Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a microfluidic die to a package structure, wherein the microfluidic die comprises a plurality of asymmetric electrodes that may be coupled with signal pads disposed within the package structure.

Abstract: A backlight source and a display device are provided. The backlight source includes a backplate (1), a light source (2) and a diffuser plate (3). The light source (2) is provided on a face of the backplate (1), the diffuser plate (3) is parallel to the face of the backplate (1), and the diffuser plate (3) is provided at a side of the backplate (1), where the light source (2) is provided, and is opposite to light source (2); and a support pole (31) is further provided between the diffuser plate (3) and the backplate (1), and the support pole (31) and the diffuser plate (1) are made of a same material and formed integrally.

Abstract: A touch display device is provided to depress the chance that the touch display device generates bubble, mura or similar bad phenomena. The touch display device includes a touch screen (1) and a display panel (2) arranged opposite to each other, and at least two insert-fitting structures (3) located between the touch screen (1) and the display panel (2), and the touch screen (1) and the display panel (2) are connected with each other in an insert-fitting way through the insert-fitting structures (3).

Abstract: Embodiments of the present description relate to the field of fabricating microelectronic structures. The microelectronic structures may include a glass routing structure formed separately from a trace routing structure, wherein the glass routing structure is incorporated with the trace routing substrate, either in a laminated or embedded configuration. Also disclosed are embodiments of a microelectronic package including at least one microelectronic device disposed proximate to the glass routing structure of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects. Further, disclosed are embodiments of a microelectronic structure including at least one microelectronic device embedded within a microelectronic encapsulant having a glass routing structure attached to the microelectronic encapsulant and a trace routing structure formed on the glass routing structure.

Abstract: Integration of sensor chips with integrated circuit (IC) chips. At least a first sensor chip including a first sensor is affixed to a first side of an interposer to hermetically seal the first sensor within a first cavity. An IC chip is affixed to a second side of the interposer opposite the first sensor, the IC chip is electrically coupled to the first sensor by a through via in the interposer. In embodiments, the first sensor includes a MEMS device and the IC chip comprises a circuit to amplify a signal from the MEMS device. The interposer may be made of glass, with the first sensor chip and the IC chip flip-chip bonded to the interposer by compression or solder. Lateral interconnect traces provide I/O between the devices on the interposer and/or a PCB upon which the interpose is affixed.

Abstract: The general inventive concepts provide a side-light type backlight unit. The side-light type backlight unit comprises a light guide plate and a light source located at the side of the light incident surface of the light guide plate. The light source comprises a circuit board which comprises a first region opposite to the light incident surface of the light guide plate and a second region adjacent to the first region. The first region and the second region are provided with LED lamps. By arranging LED lamps in both the first region and the second region of the circuit board of the side-light type backlight unit, the incident light of the side-light type backlight unit is increased, thereby improving the luminance of the side-light type backlight unit in 3D state. The disclosure further provides a display device comprising such a side-light type backlight unit.

Abstract: Embodiments of the present description relate to the field of fabricating microelectronic substrates. The microelectronic substrate may include a trace routing structure disposed between opposing glass layers. The trace routing structure may comprise one or more dielectric layers having conductive traces formed thereon and therethrough. Also disclosed are embodiments of a microelectronic package including a microelectronic device disposed proximate one glass layer of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects.

Abstract: The present disclosure provides a liquid crystal module and a display device. The liquid crystal module includes a liquid crystal screen and a backlight module. It further includes a side bezel for assembling the backlight module. The side bezel includes a first portion surrounding both sides of the backlight module and a second portion bent inwardly between the liquid crystal screen and the backlight module, and the second portion is provided with a connection structure for connecting and assembling the liquid crystal screen. According to the present disclosure, the bezel-free liquid crystal module, i.e., the liquid crystal screen without any frame or cover, will be provided by means of the connection structure. As a result, it is able to provide an attractive appearance and a simple structure, thereby to provide a user with a perfect and wide visual effect.

Abstract: Disclosed are embodiments of a substrate for an integrated circuit (IC) device. The substrate includes a core comprised of two or more discrete glass layers that have been bonded together. A separate bonding layer may be disposed between adjacent glass layers to couple these layers together. The substrate may also include build-up structures on opposing sides of the multi-layer glass core, or perhaps on one side of the core. Electrically conductive terminals may be formed on both sides of the substrate, and an IC die may be coupled with the terminals on one side of the substrate. The terminals on the opposing side may be coupled with a next-level component, such as a circuit board. One or more conductors extend through the multi-layer glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the core. Other embodiments are described and claimed.

Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.

Abstract: Disclosed are embodiments of a glass core substrate for an integrated circuit (IC) device. The glass core substrate includes a glass core and build-up structures on opposing sides of the glass core. Electrically conductive terminals may be formed on both sides of the glass core substrate. An IC die may be coupled with the terminals on one side of the substrate, whereas the terminals on the opposing side may be coupled with a next-level component, such as a circuit board. The glass core may comprise a single piece of glass in which conductors have been formed, or the glass core may comprise two or more glass sections that have been joined together, each section having conductors. The conductors extend through the glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the glass core. Other embodiments are described and claimed.

