Patents by Inventor Pu Wang

Pu Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12211818
    Abstract: A jig for manufacturing a semiconductor package includes a bottom piece and an upper piece. The bottom piece includes a base, a support plate, and at least one elastic connector. The support plate is located in a central region of the base. The at least one elastic connector is interposed between the support plate and the base. The upper piece includes a cap and outer flanges. The cap overlays the support plate when the upper piece is disposed on the bottom piece. The outer flanges are disposed at edges of the cap, connected with the cap. The outer flanges contact the base of the bottom piece when the upper piece is disposed on the bottom piece. The cap includes an opening which is a through hole. When the upper piece is disposed on the bottom piece, a vertical projection of the opening falls entirely on the support plate.
    Type: Grant
    Filed: July 26, 2023
    Date of Patent: January 28, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hao Chen, Chih-Chien Pan, Pu Wang, Li-Hui Cheng, Szu-Wei Lu
  • Patent number: 12210114
    Abstract: A radar system for tracking an object in a scene by transmitting frequency modulated continuous wave (FMCW) is provided. The radar system is configured to collect radar measurements of the scene sampled in a time-frequency domain within an intermediate frequency (IF) bandwidth to which reflection of the transmitted FMCW is shifted by mixing with a copy of the FMCW, where a frequency dimension of the time-frequency domain is quantized into multiple frequency bins forming the frequency bandwidth, where a time dimension of the time-frequency domain is quantized into multiple time instances forming a time interval corresponding to the PRI, count a number of amplitude peaks of the radar measurements for each frequency bin at different instances of time, identify a number of frequency bins with their counts of the number of peaks above a pre-determined threshold, and determine at least a distance to the object based on frequency analysis of the radar measurements.
    Type: Grant
    Filed: March 18, 2022
    Date of Patent: January 28, 2025
    Assignee: Mitsubishi Electric Research Laboratories, Inc.
    Inventors: Pu Wang, Sian Jin
  • Patent number: 12213177
    Abstract: A computer-executed method is provided for IEEE 802.15.4 devices based on a suspendable carrier-sense multiple access with collision avoidance (CSMA/CA) control program and standard CSMA/CA control program for an IEEE 802.15.4 network composing of IEEE 802.15.4 devices. The computer-executed method is provided on an IEEE 802.15.4 device, and causes a processor of the IEEE 802.15.4 device to perform steps that include determining the permission of backoff suspension and the intention of IEEE 802.15.4 device to perform backoff suspension, selecting the suspendable CSMA/CA control program if the backoff suspension is permitted and IEEE 802.15.4 device intends to perform backoff suspension.
    Type: Grant
    Filed: November 13, 2023
    Date of Patent: January 28, 2025
    Assignee: Mitsubishi Electric Research Laboratories, Inc.
    Inventors: Jianlin Guo, Yukimasa Nagai, Takenori Sumi, Kieran Parsons, Philip Orlik, Pu Wang
  • Publication number: 20250020500
    Abstract: Disclosed are a liquid level switch system and a liquid level measurement method. The liquid level switch system has a transmitting probe, a receiving probe and a main unit. The transmitting probe is located at a warning position on the outer wall of a tank body, the receiving probe is located on the outer wall of the tank body, and the transmitting probe and the receiving probe are respectively connected to the main unit by means of cables. A piezoelectric plate is placed on an inclined block to change the incident angle of an ultrasonic signal entering the tank wall so as to generate a longitudinal wave signal and a transverse wave signal, and the main unit judges, according to a signal strength difference value between a longitudinal wave receiving signal and a transverse wave receiving signal, whether the liquid level of the tank body reaches the warning position.
