Patents by Inventor Pu Wang

Pu Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220228767
    Abstract: A control method of an air conditioner, includes: acquiring a temperature of injected vapor and a pressure of the injected vapor of a compressor of the air conditioner, to obtain a superheat degree of the injected vapor of the compressor of the air conditioner and a continuous duration of the superheat degree of the injected vapor; if the continuous duration is greater than or equal to a first preset value, and if an exhaust temperature of the compressor is less than a critical value of the exhaust temperature of the compressor within the continuous duration, controlling the compressor to be in a shutdown state, and if the continuous duration is less than the first preset value, and if the exhaust temperature of the compressor is less than the critical value of the exhaust temperature of the compressor within the continuous duration, controlling the compressor to remain in an operating state.
    Type: Application
    Filed: April 4, 2022
    Publication date: July 21, 2022
    Inventors: Feng WEI, Haidong LIN, Si SUN, Chuanhua WANG, Enquan ZHANG, Pengju ZHAO, Pu ZHAO, Huaben LI
  • Publication number: 20220230985
    Abstract: A jig for manufacturing a semiconductor package includes a bottom piece and an upper piece. The bottom piece includes a base, a support plate, and at least one elastic connector. The support plate is located in a central region of the base. The at least one elastic connector is interposed between the support plate and the base. The upper piece includes a cap and outer flanges. The cap overlays the support plate when the upper piece is disposed on the bottom piece. The outer flanges are disposed at edges of the cap, connected with the cap. The outer flanges contact the base of the bottom piece when the upper piece is disposed on the bottom piece. The cap includes an opening which is a through hole. When the upper piece is disposed on the bottom piece, a vertical projection of the opening falls entirely on the support plate.
    Type: Application
    Filed: January 15, 2021
    Publication date: July 21, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hao Chen, Chih-Chien Pan, Pu Wang, Li-Hui Cheng, Szu-Wei Lu
  • Publication number: 20220222861
    Abstract: A data encoding method includes obtaining an attribute residual of a current point cloud point, binarizing the attribute residual to obtain a binary code of the current point cloud point that includes a first binary code indicating a first flag bit and a second binary code indicating a second flag bit, selecting a first context model from a context model list according to a first condition, selecting a second context model from the context model list according to a second condition, encoding the first binary code using the first context model, and encoding the second binary code using the second context model. The first condition and the second condition are different for the first context model and the second context model corresponding to a same index in the context model list.
    Type: Application
    Filed: March 29, 2022
    Publication date: July 14, 2022
    Inventors: Lu YU, Jiafeng CHEN, Wenyi WANG, Pu LI, Xiaozhen ZHENG
  • Patent number: 11387683
    Abstract: An integrated circuit (IC) includes a first circuit layer that includes a first wireless power transfer (WPT) device, a first chip electrically connected to the first circuit layer, and a first tracking circuit disposed in the first chip. The first WPT device may be configured to extract energy from an electromagnetic signal and provide an output voltage. The first tracking circuit may be powered by the output voltage of the first WPT device and may output tracking data in response to an instruction extracted from the electromagnetic signal.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: July 12, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Min-Jer Wang, Ching-Nen Peng, Chewn-Pu Jou, Feng Wei Kuo, Hao Chen, Hung-Chih Lin, Huan-Neng Chen, Kuang-Kai Yen, Ming-Chieh Liu, Tsung-Hsiung Lee
  • Patent number: 11346932
    Abstract: A system for a target image reconstruction includes a stepped frequency transmitter configured to emit a stepped frequency waveform having different constant frequencies at different periods of time and a modulator configured to modulate the stepped frequency waveform emitted at each period of time with a modulation signal to output a modulated stepped frequency waveform with an increased bandwidth. The system includes a transceiver configured to transmit the modulated stepped frequency waveform to a target and to accept reflection of the modulated stepped frequency waveform reflected from the target, a mixer to interfere the unmodulated stepped frequency waveform and the reflection of the modulated stepped frequency waveform to produce a beat signal of the interference of the unmodulated stepped frequency waveform with the reflection of the modulated stepped frequency waveform, and a signal processor to reconstruct an image of the target from the beat signal.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: May 31, 2022
    Assignee: Mitsubishi Electric Research Laboratories, Inc.