Abstract: Integration of sensor chips with integrated circuit (IC) chips. At least a first sensor chip including a first sensor is affixed to a first side of an interposer to hermetically seal the first sensor within a first cavity. An IC chip is affixed to a second side of the interposer opposite the first sensor, the IC chip is electrically coupled to the first sensor by a through via in the interposer. In embodiments, the first sensor includes a MEMS device and the IC chip comprises a circuit to amplify a signal from the MEMS device. The interposer may be made of glass, with the first sensor chip and the IC chip flip-chip bonded to the interposer by compression or solder. Lateral interconnect traces provide I/O between the devices on the interposer and/or a PCB upon which the interpose is affixed.

Abstract: The present disclosure discloses a lampshade, a backlight module and a display apparatus. The lampshade includes a containing part and a light-emitting part, wherein a chamber for containing the light source is provided inside the containing part, and a convex ridge projecting outwardly is provided on an outer surface, which is opposite to the containing part, of the light-emitting part, in order to converge light emitted by the light source in the chamber. The backlight module includes an optical film layer and a light source apparatus, wherein the light source apparatus includes a plurality of the lampshades according to the present disclosure. The display apparatus includes the backlight module according to the present disclosure.

Abstract: Provided are a method and device for eliminating echo. The method comprises: an echo path characteristic parameter of an echo signal is estimated; a source signal of the echo signal is taken as a reference signal, and an echo estimation signal is generated according to the echo path characteristic parameter; and the echo estimation signal is subtracted from a speech signal to be processed. The disclosure solves the problem in the related art that self-adaptation cannot be achieved when a returned near-end audio is suppressed, thus facilitating the enhancement of the speech quality of a conference and the improvement of user experience.

Abstract: Embodiments of the present description relate to the field of fabricating microelectronic substrates. The microelectronic substrate may include a trace routing structure disposed between opposing glass layers. The trace routing structure may comprise one or more dielectric layers having conductive traces formed thereon and therethrough. Also disclosed are embodiments of a microelectronic package including a microelectronic device disposed proximate one glass layer of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects.

Abstract: This invention relates to inductive inertial sensors employing a magnetic drive and/or sense architecture. In embodiments, translational gyroscopes utilize a conductive coil made to vibrate in a first dimension as a function of a time varying current driven through the coil in the presence of a magnetic field. Sense coils register an inductance that varies as a function of an angular velocity in a second dimension. In embodiments, the vibrating coil causes first and second mutual inductances in the sense coils to deviate from each other as a function of the angular velocity. In embodiments, self-inductances associated with a pair of meandering coils vary as a function of an angular velocity in a second dimension. In embodiments, package build-up layers are utilized to fabricate the inductive inertial sensors, enabling package-level integrated inertial sensing advantageous in small form factor computing platforms, such as mobile devices.

Abstract: An accelerometer includes a mass, suspended by a beam, and associated conductive paths. Each conductive path is subjected to a magnetic field, such that, when a time varying signal is applied to the conductive paths, a characteristic resonant frequency is produced, and when the mass experiences an acceleration, a respective change in the resonant frequency is produced that may be interpreted as acceleration data. Embodiments include methods of manufacturing an accelerometer and systems and devices incorporating the accelerometer.

Abstract: Disclosed are embodiments of a substrate for an integrated circuit (IC) device. The substrate includes a core comprised of two or more discrete glass layers that have been bonded together. A separate bonding layer may be disposed between adjacent glass layers to couple these layers together. The substrate may also include build-up structures on opposing sides of the multi-layer glass core, or perhaps on one side of the core. Electrically conductive terminals may be formed on both sides of the substrate, and an IC die may be coupled with the terminals on one side of the substrate. The terminals on the opposing side may be coupled with a next-level component, such as a circuit board. One or more conductors extend through the multi-layer glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the core. Other embodiments are described and claimed.

Abstract: The present invention relates to a backlight module for providing light to a liquid crystal panel and a display device. The backlight module comprises an optical membrane material arranged at a back surface of the liquid crystal panel, and a module frame surrounding the optical membrane material. An end surface of the module frame facing the liquid crystal panel is located at the back surface of the liquid crystal panel, and the module frame supports the liquid crystal panel through the end surface. The display device comprises a liquid crystal panel and the backlight module. According to the present invention, the end surface of the module frame facing the liquid crystal panel is located at the back surface of the liquid crystal panel. As a result, it is able to provide a very narrow end surface of the module frame, thereby to narrow a bezel of the display device.

Abstract: There are disclosed a frame assembly and liquid crystal display device for reducing leakage of light around a liquid crystal panel and improving display quality of the liquid crystal display device. The frame assembly includes a backboard in which a receiving portion is formed, a front frame mounted on the backboard around an periphery of the backboard and a buffer frame provided between the backboard and the front frame, wherein the backboard is provided with a first support portion, which is folded from a periphery of the backboard towards inside of the receiving portion so as to support the buffer frame. With the backboard of the above configuration, the support stability for the glue frame can be increased, and the deformation of the glue frame under a reaction force from the liquid crystal panel can be reduced, thereby reducing leakage of light around the liquid crystal panel and improving a display quality of the liquid crystal display device.