    Type: Application
    Filed: August 8, 2024
    Publication date: January 16, 2025
    Inventors: Pu WANG, Dinghua WANG, Rui WANG
  • Patent number: 12196679
    Abstract: Systems and methods are provided for multi-spectral or hyper-spectral fluorescence imaging. In one example, a spectral encoding device may be positioned in a detection light path between a detection objective and an imaging sensor of a microscope. In one example, the spectral encoding device includes a first dichroic mirror having a sine transmittance profile and a second dichroic mirror having a cosine transmittance profile. In addition to collecting transmitted light, reflected light from each dichroic mirror is collected and used for total intensity normalization and image analysis.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: January 14, 2025
    Assignee: University of Southern California
    Inventors: Francesco Cutrale, Pu Wang, Scott E. Fraser
  • Publication number: 20240395727
    Abstract: Semiconductor devices and methods of manufacture are provided, in which an adhesive is removed from a semiconductor die embedded within an encapsulant, and an interface material is utilized to remove heat from the semiconductor device. The removal of the adhesive leaves behind a recess adjacent to a sidewall of the semiconductor, and the recess is filled.
    Type: Application
    Filed: July 31, 2024
    Publication date: November 28, 2024
    Inventors: Chih-Hao Chen, Pu Wang, Li-Hui Cheng, Szu-Wei Lu
  • Patent number: 12154194
    Abstract: A method for a target image reconstruction is provided. The method includes emitting stepped frequency waveforms having different constant frequencies at different periods of time, modulating the stepped frequency waveforms into frequency ranges each having a first frequency and a second frequency, wherein each of the stepped frequency waveforms are increased from the first frequency to the second frequency based on a range function, wherein the modulated stepped frequency waveforms are arranged with some sparsity factor.
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: November 26, 2024
    Assignee: Mitsubishi Electric Research Laboratories, Inc.
    Inventors: David Millar, Okan Atalar, Keisuke Kojima, Toshiaki Koike-Akino, Pu Wang, Kieran Parsons
  • Publication number: 20240387446
    Abstract: A jig for manufacturing a semiconductor package includes a bottom piece and an upper piece. The bottom piece includes a base, a support plate, and at least one elastic connector. The support plate is located in a central region of the base. The at least one elastic connector is interposed between the support plate and the base. The upper piece includes a cap and outer flanges. The cap overlays the support plate when the upper piece is disposed on the bottom piece. The outer flanges are disposed at edges of the cap, connected with the cap. The outer flanges contact the base of the bottom piece when the upper piece is disposed on the bottom piece. The cap includes an opening which is a through hole. When the upper piece is disposed on the bottom piece, a vertical projection of the opening falls entirely on the support plate.
    Type: Application
    Filed: July 29, 2024
    Publication date: November 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hao Chen, Chih-Chien Pan, Pu Wang, Li-Hui Cheng, Szu-Wei Lu
  • Publication number: 20240381425
    Abstract: A computer-executed method is provided for IEEE 802.15.4 devices based on a suspendable carrier-sense multiple access with collision avoidance (CSMA/CA) control program and standard CSMA/CA control program for an IEEE 802.15.4 network composing of IEEE 802.15.4 devices. The computer-executed method is provided on an IEEE 802.15.4 device, and causes a processor of the IEEE 802.15.4 device to perform steps that include determining the permission of backoff suspension and the intention of IEEE 802.15.4 device to perform backoff suspension, selecting the suspendable CSMA/CA control program if the backoff suspension is permitted and IEEE 802.15.4 device intends to perform backoff suspension.
    Type: Application
    Filed: November 13, 2023
    Publication date: November 14, 2024
    Applicants: Mitsubishi Electric Research Laboratories, Inc., Mitsubishi Electric Corporation
    Inventors: Jianlin Guo, Yukimasa Nagai, Takenori Sumi, Kieran Parsons, Philip Orlik, Pu Wang
  • Publication number: 20240379429
    Abstract: Some embodiments of the present disclosure provide a method of manufacturing a semiconductor device. The method includes: forming a carrier; forming a sacrificial layer on the carrier; forming a through via on the sacrificial layer, wherein the through via includes a seed layer and a metal feature; disposing a die on the sacrificial layer, wherein the die has a plurality of metal pillars disposed at a side of the die facing away from the sacrificial layer; forming a molding compound on the sacrificial layer to cover and surround the die and the through via; removing a portion of the molding compound and a portion of the through via above the die to expose the metal feature of the through via; and removing the carrier and sacrificial layer to expose the seed layer of the through via.
