from a composition is provided. The AM system comprises a vat assembly having a vat, a pump, and a density control reservoir and an AM assembly having a blade system and a build system. The pump system pumps the composition from the vat, having a first and second fluid outlet and at least one perforated outlet extension attached thereto, to the density control reservoir and then back into the vat through an inlet conduit. The at least one perforated outlet extension has a tube attachment mechanism and at least one elongated perforated tube assembly communicating therewith. The blade system has a dispersing blade and cutting blade, dispersing the composition from the inlet conduit toward and throughout a central top level of the composition and cutting a top surface of the composition, respectively.
    Type: Application
    Filed: July 9, 2019
    Publication date: January 14, 2021
    Inventors: Jia Chang Wang, Tseng Pu Yang, Hitesh Dommati
  • Patent number: 10891730
    Abstract: Implementations of the present disclosure include methods, systems, and computer-readable storage mediums for image reconstruction. Actions include receiving an image acquired by an endoscopic system including an optical fiber bundle with multiple optical fibers, each optical fiber being surrounded by cladding, determining in the image fiber core locations corresponding to the optical fibers, reconstructing missing information from the image using interpolation performed in accordance with the fiber core locations, the missing information corresponding to artifacts in the acquired image that result from the cladding, and providing a fiber-pattern removed image, in which the artifacts in the acquired image are removed using the missing information.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: January 12, 2021
    Assignee: University of Southern California
    Inventors: Pu Wang, Francesco Cutrale, Scott E. Fraser
  • Publication number: 20200407174
    Abstract: Provided is a vehicle measurement system for an automatic conveyor. The measurement system includes: an information measurement unit, disposed at a position higher than the ready-for-loading vehicle and including two laser radars: a rear radar and a side radar; a voice prompt unit, configured to send a voice prompt; and a control unit; where when the ready-for-loading vehicle is approaching, the rear radar measures a distance between it and the ready-for-loading vehicle in real time as a predetermined parking distance; when a value of the predetermined parking distance is within a predetermined range, the control unit controls the voice prompt unit to send a voice prompt for parking; and after the ready-for-loading vehicle stops, the information measurement unit measures the distance between the ready-for-loading vehicle and the rear radar, carriage size information, and a deviation angle of a parking position of the ready-for-loading vehicle from the predetermined parking area.
    Type: Application
    Filed: June 26, 2020
    Publication date: December 31, 2020
    Applicant: Hubei University
    Inventors: Zhifeng Zhong, Shihui Wang, Yan Zhang, Jingjing Zhao, Pu Tan, Zhang Jiang, Min Zhou
  • Publication number: 20200413283
    Abstract: According to some embodiments, a method performed by a software defined wide area network (SD-WAN) controller in a SD-WAN network comprising a plurality of aggregation edge routers and a plurality of branch edge routers comprises the following steps.
    Type: Application
    Filed: October 29, 2019
    Publication date: December 31, 2020
    Inventors: Changhong Shen, Yu Zhang, Xiaorong Wang, Pu Duan
  • Publication number: 20200402211
    Abstract: Implementations of the present disclosure include methods, systems, and computer-readable storage mediums for image reconstruction. Actions include receiving an image acquired by an endoscopic system including an optical fiber bundle with multiple optical fibers, each optical fiber being surrounded by cladding, determining in the image fiber core locations corresponding to the optical fibers, reconstructing missing information from the image using interpolation performed in accordance with the fiber core locations, the missing information corresponding to artifacts in the acquired image that result from the cladding, and providing a fiber-pattern removed image, in which the artifacts in the acquired image are removed using the missing information.
