Patents by Inventor Qing Peng

Qing Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12217448
    Abstract: A camera pose information detection method, includes collecting a plurality of images by means of a multi-lens camera, and determining a road surface region image based on the plurality of images; and projecting points in the road surface region image onto a camera coordinate system, so as to obtain camera pose information.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: February 4, 2025
    Assignee: CiDi Inc.
    Inventors: Rongdong Hu, Mingxi Tang, Linjiang Xie, Qing Peng
  • Publication number: 20250005221
    Abstract: Systems and methods for performing hole profile modeling in a semiconductor device virtual fabrication environment are discussed. More particularly, hole profiling modeling may be performed for complicated holes used in fabricating semiconductor devices to support DOEs to optimize the fabrication process.
    Type: Application
    Filed: November 7, 2022
    Publication date: January 2, 2025
    Inventors: Qing Peng Wang, Cheng Li, Yu De Chen, Shi-hao Huang, Benjamin Vincent, Joseph Ervin
  • Patent number: 11911552
    Abstract: A combined bio-artificial liver support system, includes branch tubes that are connected in sequence: a blood input branch tube, an upstream tail end, a first plasma separation branch tube comprising at least a first plasma separator, a non-biological purification branch tube comprising at least a plasma perfusion device and a bilirubin adsorber, a biological purification branch tube comprising at least a hepatocyte culture cartridge assembly, and a plasma return branch tube, a downstream tail end of which is set as a blood output end.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: February 27, 2024
    Assignee: Southern Medical University Zhujiang Hospital
    Inventors: Yi Gao, Mingxin Pan, Lei Feng, Yang Li, Lei Cai, Guolin He, Jun Weng, Qing Peng
  • Publication number: 20230335405
    Abstract: A system, method, and/or non-transitory computer readable medium may implement or be configured to implement the following computational operations associated with electrochemical or vapor phase deposition: (a) defining an interface of a substrate where deposition of a deposited material is to occur or is occurring; (b) using a computational model of the deposition to determine a local deposition rate of the deposited material at multiple locations on the interface, where the computational model of the deposition computes the local deposition rate as a function of one or more geometric parameters of the one or more recessed or protruding features; and (c) computationally adjusting the location of the interface to produce an adjusted interface.
    Type: Application
    Filed: July 26, 2021
    Publication date: October 19, 2023
    Inventors: Qing Peng Wang, Yu De Chen, Shi Hao Huang, Rui Bao, Joseph Ervin
  • Publication number: 20230205075
    Abstract: Systems and methods for performing local Critical Dimension Uniformity (CDU) modeling in a virtual fabrication environment are discussed. More particularly, local CD variance is replicated in the virtual fabrication environment in order to produce a CDU mask that can be used during a virtual fabrication sequence to produce more accurate results reflecting the CD variance of features that occurs in a pattern for a semiconductor device being physically fabricated.
    Type: Application
    Filed: April 21, 2021
    Publication date: June 29, 2023
    Inventors: Qing Peng Wang, Yu De Chen, Shi-hao Huang, Rui Bao, Joseph Ervin
  • Patent number: 11620431
    Abstract: Systems and methods for performing depth-dependent oxidation modeling and depth-dependent etch modeling in a virtual fabrication environment are discussed. More particularly, a virtual fabrication environment models, as part of a process sequence, oxidant dispersion in a depth-dependent manner and simulates the subsequent oxidation reaction based on the determined oxidant thickness along an air/silicon interface. Further the virtual fabrication environment performs depth-dependent etch modeling as part of a process sequence to determine etchant concentration and simulate the etching of material along an air/material interface.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: April 4, 2023
    Assignee: Coventor, Inc.
    Inventors: Qing Peng Wang, Shi-hao Huang, Yu De Chen, Joseph Ervin
  • Publication number: 20220382953
    Abstract: Systems and methods for performing reflow modeling in a virtual fabrication environment are discussed. More particularly, the virtual fabrication environment may determine metal or material “reflow” or movement during fabrication of a semiconductor device structure. A reflow modeling step with user-specified parameters may be inserted into a process sequence used during fabrication of the semiconductor device structure.
    Type: Application
    Filed: November 3, 2020
    Publication date: December 1, 2022
    Inventors: Qing Peng Wang, Yu De Chen, Shi-hao Huang, Joseph Ervin, Rui Bao
  • Publication number: 20220366119
    Abstract: Systems and methods for performing depth-dependent oxidation modeling and depth-dependent etch modeling in a virtual fabrication environment are discussed. More particularly, a virtual fabrication environment models, as part of a process sequence, oxidant dispersion in a depth-dependent manner and simulates the subsequent oxidation reaction based on the determined oxidant thickness along an air/silicon interface. Further the virtual fabrication environment performs depth-dependent etch modeling as part of a process sequence to determine etchant concentration and simulate the etching of material along an air/material interface.