    Type: Application
    Filed: July 23, 2024
    Publication date: November 14, 2024
    Inventors: JING-CHENG LIN, YING-CHING SHIH, PU WANG, CHEN-HUA YU
  • Publication number: 20240371724
    Abstract: A package structure includes a substrate, a first die, a second die, a first thermal conductive layer, a heat spreader and a second thermal conductive layer. The first die and the second die are bonded to the substrate. The first thermal conductive layer is inserted between the first die and the second die. The heat spreader is disposed on the substrate to cover the first die and the second die. The second thermal conductive layer is different from the first thermal conductive layer, wherein the second thermal conductive layer is disposed between the first thermal conductive layer and the heat spreader.
    Type: Application
    Filed: July 14, 2024
    Publication date: November 7, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Pu Wang, Chin-Fu Kao, Szu-Wei Lu
  • Publication number: 20240371725
    Abstract: A method of forming a semiconductor structure includes: attaching a semiconductor device to a first surface of a substrate; placing a thermal interface material (TIM) film over a first side of the semiconductor device distal from the substrate, where the TIM film is pre-formed before the placing, where after the placing, a peripheral portion of the TIM film extends laterally beyond sidewalls of the semiconductor device; and attaching a lid to the first surface of the substrate to form an enclosed space between the lid and the substrate, where after attaching the lid, the semiconductor device and the TIM film are disposed in the enclosed space, where a first side of the TIM film distal from the substrate contacts the lid.
    Type: Application
    Filed: July 17, 2024
    Publication date: November 7, 2024
    Inventors: Chih-Hao Chen, Hung-Yu Chen, Pu Wang, Li-Hui Cheng, Szu-Wei Lu
  • Publication number: 20240371722
    Abstract: An embodiment thermal interface material may include a first component including a first thermal conductivity that is between 20 W/cm·K and 30 W/cm·K and a second component including a second thermal conductivity that is between 30 W/cm·K and 40 W/cm·K. Each of the first component and the second component may include a thermally conductive material including one or more of graphite, graphene, carbon nanotubes, a metal, and a phase change material. For example, each of the first component and the second component include graphite dispersed within a polymer matrix that may include one or more of a hydrogenated hydrocarbon resin, polybutene, polyisobutylene, and an acrylic acid ester copolymer. According to an embodiment, the first component may include 40 wt % to 60 wt % graphite and the second component may include 60 wt % to 70 wt % graphite.
    Type: Application
    Filed: May 4, 2023
    Publication date: November 7, 2024
    Inventors: Chih-Chien Pan, Li-Hui Cheng, Pu Wang
  • Publication number: 20240362457
    Abstract: A system for sensing a state of a device is provided. The system includes an autoencoder comprising an encoder, a latent subnetwork, and an extended decoder. The encoder encodes each input data point of input data from an input state space into a latent space to produce latent data points and propagates the latent data points with a neural Ordinary Differential Equation (ODE) to estimate an initial point of latent dynamics of the device in the latent space. The latent subnetwork propagates the initial point till a time index of interest using the neural ODE to produce a state of latent dynamics of the device at the time index of interest. The extended decoder decodes the state of latent dynamics of the device into an output state space different from the input state space to produce output data including the state of the device at the time index of interest.
    Type: Application
    Filed: April 27, 2023
    Publication date: October 31, 2024
    Inventors: Pu Wang, Cristian Vaca-Rubio, Toshiaki Koike Akino, Ye Wang, Petros Boufounos
  • Patent number: 12132004
    Abstract: Semiconductor devices and methods of manufacture are provided, in which an adhesive is removed from a semiconductor die embedded within an encapsulant, and an interface material is utilized to remove heat from the semiconductor device. The removal of the adhesive leaves behind a recess adjacent to a sidewall of the semiconductor, and the recess is filled.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: October 29, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Hao Chen, Pu Wang, Li-Hui Cheng, Szu-Wei Lu
  • Publication number: 20240338494
    Abstract: The present disclosure discloses a determining method, a system, a reflector, a vertical tank external measurement liquid level meter and a mounting method thereof. An ultrasonic transmitting probe thereof is mounted on an outer wall of the measured vertical tank, and an ultrasonic signal emitted by the ultrasonic transmitting probe penetrates through a side wall of the vertical tank and generates an ultrasonic emission source at an inner wall of the vertical tank; an ultrasonic signal emitted by the ultrasonic emission source is emitted to the reflector, is returned to the position of the ultrasonic emission source according to the original path after passing through the liquid level of the measured vertical tank, penetrates through the side wall of the vertical tank and is received by a measuring head of the vertical tank external measurement liquid level meter mounted outside the side wall of the vertical tank.
