Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a microfluidic die to a package structure, wherein the microfluidic die comprises a plurality of asymmetric electrodes that may be coupled with signal pads disposed within the package structure.

Abstract: Embodiments of the present description relate to the field of fabricating microelectronic structures. The microelectronic structures may include a glass routing structure formed separately from a trace routing structure, wherein the glass routing structure is incorporated with the trace routing substrate, either in a laminated or embedded configuration. Also disclosed are embodiments of a microelectronic package including at least one microelectronic device disposed proximate to the glass routing structure of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects. Further, disclosed are embodiments of a microelectronic structure including at least one microelectronic device embedded within a microelectronic encapsulant having a glass routing structure attached to the microelectronic encapsulant and a trace routing structure formed on the glass routing structure.

Abstract: Embodiments of the invention relate to a light guide plate, a method for fabricating the same and a backlight unit. The light guide plate comprises a low density region and a plurality of high density regions, wherein the plurality of high density regions are separately disposed on a light incident side of the light guide plate.

Abstract: An accelerometer includes a mass, suspended by a beam, and associated conductive paths. Each conductive path is subjected to a magnetic field, such that, when a time varying signal is applied to the conductive paths, a characteristic resonant frequency is produced, and when the mass experiences an acceleration, a respective change in the resonant frequency is produced that may be interpreted as acceleration data. Embodiments include methods of manufacturing an accelerometer and systems and devices incorporating the accelerometer.

Abstract: The disclosure discloses a backlight unit and a liquid crystal display comprising thereof. The backlight unit comprises a light guiding plate comprising a plurality of light guiding plate units, which are arranged as a matrix along longitudinal and traversal directions, with line-shaped gaps extending respectively along traversal or longitudinal direction existing between two adjacent light guiding plate units; a light source provided at a side of light guiding plate; and a diffusing sheet provided above the light guiding plate. At a position corresponding to the line-shaped gap between the two adjacent light guiding plate units, the diffusing sheet has a shape of line-shaped projection, and the line-shaped projection has a projected direction in a direction of the light emitted from the light guiding plate unit. According to the disclosure, the uniformity of the backlight may be improved.

Abstract: For a probe based data storage (PDS) device a ferroelectric film stack may be used as a media to store data bits by polarizing areas of the film as either an up domain or a down domain to represent bits. However a built-in-bias field (BBF) may create domain retention problems. By growing the ferroelectric films with stress and composition gradients this may generate polarization gradients which reduce the bias field. Thus, the retention (or imprint) may be improved with minimized BBF.

Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.

Abstract: A semiconductor package having a mechanical fuse therein and methods to form a semiconductor package having a mechanical fuse therein are described. For example, a semiconductor structure includes a semiconductor package. A semiconductor die is housed in the semiconductor package. A microelectromechanical system (MEMS) device is housed in the semiconductor package. The MEMS device has a suspended portion. A mechanical fuse is housed in the semiconductor package and either coupled to, or decoupled from, the suspended portion of the MEMS device.

Abstract: A semiconductor package having an air pressure sensor and methods to form a semiconductor package having an air pressure sensor are described. For example, a semiconductor package includes a plurality of build-up layers. A cavity is disposed in one or more of the build-up layers. An air pressure sensor is disposed in the plurality of build-up layers and includes the cavity and an electrode disposed above the cavity. Also described are various approaches to fabricating a semiconductor package having a hermetically sealed region.

Abstract: Embodiments of the present description relate to the field of fabricating microelectronic substrates. The microelectronic substrate may include a trace routing structure disposed between opposing glass layers. The trace routing structure may comprise one or more dielectric layers having conductive traces formed thereon and therethrough. Also disclosed are embodiments of a microelectronic package including a microelectronic device disposed proximate one glass layer of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects.

Abstract: A semiconductor package having a mechanical fuse therein and methods to form a semiconductor package having a mechanical fuse therein are described. For example, a semiconductor structure includes a semiconductor package. A semiconductor die is housed in the semiconductor package. A microelectromechanical system (MEMS) device is housed in the semiconductor package. The MEMS device has a suspended portion. A mechanical fuse is housed in the semiconductor package and either coupled to, or decoupled from, the suspended portion of the MEMS device.

