Abstract: A battery and an electrical device are disclosed. The battery includes multiple structural components. The multiple structural components are arranged along a first direction. At least one structural component is a battery row, which includes at least one battery cell. The battery cell includes a first surface provided with an electrical connection portion. The first surface is oriented toward an adjacent structural component; and a support piece. The support piece is disposed between the battery row and the adjacent structural component. The support piece is configured to space the first surface and the adjacent structural component apart by a fixed clearance.

Abstract: A package structure is provided. The package structure includes a substrate, a package component bonded to the substrate, a lid disposed over the package component and the substrate, and an interface structure sandwiched between the package component. The package component includes a first die, a second die laterally spaced apart from the first die by an underfill, and a molding compound adjacent the first die and the second die. The interface structure includes an adhesive layer disposed over the underfill and the molding compound, and a thermal interface material (TIM) layer over the adhesive layer, the first die and the second die.

Abstract: A heat exchanging assembly, a battery module, a battery, and an electrical device are provided. The heat exchanging assembly includes a heat exchanging plate. The heat exchanging plate has a heat exchanging flow channel. The heat exchanging plate has a discharge structure. The discharge structure is configured to correspond to a pressure relief mechanism of a battery cell. The heat exchanging flow channel is arranged on at least one side of the discharge structure in a width direction of the heat exchanging plate. The heat exchanging flow channel is configured to exchange heat with the battery cell.

Abstract: A frequency modulation continuous wave (FMCW)-based system configured to convert measurements of a linearly modulated wave from a time-domain into a frequency-domain to produce a non-linear frequency signal, where the non-linear frequency signal comprises a known linear component representing the desired linear modulation and an unknown non-linear component representing the non-linearity of the modulation. The FMCW-based system is further configured to determine coefficients of a basis function approximating a difference between the non-linear frequency signal and the linear frequency component in the frequency domain. The FMCW-based system is further configured to detect one or multiple spectrum peaks in the distorted beat signal with the distortion compensated according to the basis function with the determined coefficients to determine one or multiple distances to the one or multiple objects in the scene.

Abstract: The present disclosure relates to a multi-modal imaging device. The multi-modal imaging device includes: a Raman spectroscopic analysis module configured to obtain Raman spectroscopic information of a target object on a first sampling position by using excitation light; an optical coherence tomography module configured to obtain a tissue structure image of the target object on a second sampling position by using imaging detection light; and a co-localization module configured to control the first sampling position of the excitation light in the Raman spectroscopic analysis module and/or the second sampling position in the optical coherence tomography module according to a determined concerned area of the target object, so that the first sampling position and the second sampling position are spatially co-localized in the concerned area.

Abstract: A package structure is provided. The package structure includes a substrate, a die bonded to the substrate, a lid disposed over the die and the substrate, and an interface structure sandwiched between the die and the lid and including a first thermal interface material disposed at corners of a top surface of the die, and a second thermal interface material disposed a rest of the top surface of the die. A Young's modulus of the first thermal interface material is smaller than a Young's modulus of the second thermal interface material.

Abstract: A chip package structure is provided. The chip package structure includes a wiring substrate. The chip package structure includes a chip structure over the wiring substrate. The chip package structure includes a first ring structure over the wiring substrate and surrounding the chip structure, wherein a first coefficient of thermal expansion of the first ring structure is less than a second coefficient of thermal expansion of the wiring substrate. The chip package structure includes an anti-warpage structure over the first ring structure. A third coefficient of thermal expansion of the anti-warpage structure is greater than the first coefficient of thermal expansion of the first ring structure.

Abstract: A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.

Abstract: A method for determining a shear slowness of a subterranean formation includes receiving waveforms data acquired by receivers in an acoustic measurement tool in response to energy emitted by at least one dipole source. The waveforms are processed to extract a formation flexural acoustic mode and a tool flexural acoustic mode. The processing includes transforming the time domain waveforms to frequency domain waveforms, processing the frequency domain waveforms with a Capon algorithm to compute a two-dimensional spectrum over a chosen range of group slowness and phase slowness values; and processing the two-dimensional spectrum to extract the multi-mode slowness dispersion.

Abstract: A semiconductor structure includes a first semiconductor package, a second semiconductor package, a heat spreader and an dielectric layer. The first semiconductor package includes a plurality of first semiconductor chips and a first dielectric encapsulation layer disposed around the plurality of the first semiconductor chips. The second semiconductor package is disposed over and corresponds to one of the plurality of first semiconductor chips, wherein the second semiconductor package includes a plurality of second semiconductor chips and a second dielectric encapsulation layer disposed around the plurality of second semiconductor chips. The heat spreader is disposed over and corresponds to another of the plurality of first semiconductor chips. The dielectric layer is disposed over the first semiconductor package and around the second semiconductor package and the heat spreader.

