Abstract: A semiconductor package includes a redistribution structure, a plurality of semiconductor devices, and a plurality of heat dissipation films. The plurality of semiconductor devices mounted on the redistribution structure. The plurality of heat dissipation films are respectively disposed on and jointly covering upper surfaces of the plurality of semiconductor devices. A plurality of trenches are respectively extended between each two of the plurality of heat dissipations and extended between each two of the plurality of semiconductor devices.

Abstract: The present disclosure discloses a method for determining a reflective surface of a steering gear and a focusing steering gear of an external level gauge. The method includes: obtaining a focal length and a specific reflection angle (101); determining an 0th step reflective surface (102) of the reflective surface of the steering gear based on the focal length and the specific reflection angle; determining an adjacent step reflective surface (103) by a geometric method based on the 0th step reflective surface; and if a number of steps of the reflective surface of the steering gear reaches a preset value, determining the reflective surface (104) of the steering gear based on the 0th step reflective surface and the adjacent step reflective surface. According to the present disclosure, a liquid level can be measured at an outer side of a side wall of a vertical liquid storage tank.

Abstract: A package structure includes a circuit substrate, a semiconductor package, a lid structure and a plurality of first spacer structures. The semiconductor package is disposed on and electrically connected to the circuit substrate. The lid structure is disposed on the circuit substrate covering the semiconductor package, wherein the lid structure is attached to the circuit substrate through an adhesive material. The plurality of first spacer structures is surrounding the semiconductor package, wherein the first spacer structures are sandwiched between the lid structure and the circuit substrate, and includes a top portion in contact with the lid structure and a bottom portion in contact with the circuit substrate.

Abstract: A method of fabricating an integrated fan-out package is provided. A ring-shaped dummy die and a group of integrated circuit dies are mounted over a carrier, wherein the group of integrated circuit dies are surrounded by the ring-shaped dummy die. The ring-shaped dummy die and the group of integrated circuit dies over the carrier are encapsulated with an insulating encapsulation. A redistribution circuit structure is formed on the ring-shaped dummy die, the group of integrated circuit dies and the insulating encapsulation, wherein the redistribution circuit structure is electrically connected to the group of integrated circuit dies, and the ring-shaped dummy die is electrically floating.

Abstract: Some embodiments of the present disclosure provide a semiconductor device. The semiconductor device includes: a bottom package; wherein an area of a contact surface between the conductor and the through via substantially equals a cross-sectional area of the through via, and the bottom package includes: a molding compound; a through via penetrating through the molding compound; a die molded in the molding compound; and a conductor on the through via. An associated method of manufacturing the semiconductor device is also disclosed.

Abstract: The present disclosure discloses a method for determining a reflective surface of a steering gear and a focusing steering gear of an external level gauge. The method includes: obtaining a focal length and a specific reflection angle (101); determining an 0th step reflective surface (102) of the reflective surface of the steering gear based on the focal length and the specific reflection angle; determining an adjacent step reflective surface (103) by a geometric method based on the 0th step reflective surface; and if a number of steps of the reflective surface of the steering gear reaches a preset value, determining the reflective surface (104) of the steering gear based on the 0th step reflective surface and the adjacent step reflective surface. According to the present disclosure, a liquid level can be measured at an outer side of a side wall of a vertical liquid storage tank.

Abstract: Methods are provided for determining properties of an anisotropic formation (including both fast and slow formations) surrounding a borehole. A logging-while-drilling tool is provided that is moveable through the borehole. The logging-while drilling tool has at least one dipole acoustic source spaced from an array of receivers. During movement of the logging-while-drilling tool, the at least one dipole acoustic source is operated to excite a time-varying pressure field in the anisotropic formation surrounding the borehole. The array of receivers is used to measure waveforms arising from the time-varying pressure field in the anisotropic formation surrounding the borehole. The waveforms are processed to determine a parameter value that represents shear directionality of the anisotropic formation surrounding the borehole.

Abstract: Semiconductor devices and methods of manufacture are provided, in which an adhesive is removed from a semiconductor die embedded within an encapsulant, and an interface material is utilized to remove heat from the semiconductor device. The removal of the adhesive leaves behind a recess adjacent to a sidewall of the semiconductor, and the recess is filled.

Abstract: A semiconductor structure includes a first semiconductor package, a second semiconductor package, a heat spreader and an dielectric layer. The first semiconductor package includes a plurality of first semiconductor chips and a first dielectric encapsulation layer disposed around the plurality of the first semiconductor chips. The second semiconductor package is disposed over and corresponds to one of the plurality of first semiconductor chips, wherein the second semiconductor package includes a plurality of second semiconductor chips and a second dielectric encapsulation layer disposed around the plurality of second semiconductor chips. The heat spreader is disposed over and corresponds to another of the plurality of first semiconductor chips. The dielectric layer is disposed over the first semiconductor package and around the second semiconductor package and the heat spreader.

Abstract: An embodiment is a device including a package component including an integrated circuit die and conductive connectors connected to the integrated circuit die, the conductive connectors disposed at a first side of the package component. The device also includes a metal layer on a second side of the package component, the second side being opposite the first side. The device also includes a thermal interface material on the metal layer. The device also includes a lid on the thermal interface material. The device also includes a retaining structure on sidewalls of the package component and the thermal interface material. The device also includes a package substrate connected to the conductive connectors, the lid being adhered to the package substrate.

Abstract: A method includes placing a package, which includes a first package component, a second package component, and an encapsulant encapsulating the first package component and the second package component therein. The method further includes attaching a first thermal interface material over the first package component, attaching a second thermal interface material different from the first thermal interface material over the second package component, and attaching a heat sink over both of the first thermal interface material and the second thermal interface material.

