Abstract: A system for integrated millimeter-wave (mmWave) communication and sensing is disclosed. The system includes an antenna array configured to transmit and receive directional signals via multiple available RF chains, a memory storing a predefined codebook of beamforming patterns, and a processor executing instructions to optimize beamforming for both communication and sensing. During beam training intervals, the system transmits and receives beamforming patterns from the codebook, computing beamforming qualities for devices in communication. The system then selects multiple beamforming patterns that meet a communication criterion, such as a minimum data transmission threshold. The system further determines weights for a linear combination of the selected beamforming patterns to optimize sensing performance while maintaining communication reliability. The antenna array is configured to use the optimized beamforming pattern, ensuring efficient integrated operation within power and hardware constraints.

Abstract: A method for performing group-based association in a wireless communication network compliant with the IEEE 802.15.4 standard is provided. The method comprises receiving, by a network coordinator, association requests from a plurality of devices seeking to join the network. The method further comprises grouping the plurality of devices into one or more groups based on at least one grouping criterion selected from: (1) an association type indicating the priority of devices seeking association, (2) a time interval during which the association requests were received, (3) spatial proximity of the devices to the network coordinator, (4) a communication channel used by the devices, or (5) a beamforming direction relative to the network coordinator. The method further comprises transmitting, by the network coordinator, a group association response to each group, the association response including parameters required for devices within the group to complete the association process.

Abstract: A package structure and a method of forming the same are provided. The package structure includes a package unit and passive components disposed on and electrically connected to a circuit substrate, a dam disposed on the circuit substrate and enclosing the package unit and the passive components, and an underfill disposed between the package unit and the circuit substrate. The passive components are laterally spaced apart from the package unit, and sandwiched between the dam and the package unit. The underfill extends from the package unit to the passive components, and extends from the passive components to the dam. An outer periphery of the underfill is in contact with the dam.

Abstract: The present disclosure relates to the technical field of data processing, and discloses a video recommendation method and apparatus, an electronic device, a storage medium and a program product. The method includes: determining, in response to a first condition input on a first page, a historical live streaming video satisfying the first condition; displaying, in a display area of a second page, a display unit of at least one video segment in the historical live streaming video; displaying, in the display area of the first page, a first video segment in response to a selection instruction for the first video segment; and pushing the first video segment in response to an interaction operation on a push control in the first page.

Abstract: A package structure and a method for forming a package structure are provided. The method includes disposing an upper chip-containing structure over a lower chip-containing structure and forming a protective layer laterally surrounding the upper chip-containing structure. The method also includes partially removing the protective layer to form an opening extending towards the lower chip-containing structure. The method further includes forming a thermal conductive structure at least partially filling the opening.

Abstract: A method includes placing a package, which includes a first package component, a second package component, and an encapsulant encapsulating the first package component and the second package component therein. The method further includes attaching a first thermal interface material over the first package component, attaching a second thermal interface material different from the first thermal interface material over the second package component, and attaching a heat sink over both of the first thermal interface material and the second thermal interface material.

Abstract: The present disclosure provides a multi-modal imaging device based on Raman spectroscopy and optical coherence tomography. The multi-modal imaging device based on Raman spectroscopy and optical coherence tomography includes: a Raman spectroscopic analysis module configured to obtain Raman spectroscopic information of a target object on a first sampling position by using excitation light; an optical coherence tomography module configured to obtain at least one two-dimensional tissue structure image of the target object on a second sampling position by using imaging detection light; and a co-localization module configured to control the first sampling position of the excitation light in the Raman spectroscopic analysis module and/or the second sampling position in the optical coherence tomography module according to a determined concerned area of the target object, so that the first sampling position and the second sampling position are spatially co-localized in the concerned area.

Abstract: A packaging structure may be formed by: providing a composite package including at least one semiconductor die and a die frame; attaching the composite package to a packaging substrate to form a bonded assembly; providing a lid structure including a bottom plate portion, a top plate portion, a sidewall frame portion laterally surrounding a cavity located between the bottom plate portion and the top plate portion, and solid block portions vertically extending between the bottom plate portion and the top plate portion; and attaching the lid structure to the bonded assembly such that a thermal interface material (TIM) layer is interposed between the at least one semiconductor die and the bottom plate portion. The solid block portions do not have any areal overlap with the at least one semiconductor die in a plan view along a vertical direction.

Abstract: A semiconductor device includes a package substrate, a package component and at least one adhesive pattern. The package component has a thermal interface material (TIM) layer thereon. The adhesive pattern has a first surface facing the package substrate and a second surface opposite to the first surface, and the second surface of the at least one adhesive pattern is substantially coplanar with a surface of the TIM layer.

Abstract: A device structure may be manufactured by: disposing a semiconductor package on a package tray, wherein the package tray includes a tray base portion which laterally extends underneath the semiconductor package, a tray mesa portion which protrudes upward from the tray base portion and including a contiguous set of mesa-portion sidewalls, and a frame-shaped support portion including a continuous set of support-portion outer sidewalls that is laterally offset inward from a package area that is defined by a set of all sidewalls of the semiconductor package in a plan view; and anisotropically depositing an electromagnetic interference (EMI) shielding film on the set of all sidewalls of the semiconductor package and on a top surface of the semiconductor package.

Abstract: In an embodiment, a device includes a package component including an integrated circuit die and conductive connectors connected to the integrated circuit die, the conductive connectors disposed at a front-side of the package component. The device also includes a back-side metal layer on a back-side of the package component. The device also includes an indium thermal interface material on a back-side of the back-side metal layer. The device also includes a lid on a back-side of the indium thermal interface material. The device also includes a package substrate connected to the conductive connectors, the lid being adhered to the package substrate.