Abstract: The present disclosure provides an exhaust component, a box, a battery, and an electric device. The exhaust component includes a main body part and a one-way guiding part. The main body part is therein provided with an exhaust chamber, and the main body part is provided with a first surface, wherein the first surface is provided with ventilation holes communicating with the exhaust chamber. The one-way guiding part is arranged on the main body part. The one-way guiding part is configured to allow emissions released by the pressure relief mechanism of the battery cell to enter the exhaust chamber through the ventilation holes and is also configured to prevent the emissions within the exhaust chamber from being discharged through the ventilation holes.

Abstract: A package structure includes a lower package including a first semiconductor die including a backside metal film on a backside of the first semiconductor die, an upper package attached to the lower package and electrically coupled to the lower package, and a thermally conductive underfill layer between the lower package and the upper package and contacting the backside metal film.

Abstract: A system for controlling a character in a virtual environment includes at least one processor and at least one nontransitory computer-readable medium comprising instructions that are executable by the at least one processor. The instructions include receiving a text input indicating one or more motions of the character, generating a plurality of text-based tokens and a plurality of motion tokens, appending a plurality of masked tokens to the plurality of motion tokens, performing a masked transformer routine to generate a plurality of predicted motion tokens based on the plurality of masked tokens, the plurality of motion tokens, and the plurality of text-based tokens, decoding the plurality of predicted motion tokens and the plurality of motion tokens into a motion sequence of the character, where the motion sequence includes the one or more motions and a predicted motion of the character, and controlling the character based on the motion sequence.

Abstract: A heat management component, a case assembly, a battery, and an electric device are provided. The heat management component includes a heat exchange portion and a discharge portion. The heat exchange portion is configured to exchange heat with a battery cell. The discharge portion is configured to receive an emission from the battery cell. Further, the discharge portion is at least partially connected to the heat exchange portion in a thermally conductive manner.

Abstract: An adapter to a base model of an artificial intelligence (AI) system is disclosed. The adapter includes a connector to connect the adapter to the base model such that during an operation of the AI system at least some portion of data transformed by the base model is propagated from the base model to the adapter and back from the adapter to the base model. The adapter includes a non-linear modifier to modify the data received from the base model non-linearly before returning the modified portion of the data back to the base model, and an AI trainer to tune the non-linear modifier of the adapter by propagating training data through the base model and the adapter and updating weights of the non-linear modifier of the adapter for given weights of the base model to optimize a loss function. Further, weight matrices for the base model and the adapter are jointly constructed by an additional module, which efficiently uses a pool of parameters to allocate to save memory requirement for adaptation of the AI system.

Abstract: A manufacturing method of a package structure includes: forming a first package component, where the first package component includes a first insulating encapsulation laterally covering semiconductor dies and a redistribution structure formed on the first insulating encapsulation and the semiconductor dies; coupling the first package component to a second package component; forming an underfill layer between the first and second package component, where the underfill layer extends to cover a sidewall of the first package component; forming a metallic layer on opposing surfaces of the semiconductor dies and the first insulating encapsulation by using a jig, where a window of the jig accessibly exposes the opposing surfaces of the semiconductor dies and the first insulating encapsulation, and a peripheral region of the opposing surface of the first insulating encapsulation is shielded by the jig.

Abstract: A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.

Abstract: A semiconductor structure includes a first semiconductor package, a second semiconductor package, a heat spreader and an dielectric layer. The first semiconductor package includes a plurality of first semiconductor chips and a first dielectric encapsulation layer disposed around the plurality of the first semiconductor chips. The second semiconductor package is disposed over and corresponds to one of the plurality of first semiconductor chips, wherein the second semiconductor package includes a plurality of second semiconductor chips and a second dielectric encapsulation layer disposed around the plurality of second semiconductor chips. The heat spreader is disposed over and corresponds to another of the plurality of first semiconductor chips. The dielectric layer is disposed over the first semiconductor package and around the second semiconductor package and the heat spreader.

Abstract: Various embodiments include integrated circuit packages and methods of forming integrated circuit packages. In an embodiment, a device includes: a package substrate; an integrated circuit device attached to the package substrate; a stiffener ring around the integrated circuit device and attached to the package substrate; a lid attached to the stiffener ring; a channel connected to an area between the lid and the integrated circuit device, the channel extending along at least one side of the integrated circuit device in a top-down view; and a thermal interface material in the channel and in the area between the lid and the integrated circuit device.

Abstract: A method of image reconstruction of a structure of a scene comprises collecting measurements of intensities of a wave over a period of time. The intensities of the wave are modified by propagation of the wave in the scene. The method also comprises collecting depth information indicative of the structure of the scene at different values of depth of the scene. The different values of depth correlate with different time segments forming the period of time. The method also comprises processing the measurements with a guided recurrent neural network to sequentially learn features of the structure of the scene using the depth information as a guidance and rendering one or multiple images indicative of the features of the structure learned by the recurrent neural network.