Abstract: An example includes a housing, a stator assembly, a rotor, and a self-cooling structure. The stator assembly is mounted on the housing and fitted around the rotor, the rotor is rotatably housed within the housing, the self-cooling structure is attached to the rotor, and the self-cooling structure is located at the stator assembly. The self-cooling structure comprises an outer cylinder, an inner cylinder, and a plurality of blades, wherein the plurality of blades are radially connected between the inner cylinder and the outer cylinder. A ventilation slot is formed between the outer cylinder and the inner cylinder, with multiple end-face air intake holes formed at the ventilation slot, and side exhaust holes are formed between adjacent two blades, with the end-face air intake holes being in communication with the side exhaust holes. In this way, it is capable of actively dissipating heat within the motor without altering its form.

Abstract: A chip pad surface leveling device includes a signal control module, a glass carrying module and a temperature control module. The glass carrying module is configured to move a leveling glass substrate to contact a plurality of first convex pillar structures of a first chip or a plurality of second convex pillar structures of a second chip. The temperature control module is configured to apply a predetermined temperature to the first convex pillar structures or the second convex pillar structures, and the glass carrying module is configured to apply a predetermined pressure to the first convex pillar structures or the second convex pillar structures through the leveling glass substrate, thereby making a surface roughness of a bonding pad end of each first convex pillar structure or a surface roughness of a bonding pad end of each second convex pillar structure is not greater than 1 ?m.

Abstract: A heterogeneous chip stacking structure includes a first chip and a second chip. The first chip has a plurality of first convex pillar structures gradually formed outward from the first chip within a first predetermined time, and each of the first convex pillar structures has a first bonding pad portion. The second chip has a plurality of second convex pillar structures gradually formed outward from the second chip within a second predetermined time, and each of the second convex pillar structures has a second bonding pad portion. The first chip is configured to be disposed on the second chip, and the first bonding pad portions of the first convex pillar structures of the first chip and the second bonding pad portions of the second convex pillar structures of the second chip are in direct contact with each other and tightly coupled with each other, respectively.

Abstract: A heterogeneous chip stacking device includes a substrate carrying structure, a position-limiting substrate structure, a first cover structure, a second cover structure and a chip carrying structure. The position-limiting substrate structure is detachably disposed on the substrate carrying structure. The first cover structure is detachably disposed above the position-limiting substrate structure. The second cover structure is detachably disposed on the first cover structure. The chip carrying structure is movably disposed above the substrate carrying structure. The position-limiting substrate structure has a plurality of position-limiting grooves for respectively accommodating a plurality of first chips. The first cover structure is disposed on the first chips to press the first chips, and the first cover structure has a plurality of first openings configured to respectively accommodate a plurality of second chips.

Abstract: A heterogeneous chip stacking method includes providing a first chip, in which the first chip has a plurality of first convex pillar structures, and each first convex pillar structure has a first bonding pad portion; providing a second chip different from the first chip, in which the second chip has a plurality of second convex pillar structures, and each second convex pillar structures having a second bonding pad portion; placing the first chip on the second chip, in which the first bonding pad portions of the first convex pillar structures and the second bonding pad portions of the second convex pillar structures are in direct contact with each other respectively; and then applying at least one of a predetermined pressure, a predetermined temperature, and a predetermined ultrasonic frequency to tightly couple the first bonding pad portions and the second bonding pad portions with each other respectively.

Abstract: A portable electronic device, and an image-capturing device and an assembly method thereof are provided. The image-capturing device includes a carrier substrate, an image sensing chip, a filter element and a lens assembly. The carrier substrate has a through opening and a recessed space. The image sensing chip is disposed on the bottom side of the carrier substrate. The filter element is disposed in the recessed space of the carrier substrate, so that all or a part of the filter element is accommodated in the through opening. When at least one microparticle with a maximum particle size between 5 ?m and 25 ?m is located on the filter element, a shortest distance between the filter element and the image sensing chip is between 30 ?m and 200 ?m, so that the image sensing chip cannot capture a light spot generated due to blocking of the microparticle.

Abstract: A passive radiator module includes a cavity and two passive radiators, and the two passive radiators are disposed on an upper surface and a lower surface of the cavity respectively. Each of the two passive radiators includes a hang edge, a surrounding part and a diaphragm, the surrounding part surrounds the diaphragm, and the surrounding part is positioned between the hang edge and the diaphragm. Each of the upper surface and the lower surface includes a hollow part, the hang edge of any one of the two passive radiators is connected to a corresponding one of the upper surface and the lower surface, and the diaphragm of said any one of the two passive radiators is positioned in the hollow part of the corresponding one of the upper surface and the lower surface.