Abstract: Integration of sensor chips with integrated circuit (IC) chips. At least a first sensor chip including a first sensor is affixed to a first side of an interposer to hermitically seal the first sensor within a first cavity. An IC chip is affixed to a second side of the interposer opposite the first sensor, the IC chip is electrically coupled to the first sensor by a through via in the interposer. In embodiments, the first sensor includes a MEMS device and the IC chip comprises a circuit to amplify a signal from the MEMS device. The interposer may be made of glass, with the first sensor chip and the IC chip flip-chip bonded to the interposer by compression or solder. Lateral interconnect traces provide I/O between the devices on the interposer and/or a PCB upon which the interpose is affixed.

Abstract: Embodiments of the invention describe forming a set of probes using semiconductor regions each including a plurality of vias. A first set of probe segments may be formed from a first set of vias on a first semiconductor region. A second set of probe segments may be formed from a second set of vias on a second semiconductor region and bonded to the first set of probe segments. At least one spring comprising a dielectric material may be formed to couple the first set of probe segments, while a set of metal tips disposed on the second set of probe segments.

Abstract: Embodiments of the invention provides an electromagnetic induction antenna plate, a back-light and a display device, and the electromagnetic induction antenna plate comprises a wiring layer and a fixing structure for attaching the wiring layer to a back plate of a back-light, wherein the wiring layer comprises a first surface facing the back plate and a second surface coated with a reflective material and facing a light guide plate of the back-light when amounted to the back-light.

Abstract: A direct-type backlight device and a display device having the direct-type backlight device are disclosed. The direct-type backlight device comprises: a backplane, a plurality of light-emitting units arranged on the backplane, and a diffusion plate over the light-emitting units, wherein at least one of the light-emitting units is provided at an upper end thereof with a transparent supporter for supporting the diffusion plate.

Abstract: An LED lamp tube with improved sealing and cooling performance includes a plastic tube shell, an LED lamp strip, a metal casing and two end caps. The plastic tube shell is elongate and includes a light condensing structure and a light reflection structure integrally formed by extrusion and an installation chamber formed between the light condensing structure and the light reflection structure. The LED lamp strip is held in the installation chamber and at one side of the light reflection structure. The metal casing is coupled on the outer side of the light reflection structure. Each of the end caps is coupled on each of two ends of the plastic tube shell, thus can achieve IP67 waterproof and dustproof level, and also can resolve cooling problem of the lamp tube.

Abstract: An arrangement, a method and a system to read information stored in a layer of ferroelectric media.

Abstract: A position locking device is disclosed for a draw-out circuit breaker. In at least one embodiment, the position locking device includes a screw rod, a catching plate, a positioning plate, a locking plate, and a push rod. The screw rod has key ways. The catching plate has a catching plate hole and a protrusion that can be inserted into the key ways. Positioning notches for limiting OFF, TEST, and ON positions of the circuit breaker are formed on the top surface of the positioning plate, and corresponding protruding platforms are disposed on the bottom surface. One end of the locking plate bears against the bottom surface of the positioning plate, and the other end is locked to or unlocked from an outward protruding platform of the catching plate. One end of the push rod passes through the catching plate hole, and has an inclined surface. When the push rod is pushed, the inclined surface makes the catching plate leave the key ways.

Abstract: An apparatus comprising a substrate, a heater formed on the substrate, and a phase-change layer formed on the heater. The heater comprises a heater layer and first and second electrodes electrically coupled to the heater layer. A process comprising forming a heater on a substrate and forming a phase-change layer on the heater. The heater comprises a heater layer and first and second electrodes electrically coupled to the heater layer.

Abstract: The present invention provides a method of treating, ameliorating or preventing myocardial ischemia/reperfusion injury in a subject in need thereof, by administering to the subject a therapeutically effective amount of an ANXA1short peptide (ANXA1sp).