Abstract: A manufacturing method of a package structure includes: coupling a device package to a package substrate, where the device package includes semiconductor dies encapsulated by an insulating encapsulation and electrically coupled to the package substrate; forming a first dielectric pattern on the device package opposite to the package substrate, where the first dielectric pattern includes openings corresponding to the semiconductor dies of the device package; forming a thermal conductive material on the semiconductor dies of the device package and in the openings of the first dielectric pattern; placing a heat dissipating component over the device package and the package substrate, the heat dissipating component being in contact with the first dielectric pattern and the thermal conductive material; and performing a thermal treatment process on the first dielectric pattern and the thermal conductive material to form a thermal interface material structure coupling the heat dissipating component to the device pack

Abstract: An integrated circuit (IC) device includes a substrate, such as a printed circuit board (PCB) substrate. A chip assembly is disposed over the substrate. The chip assembly includes an IC, a plurality of electronic memory devices coupled to the IC, and a molding compound material that circumferentially surrounds the IC and the electronic memory devices collectively in a top view. A thermal interface material (TIM) is disposed over the chip assembly. The TIM includes an indium alloy, a gallium alloy, or an alloy that contains bismuth, indium, and tin. An adhesive dam is disposed over the substrate. The adhesive dam surrounds the chip assembly and the TIM laterally. A lid structure is disposed over the substrate and encapsulates the chip assembly therein. The lid structure includes one or more openings that expose portions of the TIM. The one or more openings accommodate an expansion of the TIM.

Abstract: A package structure includes a substrate a first die, a first thermal conductive layer, a heat spreader and a second thermal conductive layer. The first die is bonded to the substrate and has a plurality of protrusions thereon. The first thermal conductive layer covers the first die. The heat spreader is disposed on the substrate to cover the first die. The second thermal conductive layer is different from the first thermal conductive layer, wherein the second thermal conductive layer is disposed between the first thermal conductive layer and the heat spreader, and the first thermal conductive layer is inserted between the protrusions of the first die.

Abstract: A method includes placing a package, which includes a first package component, a second package component, and an encapsulant encapsulating the first package component and the second package component therein. The method further includes attaching a first thermal interface material over the first package component, attaching a second thermal interface material different from the first thermal interface material over the second package component, and attaching a heat sink over both of the first thermal interface material and the second thermal interface material.

Abstract: Communication-capable devices such as commercial Wi-Fi devices can be used for integrated sensing and communications (ISAC) systems to jointly exchange data and monitor environment. Such devices typically require diverse signal processing such as machine learning inference that demands high-power operations for real-time sensing and computing. The present invention provides a way to realize energy-efficient computing by exploiting the capability of data communications to access distributed computing resources including classical computers and quantum computers over networks. The system and method are based on the realization that computationally intensive processing is offloaded to networked hybrid classical-quantum computing to build dynamic computing graphs. Some embodiments use automated classical-quantum machine learning whose circuits and hyperparameters are automatically adjusted via gradient or heuristic optimization for Wi-Fi indoor monitoring and human tracking.

Abstract: The present invention relates to an electric drum, which comprises a dual-gear reduction mechanism that comprises at least one stage of sun dual-gear, N planetary dual-gear sets and a gear ring; the at least one stage of sun dual-gear is coaxially arranged with an output gear shaft of a motor; the N planetary dual-gear sets surround the at least one stage of sun dual-gear, and the structure of each planetary dual-gear set comprises a planetary pin, on which at least one stage of planetary dual-gears and an output planetary gear are sequentially sleeved in an axial direction; two ends of the planetary pin are fixedly connected with fixing parts in the drum body; the various stages of sun dual-gears are sequentially engaged with the planetary dual-gears, and finally the drum body is driven to rotate via the engagement between the output planetary gear and the gear ring; the N planetary dual-gears in each stage are evenly distributed around the sun dual-gear, and N is greater than or equal to 3.

Abstract: A package structure includes a package substrate, a semiconductor module on the package substrate, a package lid on the semiconductor module and attached to the package substrate, and a hybrid thermal interface material (TIM) structure between the semiconductor module and the package lid, including a TIM layer and a vapor core heat spreader in the TIM layer.

Abstract: A semiconductor device including a substrate, a semiconductor package, a thermal conductive bonding layer and a lid is provided. The semiconductor package is disposed on the substrate. The thermal conductive bonding layer is disposed on the semiconductor package. The lid is attached to the semiconductor package via the thermal conductive bonding layer. The lid has a first cavity and a second cavity connected to the first cavity. The semiconductor package is located in the first cavity, and the thermal conductive bonding layer is partially disposed in the second cavity. The second cavity has a first portion and a second portion joined with the first portion and narrower than the first portion, the second portion is located between the first portion and the first cavity, and the thermal conductive bonding layer is formed in the second portion. A method for manufacturing a semiconductor device is also provided.

Abstract: The present disclosure provides a system and a method for perceiving an object in a scene. The method comprises collecting features of a first radar image of the scene captured from a first sensor and a second radar image of the scene captured from a second sensor, each of the first radar image and the second radar image includes depth data. The method further comprises processing selected features of the collected features with a transformer neural network having a transformer architecture with self-attention over the selected features and cross-attention between object queries and the selected features to produce 2D+ embeddings of the object. The method further comprises processing the 2D+ embeddings with a detection neural network to perceive the object and produce an image of the scene with markings of the perceived object, and outputting the image of the scene with the markings of the perceived object.