Abstract: A Bluetooth-enabled device is provided, the Bluetooth-enabled device being configured to control a radio frequency (RF) chain during a first period to receive at a single antenna selected from a plurality of antennas, a constant tone extension (CTE) signal of multiple frames transmitted by the Bluetooth-enabled transmitter over multiple frequencies. Further the RF chain is controlled during a second period to switch among the plurality of antennas to receive the CTE signal at each of the plurality of antennas. An initial time-of-flight (ToF) data of the CTE signal is determined from first samples of the CTE signal received during the first period. Further, the Bluetooth-enabled transmitter is localized with respect to a location of the Bluetooth-enabled device using a signal model connecting samples of the CTE signal with an unknown angle-of-arrival of the CTE signal received at specific times, an unknown ToF conditioned on the initial ToF data.

Abstract: A semiconductor structure includes a first semiconductor package, a second semiconductor package, a heat spreader and an underfill layer. The first semiconductor package includes a plurality of lower semiconductor chips and a first dielectric encapsulation layer disposed around the plurality of the lower semiconductor chips. The second semiconductor package is disposed over and corresponds to one of the plurality of lower semiconductor chips, wherein the second semiconductor package includes a plurality of upper semiconductor chips and a second dielectric encapsulation layer disposed around the plurality of upper semiconductor chips. The heat spreader is disposed over and corresponds to another of the plurality of lower semiconductor chips. The underfill layer is disposed over the first semiconductor package and around the second semiconductor package and the heat spreader.

Abstract: Systems, apparatuses, methods, and computer program products are disclosed for disaggregating seasonal load from overall electricity consumption. An example method includes receiving, by a disaggregation system, historical data comprising (i) historical daily load data for a residence for a particular time period and (ii) an average temperature at the residence for each day in the particular time period. The example method further includes fitting, by the disaggregation system, a data model to the historical data, and calculating, by the disaggregation system and using the data model, an estimated seasonal load for a target time period. The example method further includes causing, by the disaggregation system, one or more notifications to be provided based on the estimated seasonal load for the target time period. Corresponding apparatuses and computer program products are also disclosed.

Abstract: A method of forming a semiconductor structure includes: attaching a semiconductor device to a first surface of a substrate; placing a thermal interface material (TIM) film over a first side of the semiconductor device distal from the substrate, where the TIM film is pre-formed before the placing, where after the placing, a peripheral portion of the TIM film extends laterally beyond sidewalls of the semiconductor device; and attaching a lid to the first surface of the substrate to form an enclosed space between the lid and the substrate, where after attaching the lid, the semiconductor device and the TIM film are disposed in the enclosed space, where a first side of the TIM film distal from the substrate contacts the lid.

Abstract: A lesion detection system for use with a patient, comprising an optoacoustic guide wire assembly configured to be insertable into a patient's tissue. The optical acoustic guide wire assembly can be comprised of an optical waveguide have a first end and a second end, a light source coupled to the second end of the optical waveguide, wherein said light source configured to emit energy to the patient's tissue, at least one transducer configured to detect an ultrasound signal emitted from the patient's tissue in response to energy emitted from the light source, and a computer system.

Abstract: A PERC solar cell selective emitter includes a silicon wafer, first and second doped regions and a laser doped region with doped layers. First doped regions are located between the doped regions of each doped layer, and each second doped region is located between two adjacent doped layers. The PERC solar cell includes the selective emitter, a front anti-reflective layer on the surface of a front passivation layer, and a positive electrode. The positive electrode includes first silver paste layers on the surfaces of the laser doped regions and second silver paste layers on the surface of the front anti-reflective layer corresponding to the first doped regions. The second silver paste layers are in electrical contact with the first silver paste layers. Damage of laser to silicon wafers is reduced, compounding in silver paste areas is reduced, an open circuit voltage is increased, and battery efficiency is improved.

Abstract: A tracking system for tracking an expanded state of an object is provided. The tracking system executes, for a predetermined time period, a probabilistic filter that iteratively tracks a belief on the expanded state of the object, wherein the belief is predicted using a motion model of the object and is further updated using a compound measurement model of the object. After the predetermined time period, the updated beliefs are smoothed to generate a state-decoupled online batch of training data. The compound measurement model includes multiple probabilistic distributions constrained to lie around a contour of the object with a predetermined relative geometrical mapping to the center of the object. The compound measurement model is updated using the online batch of training data. Further, the tracking system tracks the expanded state of the object based on the updated compound measurement model.

Abstract: A system and a method for tracking an expanded state of an object including a kinematic state indicative of a position of the object and an extended state indicative of one or combination of a dimension and an orientation of the object is provided herein. The system comprises at least one sensor configured to probe a scene including a moving object with one or multiple signal transmissions to produce one or multiple measurements of the object per the transmission, and a processor configured to execute a probabilistic filter tracking a joint probability of the expanded state of the object estimated by a motion model of the object and a measurement model of the object, wherein the measurement model includes a center-truncated distribution having truncation intervals. The system further comprises an output interface configured to output the expanded state of the object.

Abstract: Systems and methods are provided for multi-spectral or hyper-spectral fluorescence imaging. In one example, a spectral encoding device may be positioned in a detection light path between a detection objective and an imaging sensor of a microscope. In one example, the spectral encoding device includes a first dichroic mirror having a sine transmittance profile and a second dichroic mirror having a cosine transmittance profile. In addition to collecting transmitted light, reflected light from each dichroic mirror is collected and used for total intensity normalization and image analysis.