Abstract: A jig for manufacturing a semiconductor package includes a bottom piece and an upper piece. The bottom piece includes a base, a support plate, and at least one elastic connector. The support plate is located in a central region of the base. The at least one elastic connector is interposed between the support plate and the base. The upper piece includes a cap and outer flanges. The cap overlays the support plate when the upper piece is disposed on the bottom piece. The outer flanges are disposed at edges of the cap, connected with the cap. The outer flanges contact the base of the bottom piece when the upper piece is disposed on the bottom piece. The cap includes an opening which is a through hole. When the upper piece is disposed on the bottom piece, a vertical projection of the opening falls entirely on the support plate.

Abstract: Communication-capable devices such as commercial Wi-Fi devices can be used for integrated sensing and communications (ISAC) systems to jointly exchange data and monitor environment. Such devices typically require diverse signal processing such as machine learning inference that demands high-power operations for real-time sensing and computing. The present invention provides a way to realize energy-efficient computing by exploiting the capability of data communications to access distributed computing resources including classical computers and quantum computers over networks. The system and method are based on the realization that computationally intensive processing is offloaded to networked hybrid classical-quantum computing to build dynamic computing graphs. Some embodiments use automated classical-quantum machine learning whose circuits and hyperparameters are automatically adjusted via gradient or heuristic optimization for Wi-Fi indoor monitoring and human tracking.

Abstract: A jig for manufacturing a semiconductor package includes a bottom piece and an upper piece. The bottom piece includes a base, a support plate, and at least one elastic connector. The support plate is located in a central region of the base. The at least one elastic connector is interposed between the support plate and the base. The upper piece includes a cap and outer flanges. The cap overlays the support plate when the upper piece is disposed on the bottom piece. The outer flanges are disposed at edges of the cap, connected with the cap. The outer flanges contact the base of the bottom piece when the upper piece is disposed on the bottom piece. The cap includes an opening which is a through hole. When the upper piece is disposed on the bottom piece, a vertical projection of the opening falls entirely on the support plate.

Abstract: A multi-user scheduling method based on reinforcement learning for 5G IoT, including: calculating the achievable rate of each user in a set according to a communication scenario model; generating an initial scheduled users set according to the achievable rate of each user; according to the achievable rate of each user and the number of times each user is scheduled, evaluating the estimated value of each user's action value under the current scheduling period by using the Q-learning method; determining the upper bound value of the confidence interval of each user's action value; determining the set of scheduled users under the current scheduling period according to the upper bound of the confidence interval of each user's action value; according to the set of scheduled users under the current scheduling period, recalculating the actual achievable rate value of each selected user under the current scheduling period.

Abstract: A computer-implemented method is provided for discovering heterogenous neighbors in coexisting IoT networks including at least one Wi-Fi device and at least one of Zigbee coordinators, ZigBee routers and ZigBee end devices. The method includes generating a broadcast packet such that the broadcast packet emulates a ZigBee broadcast frame, transmitting the emulated broadcast packet using a transceiver of the at least one Wi-Fi device according to cross-technology communication (CTC) method, wherein the emulated broadcast packet is configured to trigger the at least one of the Zigbee coordinators and ZigBee routers having received the emulated broadcast packet to rebroadcast the received packet.

Abstract: A method of forming a semiconductor structure includes: attaching a semiconductor device to a first surface of a substrate; placing a thermal interface material (TIM) film over a first side of the semiconductor device distal from the substrate, where the TIM film is pre-formed before the placing, where after the placing, a peripheral portion of the TIM film extends laterally beyond sidewalls of the semiconductor device; and attaching a lid to the first surface of the substrate to form an enclosed space between the lid and the substrate, where after attaching the lid, the semiconductor device and the TIM film are disposed in the enclosed space, where a first side of the TIM film distal from the substrate contacts the lid.

Abstract: The present disclosure provides a system and a method for detecting and tracking objects. The method includes permuting an order of frames in a sequence of radar image frames to produce multiple permuted sequences with different frames at a dominant position in a corresponding permuted sequence of radar image frames. Each permuted sequence of radar image frames is processed with a first neural network to produce temporally enhanced features for each of the frames in the sequence of radar image frames. Further a feature map is reconstructed from the temporally enhanced features of each of the frames in the sequence of radar image frames to produce a sequence of feature maps. The method further includes processing a list of feature vectors from each feature map with a second neural network to produce temporally enhanced heatmaps.

Abstract: A radar system for tracking an object in a scene by transmitting frequency modulated continuous wave (FMCW) is provided. The radar system is configured to collect radar measurements of the scene sampled in a time-frequency domain within an intermediate frequency (IF) bandwidth to which reflection of the transmitted FMCW is shifted by mixing with a copy of the FMCW, where a frequency dimension of the time-frequency domain is quantized into multiple frequency bins forming the frequency bandwidth, where a time dimension of the time-frequency domain is quantized into multiple time instances forming a time interval corresponding to the PRI, count a number of amplitude peaks of the radar measurements for each frequency bin at different instances of time, identify a number of frequency bins with their counts of the number of peaks above a predetermined threshold, and determine at least a distance to the object based on frequency analysis of the radar measurements.

Abstract: A package structure includes first and second package components, an underfill layer disposed between the first and second package components, and a metallic layer. The first package component includes semiconductor dies, a first insulating encapsulation laterally encapsulating the semiconductor dies, and a redistribution structure underlying first surfaces of the semiconductor dies and the first insulating encapsulation. The second package component underlying the first package component is electrically coupled to the semiconductor dies through the redistribution structure. The underfill layer extends to cover a sidewall of the first package component, the metallic layer overlying second surfaces of the semiconductor dies and the first insulating encapsulation, and a peripheral region of the second surface of the first insulating encapsulation is accessibly exposed by the metallic layer, where the first surfaces are opposite to the second surfaces.