Patents by Inventor Qiang Shen

Qiang Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110309530
    Abstract: A method of manufacture of an integrated circuit packaging system includes: forming a paddle having an indented planar surface intersecting an outwardly extending planar surface at an angle of approximately 135 degrees plus 25 degrees or minus 5 degrees; mounting an integrated circuit over the paddle; and forming an encapsulation over the integrated circuit and under the extension void free.
    Type: Application
    Filed: June 18, 2010
    Publication date: December 22, 2011
    Inventors: Guo Qiang Shen, Jae Hak Yee, Feng Yao
  • Patent number: 8058981
    Abstract: A tire pressure-monitoring device (TPMD) directly mounted onto an air-pumping inlet-stem on a tire. The TPMD includes a light emitter connected to a battery through an electrical connecting loop wherein the electrical connecting loop comprising a plurality of electrical conductive structural components and at least two of the structural components are physically separated in a normal tire pressure condition and connected in a low pressure tire pressure condition for providing power to the light emitter for emitting a low tire pressure warning light.
    Type: Grant
    Filed: November 13, 2007
    Date of Patent: November 15, 2011
    Assignee: Kysonix, Inc.
    Inventors: James Y. Yang, Yunlong Min, Jianyun Yang, Qiang Shen, Huigang Tu
  • Publication number: 20110266664
    Abstract: A method of manufacture of an integrated circuit packaging system includes: applying a conductive material on a support structure; providing a bottom integrated circuit package having a bottom lead extended therefrom; attaching the bottom lead to the conductive material; stacking a top integrated circuit package over the bottom integrated circuit package, the top integrated circuit package having a top lead extending therefrom and the top lead over the bottom lead; attaching a conductive paste at an end portion of the top lead; and forming a stacking joint by flowing the conductive paste and the conductive material, the stacking joint below the top lead as well as below and above the bottom lead.
    Type: Application
    Filed: April 30, 2010
    Publication date: November 3, 2011
    Inventors: Guo Qiang Shen, Jae Hak Yee, Denver Zhu
  • Patent number: 8037918
    Abstract: Pick-up heads and systems are especially useful for picking up, transporting, and placing semiconductor dies at bond sites on packaging substrates. Alternatively, the heads and systems are useful for performing these tasks with any of various other planar objects. An exemplary head includes a shank and a body. The body includes a compliant end portion contactable by the shank, and the end portion includes a face. The shank is movable relative to the end portion such that, whenever the shank is retracted, the face has a substantially planar contour, and whenever the shank is extended, the shank contacts and urges the end portion to provide the face with a convex contour. The end portion desirably defines at least one vacuum orifice connected to an evacuation device (e.g., a vacuum pump) that evacuates the vacuum orifice sufficiently to cause the planar object to adhere to the face.
    Type: Grant
    Filed: December 4, 2006
    Date of Patent: October 18, 2011
    Assignee: Stats Chippac, Inc.
    Inventors: Ya Ping Wang, Jian Ming Yang, Guo Qiang Shen, Chee Keong Chin
  • Patent number: 8024644
    Abstract: Provided are systems, methods and techniques that use an embedded error-detection code within a received communication signal to determine when to stop iterative decoding of the communication signal.
    Type: Grant
    Filed: November 14, 2006
    Date of Patent: September 20, 2011
    Assignee: VIA Telecom Co., Ltd.
    Inventor: Qiang Shen
  • Publication number: 20110194555
    Abstract: A receiver for maintaining parameters of packets received from a transmitter is provided. In the receiver: a first module receives packets from the transmitter and decodes the packets to obtain corresponding payload data, wherein each received packet is transmitted in accordance with a first set of parameters predetermined before decoding of the packets, a second set of parameters which are dynamically determined when the packets are being decoded, and a third set of parameters which are determined after the packets have been decoded. Also, a record generating module generates a record for each received packet, wherein the record comprises the first set, the second set, and the third set of parameters and a buffering module stores the record and corresponding payload data of each received packet. A second module retrieves the record and corresponding payload data from the buffering module, and processes the corresponding payload data according to the record.
    Type: Application
    Filed: February 8, 2010
    Publication date: August 11, 2011
    Applicant: VIA TELECOM, INC.