Abstract: The present subject matter relates to devices and techniques for preparing a sample. The disclosed device can include a mixer, a reaction channel, and a micro sprayer. The mixer can be configured to mix at least two components and perform a splitting and recombination (SAR) mixing. The micro sprayer can be configured to generate a droplet of the sample. The mixer and the micro sprayer can be coupled through the reaction channel. The reaction channel can be a microcapillary tubing or a yin-yang reaction channel.

Abstract: A SpyCatcher peptide-modified carrier, a protein immobilizing carrier, and a protein immobilizing method. The method comprises: linking a SpyCatcher peptide to a carrier so as to obtain a SpyCatcher peptide-modified carrier; and then based on a SpyCatcher-SpyTag reaction, immobilizing a target protein containing SpyTag to the SpyCatcher-modified carrier. A protein immobilization process in which the method is used is fast, a condition is mild, no extra chemical reagent is needed, the immobilization efficiency and an activity recovery rate are high, and the homogeneity is good.

Abstract: A microdevice for monitoring a target analyte is provided. The microdevice can include a field effect transistor comprising a substrate, a gate electrode, and a microfluidic channel including graphene. The microfluidic channel can be formed between drain electrodes and source electrodes on the substrate. The microdevice can also include at least one aptamer functionalized on a surface of the graphene. The at least one aptamer can be adapted for binding to the target analyte. Binding of the target analyte to the at least one aptamer can alter the conductance of the graphene.

Abstract: A silicone cup is provided. The silicone cup includes a body made of a silicone. The silicone cup also includes a plurality of concave measurement windows provided on an exterior surface of the body.

Abstract: A method for wafer image equalization includes obtaining a wafer image, converting the wafer image into bitmap data, generating a grayscale distribution of RGB pixels according to the bitmap data, generating a grayscale cumulative probability distribution of the RGB pixels according to the grayscale distribution, generating a mapping function according to the grayscale cumulative probability distribution of the RGB pixels, converting the grayscale distribution of the RGB pixels by the mapping function into an equalized grayscale distribution of the RGB pixels, and generating an equalized wafer image according to the equalized grayscale distribution of the RGB pixels.

Abstract: The present disclosure pertains to the technical field of electric motors, and discloses an electric motor and an electric toy. The electric motor includes a stator assembly, a rotor assembly, a front end cover assembly, a rear end cover assembly, a three-phase power line, and a data transmission line. The rotor assembly is sleeved on the stator assembly. The rotor assembly includes a magnetic ring, a magnetic knitting frame, an iron core, several tile-shaped magnets, a rotating shaft, and a rotor end plate. A positioning slot is arranged between adjacent tile-shaped magnets. The magnetic knitting frame is provided with a positioning boss that is inserted into the structure of the positioning slot. The electric motor allows the accurate positioning and assembling of the rotor assembly, so that the magnetic poles of the magnetic ring correspond to the magnetic poles of the tile-shaped magnet.

Abstract: An electric motor and an electric toy, wherein the electric motor includes a stator assembly, a rotor assembly, a front end cover assembly, a rear end cover assembly, a three-phase power line, and a data transmission line. The rotor assembly is sleeved on the stator assembly. The rotor assembly includes a magnetic ring, a magnetic knitting frame, an iron core, several tile-shaped magnets, a rotating shaft, and a rotor end plate. A positioning slot is arranged between adjacent tile-shaped magnets. The magnetic knitting frame is provided with a positioning boss that is inserted into the structure of the positioning slot. The electric motor allows the accurate positioning and assembling of the rotor assembly, so that the magnetic poles of the magnetic ring correspond to the magnetic poles of the tile-shaped magnet.

Abstract: A portable electronic device, and an image-capturing device and an assembly method thereof are provided. The image-capturing device includes a carrier substrate, an image sensing chip, a filter element and a lens assembly. The carrier substrate has a through opening and a recessed space. The image sensing chip is disposed on the bottom side of the carrier substrate. The filter element is disposed in the recessed space of the carrier substrate, so that all or a part of the filter element is accommodated in the through opening. When at least one microparticle with a maximum particle size between 5 ?m and 25 ?m is located on the filter element, a shortest distance between the filter element and the image sensing chip is between 30 ?m and 200 ?m, so that the image sensing chip cannot capture a light spot generated due to blocking of the microparticle.