    Type: Application
    Filed: July 29, 2022
    Publication date: October 10, 2024
    Inventors: Dinghua WANG, Rui WANG, Pu WANG
  • Publication number: 20240332113
    Abstract: An integrated circuit (IC) device includes a substrate, such as a printed circuit board (PCB) substrate. A chip assembly is disposed over the substrate. The chip assembly includes an IC, a plurality of electronic memory devices coupled to the IC, and a molding compound material that circumferentially surrounds the IC and the electronic memory devices collectively in a top view. A thermal interface material (TIM) is disposed over the chip assembly. The TIM includes an indium alloy, a gallium alloy, or an alloy that contains bismuth, indium, and tin. An adhesive dam is disposed over the substrate. The adhesive dam surrounds the chip assembly and the TIM laterally. A lid structure is disposed over the substrate and encapsulates the chip assembly therein. The lid structure includes one or more openings that expose portions of the TIM. The one or more openings accommodate an expansion of the TIM.
    Type: Application
    Filed: March 31, 2023
    Publication date: October 3, 2024
    Inventors: Ping-Yin Hsieh, Li-Hui Cheng, Pu Wang, Ying-Ching Shih
  • Patent number: 12105185
    Abstract: The present disclosure provides a system and a method for detecting and tracking objects. The method includes permuting an order of frames in a sequence of radar image frames to produce multiple permuted sequences with different frames at a dominant position in a corresponding permuted sequence of radar image frames. Each permuted sequence of radar image frames is processed with a first neural network to produce temporally enhanced features for each of the frames in the sequence of radar image frames. Further a feature map is reconstructed from the temporally enhanced features of each of the frames in the sequence of radar image frames to produce a sequence of feature maps. The method further includes processing a list of feature vectors from each feature map with a second neural network to produce temporally enhanced heatmaps.
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: October 1, 2024
    Assignee: Mitsubishi Electric Research Laboratories, Inc.
    Inventors: Pu Wang, Peizhao Li, Karl Berntorp
  • Publication number: 20240319978
    Abstract: A network manager is provided for delivering a firmware/software program to multi-mode nodes and single-mode nodes arranged in a multi-hop wireless IoT network. The network manager includes a transceiver configured to perform wireless communication by transmitting the encoded packets of the firmware/software program to the first-hop nodes. The network manager divides firmware/software program into source blocks, encodes the source blocks into encoded blocks based on coding scheme, packs the encoded blocks into encoded packets, transmits the encoded packets to the first-hop nodes. In this case, the first-hop nodes are configured to receive, decode, re-encode and re-transmit the encoded packets to propagate firmware/software distribution to the other-hop nodes. The network manager keeps broadcasting the encoded packets to the first-hop nodes until a predetermined percent of the first-hop nodes receive the firmware/software program.
    Type: Application
    Filed: March 21, 2023
    Publication date: September 26, 2024
    Inventors: Jianlin Guo, Jothi Prasanna Shanmuga Sundaram, Toshiaki Koike Akino, Pu Wang, Kieran Parsons, Philip Orlik, Takenori Sumi, Yukimasa Nagai
  • Patent number: 12100640
    Abstract: A method of forming a semiconductor structure includes: attaching a semiconductor device to a first surface of a substrate; placing a thermal interface material (TIM) film over a first side of the semiconductor device distal from the substrate, where the TIM film is pre-formed before the placing, where after the placing, a peripheral portion of the TIM film extends laterally beyond sidewalls of the semiconductor device; and attaching a lid to the first surface of the substrate to form an enclosed space between the lid and the substrate, where after attaching the lid, the semiconductor device and the TIM film are disposed in the enclosed space, where a first side of the TIM film distal from the substrate contacts the lid.
    Type: Grant
    Filed: June 2, 2023
    Date of Patent: September 24, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Hao Chen, Hung-Yu Chen, Pu Wang, Li-Hui Cheng, Szu-Wei Lu