    Inventors: David Millar, Pu Wang, Kieran Parsons, Philip Orlik
  • Publication number: 20220164924
    Abstract: A system for a target image reconstruction includes a stepped frequency transmitter configured to emit a stepped frequency waveform having different constant frequencies at different periods of time and a modulator configured to modulate the stepped frequency waveform emitted at each period of time with a modulation signal to output a modulated stepped frequency waveform with an increased bandwidth. The system includes a transceiver configured to transmit the modulated stepped frequency waveform to a target and to accept reflection of the modulated stepped frequency waveform reflected from the target, a mixer to interfere the unmodulated stepped frequency waveform and the reflection of the modulated stepped frequency waveform to produce a beat signal of the interference of the unmodulated stepped frequency waveform with the reflection of the modulated stepped frequency waveform, and a signal processor to reconstruct an image of the target from the beat signal.
    Type: Application
    Filed: December 20, 2018
    Publication date: May 26, 2022
    Applicant: Mitsubishi Electric Research Laboratories, Inc.
    Inventors: David Millar, Pu Wang, Kieran Parsons, Philip Orlik
  • Publication number: 20220155770
    Abstract: The invent relates to an intelligent fault monitoring method based on high-order information enhanced recurrent neural network, for real-time fault monitoring of sewage treatment process. The invent includes two phases of offline modeling and online monitoring. In offline phase, the original data is extracted into high-dimensional high-order information features using OCIA, which can effectively deal with the non Gaussian feature of the data and solve the correlation between variables. Then the extracted features are trained by DRNN. In the online phase, the data are directly mapped to new high-order feature components, and to be discriminated in category by the DRNN network after trained offline. If there is no fault, then the results get into the monitoring model composed of simple OICA for unsupervised monitoring. If no fault is detected, it is determined that there is no fault in the process.
    Type: Application
    Filed: November 5, 2021
    Publication date: May 19, 2022
    Inventors: Peng CHANG, Zeyu LI, Kai WANG, Chunhao DING, Chen JIN, Xiangyu ZHANG, Ruiwei LU, Pu WANG
  • Publication number: 20220157692
    Abstract: A package structure includes a semiconductor package, a thermal conductive gel, a thermal conductive film and a heat spreader. The thermal conductive gel is disposed over the semiconductor package. The thermal conductive film is disposed over the semiconductor package and the thermal conductive gel. A thermal conductivity of the thermal conductive film is different from a thermal conductivity of the thermal conductive gel. The thermal conductive film is surrounded by the heat spreader.
    Type: Application
    Filed: February 7, 2022
    Publication date: May 19, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Pu Wang, Chin-Fu Kao, Szu-Wei Lu
  • Patent number: 11336960
    Abstract: A digital television including an interface to receive control signals from a remote controller; a screen; and a controller to execute an application related to a first icon within a menu when the controller receives a signal selecting the first icon within the menu from the remote controller, display a content of the executed application related to the first icon on the screen, enter into an edit mode of a second icon within the menu and display a first indicator for deleting the second icon as well as a second indicator for moving the second icon with displaying the content of the executed application related to the first icon in response to selecting an Up-key included in the remote controller, display a message verifying whether or not to delete the second icon from the menu in response to selecting an OK-key included in the remote controller after selecting the first indicator, delete the second icon from the menu and align other icons in a respective order in response to receiving a signal requesting fo
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: May 17, 2022
    Assignee: LG ELECTRONICS INC.
    Inventors: Daegu Kim, Alan Thomas Shen, David Kempe, Itai Vonshak, Molly Davis, Liron Damir, Danielle Zimmerman, Herbert Han-pu Wang, Brian Behnke
  • Publication number: 20220122922
    Abstract: Semiconductor devices and methods of manufacture are provided, in which an adhesive is removed from a semiconductor die embedded within an encapsulant, and an interface material is utilized to remove heat from the semiconductor device. The removal of the adhesive leaves behind a recess adjacent to a sidewall of the semiconductor, and the recess is filled.