    Inventors: Qiang Shen, Tarun Tandon, Alon Saado
  • Patent number: 7989941
    Abstract: An integrated circuit package system including: providing a substrate having a support mounted thereover; mounting an integrated circuit die above the substrate; mounting a wire-bonded die offset above the integrated circuit die creating an overhang supported by the support; connecting the wire-bonded die to the substrate with bond wires; and encapsulating the integrated circuit die, the wire-bonded die and the bond wires with an encapsulation.
    Type: Grant
    Filed: March 19, 2008
    Date of Patent: August 2, 2011
    Assignee: Stats Chippac Ltd.
    Inventors: Chee Keong Chin, Guo Qiang Shen, Ya Ping Wang
  • Publication number: 20100329307
    Abstract: A heat sink tester for pressing a heat sink against a simulation heat source includes a base, a pressing assembly and a supporting device. The base is for supporting the heat sink thereon. The pressing assembly presses the heat sink against the base along a first direction. The supporting device is for supporting the simulation heat source thereon. The supporting device pushes the simulation heat source through the base to engage against the heat sink along a second direction opposite to the first direction.
    Type: Application
    Filed: August 19, 2009
    Publication date: December 30, 2010
    Applicants: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: DENG-QIANG SHEN, HONG-XUE CHEN, DAN HUANG, XIN-XIANG ZHA
  • Patent number: 7849125
    Abstract: A system and method for computing A mod (2n?1), where A is an m bit quantity, where n is a positive integer, where m is greater than or equal to n. The quantity A may be partitioned into a plurality of sections, each being at most n bits long. The value A mod (2n?1) may be computed by adding the sections in mod(2n?1) fashion. This addition of the sections of A may be performed in a single clock cycle using an adder tree, or, sequentially in multiple clock cycles using a two-input adder circuit provided the output of the adder circuit is coupled to one of the two inputs. The computation A mod (2n?1) may be performed as a part of an interleaving/deinterleaving operation, or, as part of an encryption/decryption operation.
    Type: Grant
    Filed: July 7, 2006
    Date of Patent: December 7, 2010
    Assignee: VIA Telecom Co., Ltd
    Inventor: Qiang Shen
  • Publication number: 20090325586
    Abstract: A mobile station that is configured to perform common channel cancellation may include a parameter estimation unit that is configured to estimate parameters for generating a common channel error. The mobile station may also include a common channel generation unit that is configured to generate the common channel error based on the parameters. The mobile station may also include an adder that is configured to subtract the common channel error from received data samples.
    Type: Application
    Filed: June 25, 2008
    Publication date: December 31, 2009
    Applicant: QUALCOMM INCORPORATED
    Inventors: Qiang Shen, Nathan Yee, Parvathanathan Subrahmanya
  • Patent number: 7640479
    Abstract: A method and apparatus for decoding and de-interleaving a received encoded and interleaved signal, the method employing and the apparatus including a single decoder coupled to a common buffer, the common buffer size equal to a frame of the received signal and the method further employing, and the apparatus further including, an address controller that causes data to be de-interleaved when read from the buffer and data to be interleaved when written to the buffer.
    Type: Grant
    Filed: March 3, 2008
    Date of Patent: December 29, 2009
    Assignee: LSI Corporation
    Inventor: Qiang Shen
  • Publication number: 20090236751
    Abstract: An integrated circuit package system including: providing a substrate having a support mounted thereover; mounting an integrated circuit die above the substrate; mounting a wire-bonded die offset above the integrated circuit die creating an overhang supported by the support; connecting the wire-bonded die to the substrate with bond wires; and encapsulating the integrated circuit die, the wire-bonded die and the bond wires with an encapsulation.
    Type: Application
    Filed: March 19, 2008
    Publication date: September 24, 2009
    Inventors: Chee Keong Chin, Guo Qiang Shen, Ya Ping Wang
  • Patent number: 7567515
    Abstract: Provided is a multi-layered transmission technique in which a signal indicating that a transmitted data packet has been correctly received by the receiver is provided from one communication layer to another. Based on that signal, the second layer releases the corresponding data from its retransmission buffer. As result, storage requirements for data waiting to be retransmitted, if necessary, often can be significantly reduced.
    Type: Grant
    Filed: November 4, 2005
    Date of Patent: July 28, 2009
    Assignee: VIA Telecom, Inc.