Abstract: A method includes bonding a second package component to a first package component, bonding a third package component to the first package component, attaching a dummy die to the first package component, encapsulating the second package component, the third package component, and the dummy die in an encapsulant, and performing a planarization process to level a top surface of the second package component with a top surface of the encapsulant. After the planarization process, an upper portion of the encapsulant overlaps the dummy die. The dummy die is sawed-through to separate the dummy die into a first dummy die portion and a second dummy die portion. The upper portion of the encapsulant is also sawed through.

Abstract: A package structure includes a package substrate, a first semiconductor package and a second semiconductor package, an underfill material, a gap filling structure and a heat dissipation structure. The first semiconductor package and the second semiconductor package are electrically bonded to the package substrate. The underfill material is disposed to fill a first space between the first semiconductor package and the package substrate and a second space between the second semiconductor package and the package substrate. The gap filling structure is disposed over the package substrate and in a first gap laterally between the first semiconductor package and the second semiconductor package. The heat dissipation structure is disposed on the package substrate and attached to the first semiconductor package and the second semiconductor package through a thermal conductive layer.

Abstract: A package structure includes a first semiconductor die, a first insulating encapsulation, a thermal coupling structure, and a heat dissipating component thermally coupled to the first semiconductor die through the thermal coupling structure. The first semiconductor die includes an active side, a rear side, and a sidewall connected to the active side and the rear side. The first insulating encapsulation extends along the sidewall of the first semiconductor die and includes a first side substantially leveled with the active side, a second side opposite to the first side, and topographic features at the second side. The thermal coupling structure includes a metallic layer overlying and the rear side of the first semiconductor die and the topographic features of the first insulating encapsulation. A manufacturing method of a package structure is also provided.

Abstract: A computer-executed method is provided for IEEE 802.15.4 devices based on an active carrier sense based carrier-sense multiple access with collision avoidance (ACS-CSMA/CA) control program and standard CSMA/CA control program for coexistence of an IEEE 802.15.4 network composing of IEEE 802.15.4 devices and IEEE 802.11 network composing of IEEE 802.11 devices sharing frequency spectra between the networks. The computer-executed method is provided on an IEEE 802.15.4 device, and causes a processor of the IEEE 802.15.4 device to perform steps that include estimating a severity of IEEE 802.11 interference based on a severity estimation metric, selecting the ACS-CSMA/CA control program based on the estimated severity.

Abstract: A package structure includes first/second/third package components, a thermal interface material (TIM) structure overlying the first package component opposite to the second package component, and a heat dissipating component disposed on the third package component and thermally coupled to the first package component through the TIM structure. The first package component includes semiconductor dies and an insulating encapsulation encapsulating the semiconductor dies, the second package component is interposed between the first and third package components, and the semiconductor dies are electrically coupled to the third package component via the second package component. The TIM structure includes a dielectric dam and thermally conductive members including a conductive material, disposed within areas confined by the dielectric dam, and overlying the semiconductor dies. A manufacturing method of a package structure is also provided.

Abstract: A frequency modulation continuous wave (FMCW)-based system configured to convert measurements of a linearly modulated wave from a time-domain into a frequency-domain to produce a non-linear frequency signal, where the non-linear frequency signal comprises a known linear component representing the desired linear modulation and an unknown non-linear component representing the non-linearity of the modulation. The FMCW-based system is further configured to determine coefficients of a basis function approximating a difference between the non-linear frequency signal and the linear frequency component in the frequency domain. The FMCW-based system is further configured to detect one or multiple spectrum peaks in the distorted beat signal with the distortion compensated according to the basis function with the determined coefficients to determine one or multiple distances to the one or multiple objects in the scene.

Abstract: A multiple input multiple output (MIMO) radar system for detecting a moving object is based on an explicit signal model. The explicit signal model accounts for waveform separation residuals by relating measurements of the virtual array to an auto-term including a Kronecker product of object-receiver signatures and transmitter-object signatures; and a cross-term including a Kronecker product of object-receiver signatures and transmitter-object residual signatures. The radar system uses a spatial MIMO object detector that is based on the explicit signal model to detect the moving object.

Abstract: A semiconductor package includes a redistribution structure, a plurality of semiconductor devices, and a plurality of heat dissipation films. The plurality of semiconductor devices mounted on the redistribution structure. The plurality of heat dissipation films are respectively disposed on and jointly covering upper surfaces of the plurality of semiconductor devices. A plurality of trenches are respectively extended between each two of the plurality of heat dissipations and extended between each two of the plurality of semiconductor devices.

Abstract: A package assembly may include a package substrate, a package lid attached to the package substrate and including a plate portion, an outer foot extending from the plate portion, and an inner foot extending from the plate portion inside the outer foot, and an adhesive that adheres the outer foot to the package substrate and the inner foot to the package substrate.

Abstract: In an embodiment, a device includes: a package component including an integrated circuit die and conductive connectors connected to the integrated circuit die, the conductive connectors disposed at a front-side of the package component, the integrated circuit die exposed at a back-side of the package component; a heat dissipation layer on the back-side of the package component and on sidewalls of the package component; an adhesive layer on a back-side of the heat dissipation layer, a portion of a sidewall of the heat dissipation layer being free from the adhesive layer; and a package substrate connected to the conductive connectors.

Abstract: A semiconductor device includes a substrate, a package structure, a thermal interface material (TIM) structure, and a lid structure. The package structure is disposed on the substrate. The TIM structure is disposed on the package structure. The TIM structure includes a metallic TIM layer and a non-metallic TIM layer in contact with the metallic TIM layer, and the non-metallic TIM layer surrounds the metallic TIM layer. The lid structure is disposed on the substrate and the TIM structure.