    Type: Application
    Filed: January 15, 2021
    Publication date: April 21, 2022
    Inventors: Chih-Hao Chen, Pu Wang, Li-Hui Cheng, Szu-Wei Lu
  • Publication number: 20220122896
    Abstract: A package structure includes a package substrate, a first semiconductor package and a second semiconductor package, an underfill material, a gap filling structure and a heat dissipation structure. The first semiconductor package and the second semiconductor package are electrically bonded to the package substrate. The underfill material is disposed to fill a first space between the first semiconductor package and the package substrate and a second space between the second semiconductor package and the package substrate. The gap filling structure is disposed over the package substrate and in a first gap laterally between the first semiconductor package and the second semiconductor package. The heat dissipation structure is disposed on the package substrate and attached to the first semiconductor package and the second semiconductor package through a thermal conductive layer.
    Type: Application
    Filed: October 21, 2020
    Publication date: April 21, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Pu Wang, Li-Hui Cheng, Szu-Wei Lu, Tsung-Fu Tsai
  • Patent number: 11289399
    Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes a substrate, a semiconductor package, a thermal conductive gel, a thermal conductive film, and a heat spreader. The semiconductor package has an uneven top surface. The thermal conductive gel covers the uneven top surface of the semiconductor package. The thermal conductive film is over the uneven top surface of the semiconductor package. A thermal conductivity of the thermal conductive film is higher than a thermal conductivity of the thermal conductive gel. The heat spreader is disposed over the thermal conductive film.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: March 29, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Pu Wang, Chin-Fu Kao, Szu-Wei Lu
  • Publication number: 20220075087
    Abstract: Methods are provided for determining properties of an anisotropic formation (including both fast and slow formations) surrounding a borehole. A logging-while-drilling tool is provided that is moveable through the borehole. The logging-while drilling tool has at least one dipole acoustic source spaced from an array of receivers. During movement of the logging-while-drilling tool, the at least one dipole acoustic source is operated to excite a time-varying pressure field in the anisotropic formation surrounding the borehole. The array of receivers is used to measure waveforms arising from the time-varying pressure field in the anisotropic formation surrounding the borehole. The waveforms are processed to determine a parameter value that represents shear directionality of the anisotropic formation surrounding the borehole.
    Type: Application
    Filed: September 13, 2021
    Publication date: March 10, 2022
    Inventors: Pu Wang, Sandip Bose, Bikash Kumar Sinha, Ting Lei
  • Patent number: 11262184
    Abstract: An optical coherence tomography (OCT) system for profilometry measurements of a specimen with a lateral resolution across the profilometry measurements is provided. The OCT system includes a line-field generator, an interferometer, and a spectrometer. The line-field generator includes a filter arranged in a focal plane of a lens for spatially filtering extended line-field light into a line-field light of a width equal to the lateral resolution. The interferometer is configured to interfere the line-field light reflected from the specimen illuminated with a line-shaped focus with a reference signal of the line-field light to produce an interference pattern. The spectrometer configured to analyze spectral components of the interference pattern in a digital domain to produce the profilometry measurements of the specimen.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: March 1, 2022
    Assignee: Mitsubishi Electric Research Laboratories, Inc.
    Inventors: David Millar, Celalettin Yurdakul, Pu Wang, Kieran Parsons
  • Patent number: 11249181
    Abstract: A system for keyless entry applications using beamforming transmission in a millimeter wave spectrum in an environment. A memory with data including values indicative of link attributes associated with beam signal measurements with states of devices and states of environments. The states of the devices for each device including types of user behavior, locations and poses in each environment. Control circuitry performs beam training with a target device associated with at least one keyless entry application in the environment to measure beam signal values and environmental responses for different beams transmitted over the different beam angles. Selects, in response to the beam training, at least one dominant angle for a beamforming communication with the target device. Estimates, a state of the target device associated with the at least one keyless entry application or a state of the environment, corresponding to environmental responses for different beams estimated during the beam training.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: February 15, 2022
    Assignee: Mitsubishi Electric Research Laboratories, Inc.