    Inventor: Qiang Shen
  • Publication number: 20090134990
    Abstract: A tire pressure-monitoring (TPM) system includes a TPM device directly mounted onto an air-pumping inlet on a tire. The TPM device further includes a mechanical triggering mechanism engaged to an air pressure through the air-pumping inlet pushing from an air filled in the tire. The triggering mechanism is triggered by a low tire pressure to turn on a micro-controller unit of the TPS device to send a radio frequency (RF) signal for warning a low tire-pressure of the tire. The tire pressure monitoring (TPS) system further includes a signal receiving system near a vehicle driver for receiving and processing the RF signal.
    Type: Application
    Filed: November 23, 2007
    Publication date: May 28, 2009
    Inventors: James Y. Yang, Yunlong Min, Jianyun Yang, Qiang Shen, Huigang Tu
  • Publication number: 20090121855
    Abstract: A tire pressure-monitoring device (TPMD) directly mounted onto an air-pumping inlet-stem on a tire. The TPMD includes a light emitter connected to a battery through an electrical connecting loop wherein the electrical connecting loop comprising a plurality of electrical conductive structural components and at least two of the structural components are physically separated in a normal tire pressure condition and connected in a low pressure tire pressure condition for providing power to the light emitter for emitting a low tire pressure warning light.
    Type: Application
    Filed: November 13, 2007
    Publication date: May 14, 2009
    Inventors: James Y. Yang, Yunlong Min, Jianyun Yang, Qiang Shen, Huigang Tu
  • Patent number: 7450556
    Abstract: A method and apparatus for communicating data signals using a spread spectrum cellular network, the cellular network including a plurality of base stations coupled to the cellular network the mobile unit assigned to one of the plurality of base stations. The method and apparatus receives a signal of another of the plurality of base stations (target base station) and determines the interference density to the target base station from the received signal.
    Type: Grant
    Filed: July 10, 2003
    Date of Patent: November 11, 2008
    Assignee: VIA Telecom Co., Ltd.
    Inventors: Qiang Shen, Stanislaw Czaja
  • Publication number: 20080222484
    Abstract: A method and apparatus for decoding and de-interleaving a received encoded and interleaved signal, the method employing and the apparatus including a single decoder coupled to a common buffer, the common buffer size equal to a frame of the received signal and the method further employing, and the apparatus further including, an address controller that causes data to be de-interleaved when read from the buffer and data to be interleaved when written to the buffer.
    Type: Application
    Filed: March 3, 2008
    Publication date: September 11, 2008
    Inventor: Qiang Shen
  • Publication number: 20080128081
    Abstract: Pick-up heads and systems including such heads are disclosed. The pick-up heads and systems are especially useful for picking up, transporting, and placing semiconductor dies at bond sites on packaging substrates. Alternatively, the heads and systems are useful for performing these tasks with any of various other planar objects. An exemplary head includes a shank and a body. The body includes a compliant end portion contactable by the shank, and the end portion includes a face. The shank is movable relative to the end portion such that, whenever the shank is retracted, the face has a substantially planar contour, and whenever the shank is extended, the shank contacts and urges the end portion to provide the face with a convex contour. The end portion desirably defines at least one vacuum orifice connected to an evacuation device (e.g., a vacuum pump) that evacuates the vacuum orifice sufficiently to cause the planar object to adhere to the face.
    Type: Application
    Filed: December 4, 2006
    Publication date: June 5, 2008
    Inventors: Ya Ping Wang, Jian Ming Yang, Guo Qiang Shen, Chee Keong Chin
  • Publication number: 20080115031
    Abstract: Provided are systems, methods and techniques that use an embedded error-detection code within a received communication signal to determine when to stop iterative decoding of the communication signal.
    Type: Application
    Filed: November 14, 2006
    Publication date: May 15, 2008
    Applicant: VIA Telecom Co., Ltd.
    Inventor: Qiang Shen
  • Patent number: 7340669
    Abstract: An apparatus comprising a first circuit, a second circuit and a third circuit. The first circuit may be configured to generate an output signal in response to a first intermediate signal and a second intermediate signal. The second intermediate signal comprises a series of bit pairs. The second circuit comprises a first and a second encoder and may be configured to generate the second intermediate signal in response to a third intermediate signal. The third circuit may be configured to generate the first intermediate signal and the third intermediate signal in response to a first address signal and a second address signal. The third circuit comprises a first multiplexer and a second multiplexer.
    Type: Grant
    Filed: March 11, 2005
    Date of Patent: March 4, 2008
    Assignee: VIA Telecom Co., Ltd.
    Inventor: Qiang Shen