    Type: Application
    Filed: November 30, 2018
    Publication date: December 24, 2020
    Inventors: Pu Wang, Francesco Cutrale, Scott E. Fraser
  • Patent number: 10866124
    Abstract: An encoder including an emitter to emit a waveform to a scene including a structure. A receiver to receive the waveform reflected from the scene and to measure phases of the received waveform for a period of time. A memory to store a signal model relating phase measurements of the received waveform with phase parameters, and to store a state model relating the phase parameters with a state of the encoder. Wherein the signal model includes a motion-induced polynomial phase signal (PPS) component and a sinusoidal frequency modulated (FM) component. Wherein the PPS component is a polynomial function of the phase parameters, and wherein the FM component is a sinusoidal function of the phase parameters. A processor to determine the phase parameters using non-linear mapping of the phase measurements on the signal model and to determine the state of the encoder by submitting the phase parameters into the state model.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: December 15, 2020
    Assignees: Mitsubishi Electric Research Laboratories, Inc., Mitsubishi Electric Corporation
    Inventors: Pu Wang, Philip Orlik, Kota Sadamoto, Wataru Tsujita
  • Patent number: 10868011
    Abstract: A semiconductor device is provided in the disclosure, including a substrate, multiple parallel fins protruding from the substrate and isolated by trenches, and a device insulating layer on the trenches between two fins, wherein the trench is provided with a central first trench and two second trenches at both sides of the first trench, and a depth of the first trench is deeper than a depth of the second trench, and the device insulating layer is provided with a top plane, a first trench and a second trench, and the fins protrude from the top plane, and the bottom surface of the second trench is lower than the bottom surface of the first trench.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: December 15, 2020
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chih-Yi Wang, Tien-Shan Hsu, Cheng-Pu Chiu, Yao-Jhan Wang
  • Patent number: 10867937
    Abstract: Disclosed are various embodiments to enhance the security of a circuit design after a global routing of the circuit design and an assignment of wire layers for the circuit design. A tree can be extracted from the circuit design. The tree can include multiple gates and location information for the gates. The tree can be perturbed by moving one or more locations of one or more gates.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: December 15, 2020
    Assignee: Board of Regents, The University of Texas System
    Inventors: Jeyavijayan Rajendran, Jiang Hu, Yujie Wang, Pu Chen
  • Patent number: 10867965
    Abstract: An embodiment is a method including bonding a first die to a first side of an interposer using first electrical connectors, bonding a second die to first side of the interposer using second electrical connectors, attaching a first dummy die to the first side of the interposer adjacent the second die, encapsulating the first die, the second die, and the first dummy die with an encapsulant, and singulating the interposer and the first dummy die to form a package structure.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: December 15, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ying-Ching Shih, Chi-Hsi Wu, Chen-Hua Yu, Chih-Wei Wu, Jing-Cheng Lin, Pu Wang, Szu-Wei Lu
  • Patent number: 10861799
    Abstract: A method includes bonding a second package component to a first package component, bonding a third package component to the first package component, attaching a dummy die to the first package component, encapsulating the second package component, the third package component, and the dummy die in an encapsulant, and performing a planarization process to level a top surface of the second package component with a top surface of the encapsulant. After the planarization process, an upper portion of the encapsulant overlaps the dummy die. The dummy die is sawed-through to separate the dummy die into a first dummy die portion and a second dummy die portion. The upper portion of the encapsulant is also sawed through.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: December 8, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Wei Wu, Li-Chung Kuo, Pu Wang, Ying-Ching Shih, Szu-Wei Lu, Kung-Chen Yeh
  • Patent number: 10854713
    Abstract: A method includes forming a flowable dielectric layer in a trench of a substrate; curing the flowable dielectric layer; and annealing the cured flowable dielectric layer to form an insulation structure and a liner layer. The insulation structure is formed in the trench, the liner layer is formed between the insulation structure and the substrate, and the liner layer includes nitrogen.
    Type: Grant
    Filed: January 8, 2018
    Date of Patent: December 1, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jia-Ming Lin, Shiu-Ko Jangjian, Chun-Che Lin, Ying-Lang Wang, Wei-Ken Lin, Chuan-Pu Liu
  • Publication number: 20200365525
    Abstract: A method includes bonding a second package component to a first package component, bonding a third package component to the first package component, attaching a dummy die to the first package component, encapsulating the second package component, the third package component, and the dummy die in an encapsulant, and performing a planarization process to level a top surface of the second package component with a top surface of the encapsulant. After the planarization process, an upper portion of the encapsulant overlaps the dummy die. The dummy die is sawed-through to separate the dummy die into a first dummy die portion and a second dummy die portion. The upper portion of the encapsulant is also sawed through.
    Type: Application
    Filed: May 17, 2019
    Publication date: November 19, 2020
    Inventors: Chih-Wei Wu, Li-Chung Kuo, Pu Wang, Ying-Ching Shih, Szu-Wei Lu, Kung-Chen Yeh
  • Patent number: 10838001
    Abstract: An integrated circuit testing system is provided that includes a conductive line connected to a node configured to have a ground voltage. A plurality of conductive structures are coupled to the conductive line. A plurality of test circuits each is configured to supply a test voltage individually to a different conductive structure of the plurality of conductive structures for testing electrical connectivity of each of the different conductive structures. The conductive line is positioned between the node and the test circuits of the plurality of test circuits. A controller is coupled to each of the test circuits of the plurality of test circuits. The controller is configured to cause each of the test circuits of the plurality of test circuits to individually supply the test voltage to each of the different conductive structures of the plurality of conductive structures.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: November 17, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chewn-Pu Jou, Min-Jer Wang
  • Publication number: 20200335479
    Abstract: A method for forming a semiconductor package structure includes stacking chips to form a chip stack over an interposer. The method also includes disposing a semiconductor die over the interposer. The method also includes filling a first encapsulating layer between the chips and surrounding the chip stack and the semiconductor die. The method also includes forming a second encapsulating layer covering the chip stack and the semiconductor die. The first encapsulating layer fills the gap between the chip stack and the semiconductor die.
    Type: Application
    Filed: April 16, 2019
    Publication date: October 22, 2020
    Inventors: Cheng-Chieh LI, Pu WANG, Chih-Wei WU, Ying-Ching SHIH, Szu-Wei LU