Abstract: The present disclosure provides a backlight module and a display device. The backlight module includes a plurality of first light sources and a diffusion plate. In a 3D display mode, the first light sources belong to different scanning areas, each of which corresponds to a display area. The backlight module further includes a barrier structure provided corresponding to the respective scanning areas and configured to prevent light emitted by first light sources in the scanning areas other than a current scanning area from entering into a display area corresponding to the current scanning area. In the backlight module of the present disclosure, the barrier structure is provided corresponding to each scanning area, which can prevent light emitted by first light sources in other scanning areas from entering into the display area corresponding to the current scanning area.

Abstract: The present disclosure relates to a lamp with pluggable control interface including a head, a power device electrically connecting to the head, a body, and a control interface device. The body is configured with a receiving chamber, a heat sink, and a connection portion connecting to the power device. The control interface device includes a plug-in end, a first circuit board electrically connecting to the plug-in end, a controller configured on the first circuit board, the plug-in end engages with the connection portion, and the controller is configured to turn on or off the lamp or to turn on a dimming function.

Abstract: The present invention provides a method of treating, ameliorating or inhibiting sirtuin-associated disorders and/or conditions in a subject in need thereof, by administering to the subject an effective amount of an ANXA1 peptide.

Abstract: A method of manufacturing an accelerometer, including placing a magnet on a substrate, laminating a dielectric layer over the magnet, forming a conductive layer over the dielectric layer, the conductive layer including a mass and a conductive path overlying the magnet, removing a portion of the dielectric layer proximate the mass and conductive path such that the mass is movable in response to acceleration of the accelerometer, and forming a dielectric layer over the mass to form a space between the mass and the dielectric layer formed over the mass sufficiently clear such that the mass remains movable.

Abstract: A glass core substrate for an integrated circuit (IC) device may be formed to include a glass core and build-up structures on opposing sides of the glass core. Electrically conductive terminals may be formed on both sides of the glass core substrate. An IC die may be coupled with the terminals on one side of the substrate, whereas the terminals on the opposing side may be coupled with a next-level component, such as a circuit board. The glass core may comprise a single piece of glass in which conductors have been formed, or the glass core may comprise two or more glass sections that have been joined together, each section having conductors. The conductors extend through the glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the glass core. Other embodiments are described and claimed.

Abstract: A display device and a display method are provided. The display device includes a plurality of transparent display units configured to emit imaging light along a same direction and arranged in sequence with spaces therebetween along a light-emitting direction of the imaging light; and a layer-by-layer scan circuit configured to respectively input a plurality of depth images of a same three-dimensional (3D) image into corresponding transparent display units in the plurality of transparent display units, wherein, the plurality of depth images have different depth ranges; and upon each transparent display unit displaying the inputted depth image, the layer-by-layer scan circuit is configured to control transparent display units on a display side of the each transparent display unit to be in a transparent state.

Abstract: Embodiments of the present description relate to the field of fabricating microelectronic structures. The microelectronic structures may include a glass routing structure formed separately from a trace routing structure, wherein the glass routing structure is incorporated with the trace routing substrate, either in a laminated or embedded configuration. Also disclosed are embodiments of a microelectronic package including at least one microelectronic device disposed proximate to the glass routing structure of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects. Further, disclosed are embodiments of a microelectronic structure including at least one microelectronic device embedded within a microelectronic encapsulant having a glass routing structure attached to the microelectronic encapsulant and a trace routing structure formed on the glass routing structure.

Abstract: The present disclosure provides compositions and methods for treating post-operative cognitive dysfunction with Annexin A1 (ANXA1) peptides.

Abstract: An electronic device and methods including a switch formed in a chip package are shown. An electronic device and methods including a switch formed in a polymer based dielectric are shown. Examples of switches shown include microelectromechanical system (MEMS) structures, such as cantilever switches and/or shunt switches.

Abstract: The present disclosure discloses a light guide plate, a backlight module and a liquid crystal module. The light guide plate includes a plurality of light guide blocks; the light guide blocks are doped with scattering particles. Since the light guide plate includes a plurality of light guide blocks, this can simplify the cutting of the light guide plate and the making of grid points. The light guide blocks are doped with scattering particles, so that most of rays incident upon the light guide blocks are scattered in a preset direction and guided to a middle part and the light-far end of the backlight module to compensate the brightness of the middle part and the light-far end, thus making the brightness of the side light type backlight display uniform.