    Type: Application
    Filed: February 28, 2022
    Publication date: November 17, 2022
    Inventors: Qing Peng Wang, Shi-hao Huang, Yu De Chen, Joseph Ervin
  • Patent number: 11484866
    Abstract: Disclosed herein are composite materials and methods of making and use thereof. The composite materials disclosed herein can comprise: a first metal oxide particle having a thermal stability and a specific reversible oxygen storage capacity, wherein the first metal oxide particle comprises a first metal oxide comprising a transition metal oxide; and a second metal oxide disposed on the first metal oxide particle; wherein the composite material has a thermal stability and a specific reversible oxygen storage capacity; and wherein the thermal stability of the composite material is greater than the thermal stability of the first metal oxide particle. The methods of use of the composite materials described herein can comprise using the composite material as a catalyst, as an oxygen carrier, as a catalyst support, in a fuel cell, in a catalytic converter, or a combination thereof.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: November 1, 2022
    Assignee: The Board of Trustees of The University of Alabama
    Inventors: Qing Peng, Ruigang Wang, Haoming Yan, Zhongqi Liu
  • Publication number: 20220304838
    Abstract: A vascular implant, a delivery device and a medical apparatus are disclosed. The vascular implant includes a first engagement structure, and the delivery device includes the delivery shaft and a chamber. The delivery shaft includes a second engagement structure configured for detachable retaining engagement with the first engagement structure. Both the first engagement structure and the delivery shaft are configured to be received in the chamber. When the first engagement structure and the delivery shaft are received in the chamber, the first engagement structure is confined by the chamber and thus remains in retaining engagement with the second engagement structure, thus axially locking the vascular implant to the delivery shaft. When the first engagement structure is removed from the chamber, it is no longer confined thereby and is thus detachable from the second engagement structure, thus axially unlocking the vascular implant from the delivery shaft.
    Type: Application
    Filed: June 26, 2020
    Publication date: September 29, 2022
    Inventors: Hanyi ZHAO, Hao TIAN, Qing PENG, Qinfen WANG
  • Patent number: 11401385
    Abstract: A method of preparing tunable inorganic patterned nanofeatures by infiltration of a block copolymer scaffold having a plurality of self-assembled periodic polymer microdomains. The method may be used sequential infiltration synthesis (SIS), related to atomic layer deposition (ALD). The method includes selecting a metal precursor that is configured to selectively react with the copolymer unit defining the microdomain but is substantially non-reactive with another polymer unit of the copolymer. A tunable inorganic features is selectively formed on the microdomain to form a hybrid organic/inorganic composite material of the metal precursor and a co-reactant. The organic component may be optionally removed to obtain an inorganic feature s with patterned nanostructures defined by the configuration of the microdomain.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: August 2, 2022
    Assignee: UChicago Argonne, LLC
    Inventors: Seth B. Darling, Jeffrey W. Elam, Yu-Chih Tseng, Qing Peng
  • Publication number: 20220215573
    Abstract: A camera pose information detection method, includes collecting a plurality of images by means of a multi-lens camera, and determining a road surface region image based on the plurality of images; and projecting points in the road surface region image onto a camera coordinate system, so as to obtain camera pose information.
    Type: Application
    Filed: May 12, 2020
    Publication date: July 7, 2022
    Inventors: Rongdong HU, Mingxi TANG, Linjiang XIE, Qing PENG
  • Patent number: 11301613
    Abstract: Systems and methods for performing depth-dependent oxidation modeling and depth-dependent etch modeling in a virtual fabrication environment are discussed. More particularly, a virtual fabrication environment models, as part of a process sequence, oxidant dispersion in a depth-dependent manner and simulates the subsequent oxidation reaction based on the determined oxidant thickness along an air/silicon interface. Further the virtual fabrication environment performs depth-dependent etch modeling as part of a process sequence to determine etchant concentration and simulate the etching of material along an air/material interface.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: April 12, 2022
    Assignee: Coventor, Inc.
    Inventors: Qing Peng Wang, Shi-Hao Huang, Yu De Chen, Rui Bao, Joseph Ervin
  • Publication number: 20210192120
    Abstract: Systems and methods for performing depth-dependent oxidation modeling and depth-dependent etch modeling in a virtual fabrication environment are discussed. More particularly, a virtual fabrication environment models, as part of a process sequence, oxidant dispersion in a depth-dependent manner and simulates the subsequent oxidation reaction based on the determined oxidant thickness along an air/silicon interface. Further the virtual fabrication environment performs depth-dependent etch modeling as part of a process sequence to determine etchant concentration and simulate the etching of material along an air/material interface.