    Inventors: Toshiaki Koike-Akino, Pu Wang, Milutin Pajovic, Philip Orlik
  • Publication number: 20220044124
    Abstract: The invention discloses a convolution self-encoding fault monitoring method based on batch imaging, and belongs to the technical field of batch process fault monitoring. The method comprises two steps of off-line modeling and on-line monitoring. The offline modeling step comprises the following steps: firstly, normalizing three-dimensional data of intermittent process; then, taking the two-dimensional array of each batch as an image to be directly input into a convolutional auto-encoder (CAE) to carry out deep unsupervised feature learning; and finally, constructing statistics and corresponding control limits for the features learned by CAE by utilizing a support vector machine. The online monitoring step includes: normalizing the collected data, and carrying out batch filling; inputting the normalized and filled batch graph into trained CAE to learn features; and calculating an online statistic, comparing online statistic with an offline control limit.
    Type: Application
    Filed: October 20, 2021
    Publication date: February 10, 2022
    Inventors: Pu WANG, Haili ZHANG, Xuejin GAO, Huihui GAO
  • Publication number: 20220012926
    Abstract: A method for a target image reconstruction is provided. The method includes emitting stepped frequency waveforms having different constant frequencies at different periods of time, modulating the stepped frequency waveforms into frequency ranges each having a first frequency and a second frequency, wherein each of the stepped frequency waveforms are increased from the first frequency to the second frequency based on a range function, wherein the modulated stepped frequency waveforms are arranged with some sparsity factor.
    Type: Application
    Filed: July 10, 2020
    Publication date: January 13, 2022
    Inventors: David Millar, Okan Atalar, Keisuke Kojima, Toshiaki Koike-Akino, Pu Wang, Kieran Parsons
  • Patent number: 11205615
    Abstract: An integrated fan out package on package architecture is utilized along with de-wetting structures in order to reduce or eliminated delamination from through vias. In embodiments the de-wetting structures are titanium rings formed by applying a first seed layer and a second seed layer in order to help manufacture the vias. The first seed layer is then patterned into a ring structure which also exposes at least a portion of the first seed layer.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: December 21, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsien-Ju Tsou, Chih-Wei Wu, Jing-Cheng Lin, Pu Wang, Szu-Wei Lu, Ying-Ching Shih
  • Publication number: 20210389487
    Abstract: A method for determining a shear slowness of a subterranean formation includes receiving waveforms data acquired by receivers in an acoustic measurement tool in response to energy emitted by at least one dipole source. The waveforms are processed to extract a formation flexural acoustic mode and a tool flexural acoustic mode. The processing includes transforming the time domain waveforms to frequency domain waveforms, processing the frequency domain waveforms with a Capon algorithm to compute a two-dimensional spectrum over a chosen range of group slowness and phase slowness values; and processing the two-dimensional spectrum to extract the multi-mode slowness dispersion.
    Type: Application
    Filed: August 26, 2021
    Publication date: December 16, 2021
    Inventors: Pu Wang, Sandip Bose, Bikash K. Sinha
  • Patent number: 11182445
    Abstract: Embodiments of the present disclosure disclose a method, an apparatus, a server, and a storage medium for recalling for a search. The method for recalling for a search includes: acquiring a search term inputted by a user; calculating a semantic vector of the search term using a pre-trained neural network model; and recalling, according to a pre-established index, target documents related to the semantic vector of the search term from candidate documents, the index being established based on the semantic vectors of the candidate documents, and the semantic vectors of the candidate documents being calculated using the pre-trained neural network model. The embodiments of the present disclosure may solve a problem in the existing method for recalling that the recalling accuracy is affected by failing to generalize semantics, to improve the accuracy of recalling for a search.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: November 23, 2021
    Assignee: BEIJING BAIDU NETCOM SCIENCE AND TECHNOLOGY CO., LTD.
    Inventors: Chen Li, Di Jiang, Xinyu Wang, Yibin Wei, Pu Wang, Jingzhou He