Abstract: Embodiments of the invention relate to a light guide plate, a method for fabricating the same and a backlight unit. The light guide plate comprises a low density region and a plurality of high density regions, wherein the plurality of high density regions are separately disposed on a light incident side of the light guide plate.

Abstract: Embodiments of the invention provides an electromagnetic induction antenna plate, a backlight and a display device, and the electromagnetic induction antenna plate comprises a wiring layer and a fixing structure for attaching the wiring layer to a back plate of a backlight, wherein the wiring layer comprises a first surface facing the back plate and a second surface coated with a reflective material and facing a light guide plate of the backlight when mounted to the backlight.

Abstract: Embodiments of the present description relate to the field of fabricating microelectronic substrates. The microelectronic substrate may include a trace routing structure disposed between opposing glass layers. The trace routing structure may comprise one or more dielectric layers having conductive traces formed thereon and therethrough. Also disclosed are embodiments of a microelectronic package including a microelectronic device disposed proximate one glass layer of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects.

Abstract: Disclosed are embodiments of a substrate for an integrated circuit (IC) device. The substrate includes a core comprised of two or more discrete glass layers that have been bonded together. A separate bonding layer may be disposed between adjacent glass layers to couple these layers together. The substrate may also include build-up structures on opposing sides of the multi-layer glass core, or perhaps on one side of the core. Electrically conductive terminals may be formed on both sides of the substrate, and an IC die may be coupled with the terminals on one side of the substrate. The terminals on the opposing side may be coupled with a next-level component, such as a circuit board. One or more conductors extend through the multi-layer glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the core. Other embodiments are described and claimed.

Abstract: Embodiments of the present description relate to the field of fabricating microelectronic structures. The microelectronic structures may include a glass routing structure formed separately from a trace routing structure, wherein the glass routing structure is incorporated with the trace routing substrate, either in a laminated or embedded configuration. Also disclosed are embodiments of a microelectronic package including at least one microelectronic device disposed proximate to the glass routing structure of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects. Further, disclosed are embodiments of a microelectronic structure including at least one microelectronic device embedded within a microelectronic encapsulant having a glass routing structure attached to the microelectronic encapsulant and a trace routing structure formed on the glass routing structure.

Abstract: An electronic device and methods including a switch formed in a chip package are shown. An electronic device and methods including a switch formed in a polymer based dielectric are shown. Examples of switches shown include microelectromechanical system (MEMS) structures, such as cantilever switches and/or shunt switches.

Abstract: Disclosed are embodiments of a glass core substrate for an integrated circuit (IC) device. The glass core substrate includes a glass core and build-up structures on opposing sides of the glass core. Electrically conductive terminals may be formed on both sides of the glass core substrate. An IC die may be coupled with the terminals on one side of the substrate, whereas the terminals on the opposing side may be coupled with a next-level component, such as a circuit board. The glass core may comprise a single piece of glass in which conductors have been formed, or the glass core may comprise two or more glass sections that have been joined together, each section having conductors. The conductors extend through the glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the glass core. Other embodiments are described and claimed.

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations for integrated circuit package assemblies including a glass solder mask layer and/or bridge. In one embodiment, an apparatus includes one or more build-up layers having electrical routing features and a solder mask layer composed of a glass material, the solder mask layer being coupled with the one or more build-up layers and having openings disposed in the solder mask layer to allow coupling of package-level interconnect structures with the electrical routing features through the one or more openings. Other embodiments may be described and/or claimed.

Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a microfluidic die to a package structure, wherein the microfluidic die comprises a plurality of asymmetric electrodes that may be coupled with signal pads disposed within the package structure.

Abstract: A backlight source and a display device are provided. The backlight source includes a backplate (1), a light source (2) and a diffuser plate (3). The light source (2) is provided on a face of the backplate (1), the diffuser plate (3) is parallel to the face of the backplate (1), and the diffuser plate (3) is provided at a side of the backplate (1), where the light source (2) is provided, and is opposite to light source (2); and a support pole (31) is further provided between the diffuser plate (3) and the backplate (1), and the support pole (31) and the diffuser plate (1) are made of a same material and formed integrally.