    Type: Application
    Filed: December 22, 2020
    Publication date: June 24, 2021
    Inventors: Qing Peng Wang, Shi-Hao Huang, Yu De Chen, Rui Bao, Joseph Ervin
  • Publication number: 20210030943
    Abstract: A combined bio-artificial liver support system, includes branch tubes that are connected in sequence: a blood input branch tube, an upstream tail end, a first plasma separation branch tube comprising at least a first plasma separator, a non-biological purification branch tube comprising at least a plasma perfusion device and a bilirubin adsorber, a biological purification branch tube comprising at least a hepatocyte culture cartridge assembly, and a plasma return branch tube, a downstream tail end of which is set as a blood output end.
    Type: Application
    Filed: March 23, 2018
    Publication date: February 4, 2021
    Applicant: Southern Medical University Zhujiang Hospital
    Inventors: Yi Gao, Mingxin Pan, Lei Feng, Yang Li, Lei Cai, Guolin He, Jun Weng, Qing Peng
  • Patent number: 10825735
    Abstract: A semiconductor structure and a method for fabricating the semiconductor structure are provided. The method includes providing a substrate. The substrate includes an active region and a blank region disposed adjacent to the active region. The method also includes forming a fin material layer on the substrate. Further, the method includes forming a plurality of fins on the active region, and a plurality of dummy fins on the blank region by etching the fin material layer. A spacing between a fin and an adjacent dummy fin is greater than a spacing between adjacent fins.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: November 3, 2020
    Assignees: Semiconductor Manufacturing International (Shanghai) Corporation, SMIC New Technology Research and Development (Shanghai) Corporation
    Inventor: Qing Peng Wang
  • Publication number: 20200140622
    Abstract: A method of preparing tunable inorganic patterned nanofeatures by infiltration of a block copolymer scaffold having a plurality of self-assembled periodic polymer microdomains. The method may be used sequential infiltration synthesis (SIS), related to atomic layer deposition (ALD). The method includes selecting a metal precursor that is configured to selectively react with the copolymer unit defining the microdomain but is substantially non-reactive with another polymer unit of the copolymer. A tunable inorganic features is selectively formed on the microdomain to form a hybrid organic/inorganic composite material of the metal precursor and a co-reactant. The organic component may be optionally removed to obtain an inorganic feature s with patterned nanostructures defined by the configuration of the microdomain.
    Type: Application
    Filed: December 19, 2019
    Publication date: May 7, 2020
    Applicant: UCHICAGO ARGONNE, LLC
    Inventors: Seth B. Darling, Jeffrey W. Elam, Yu-Chih Tseng, Qing Peng
  • Publication number: 20200108372
    Abstract: Disclosed herein are composite materials and methods of making and use thereof. The composite materials disclosed herein can comprise: a first metal oxide particle having a thermal stability and a specific reversible oxygen storage capacity, wherein the first metal oxide particle comprises a first metal oxide comprising a transition metal oxide; and a second metal oxide disposed on the first metal oxide particle; wherein the composite material has a thermal stability and a specific reversible oxygen storage capacity; and wherein the thermal stability of the composite material is greater than the thermal stability of the first metal oxide particle. The methods of use of the composite materials described herein can comprise using the composite material as a catalyst, as an oxygen carrier, as a catalyst support, in a fuel cell, in a catalytic converter, or a combination thereof.
    Type: Application
    Filed: October 4, 2019
    Publication date: April 9, 2020
    Inventors: Qing Peng, Ruigang Wang, Haoming Yan, Zhongqi Liu
  • Patent number: 10586859
    Abstract: A semiconductor structure and a method for fabricating the semiconductor structure are provided. The method includes providing a semiconductor substrate including a dense region and a sparse region. The method also includes forming initial fins equally spaced apart from one another on the semiconductor substrate, the initial fins including a plurality of intrinsic fins and dummy fins. The intrinsic fins on the dense region has a spatial density greater than the intrinsic fins on the sparse region. In addition, the method includes forming a first isolation layer on the semiconductor substrate. The first isolation layer covers a portion of sidewalls of the dummy fins and a portion of sidewalls of the intrinsic fins. Further, the method includes forming first trenches in the first isolation layer by removing the dummy fins, and forming a second isolation layer in the first trenches.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: March 10, 2020
    Assignees: Semiconductor Manufacturing International (Shanghai) Corporation, SMIC New Technology Research and Development (Shanghai) Corporation
    Inventor: Qing Peng Wang
  • Patent number: D1062748
    Type: Grant
    Filed: April 27, 2023
    Date of Patent: February 18, 2025
    Assignee: WINNERS' SUN PLASTIC & ELECTRONIC (SHENZHEN) CO., LTD.
    Inventors: Yibing Peng, Yufa Zhao, Cong He, Qing Le