Abstract: A method of manufacturing an integrated circuit is provided. According to the method, a layered fin including a plurality of sacrificial layers and semiconductor layers wherein two adjacent semiconductor layers are separated by the sacrificial layer is provided on a semiconductor substrate. A gate over the layered fin and a spacer surrounding a sidewall of the gate are then formed. The sacrificial layers are subsequently removed to provide a structure in which two adjacent semiconductor layers are separated by a gap. The method further includes forming an insulator in the gap and forming source and drain regions located on the layered fin. The insulator includes a high-K dielectric material surrounded by a low-K dielectric material, both of which are in contact with the two adjacent semiconductor layers.

Abstract: A one-time programmable memory (OTP) is provided that includes a combined word line programming line (WL-PL). The OTP includes a programmable transistor having a first threshold voltage and a first breakdown voltage, and a pass transistor having a second threshold voltage and a second breakdown voltage. The combined WL-PL is electrically connected to respective gate electrodes of both the programmable transistor and the pass transistor so that both receive the same control voltage. The second gate electrode has a work function that is greater than that of the first gate electrode, so that the second gate breakdown voltage is greater than the first gate breakdown voltage, which enables the use of the combined WL-PL.

Abstract: Embodiments are directed to a method of forming a semiconductor device and resulting structures having a nanosheet capacitor by forming a first nanosheet stack over a substrate. The first nanosheet stack includes a first nanosheet vertically stacked over a second nanosheet. A second nanosheet stack is formed over the substrate adjacent to the first nanosheet stack. The second nanosheet stack includes a first nanosheet vertically stacked over a second nanosheet. Exposed portions of the first and second nanosheets of the second nanosheet stack are doped and gates are formed over channel regions of the first and second nanosheet stacks.

Abstract: A programmable cell includes a split gate structure. The split gate structure includes a thin gate dielectric region and a thick gate dielectric region disposed below a gate conductor. A thickness of the thick oxide region is more than a thickness of the thin oxide region. The programmable cell can be fabricated using angle doping to dope an area associated with the thin dielectric region.

Abstract: A method of forming a spacer for a vertical transistor is provided. The method includes forming a fin structure that includes a fin on a semiconductor substrate, forming a source junction or a drain junction at an upper surface of the semiconductor substrate and at a base of the fin and epitaxially growing a rare earth oxide (REO) spacer to have a substantially uniform thickness along respective upper surfaces of the source or drain junction and on opposite sides of the fin structure.

Abstract: A field effect transistor (FET) configuration is provided having a gate region with a split work function for the source-side and drain-side of the gate region. The work function of a material is defined as the minimum energy required to extract an electron from the surface of the material to free space. Accordingly, the source-side portion of the gate region has a first work function that less than a second work function of the drain-side portion, the result of which is increased breakdown voltage at the drain-gate interface, without significantly increasing the threshold voltage of the FET. The split work function is achieved by layering n-type gate material over p-type gate material in the drain-side portion of the gate region, while only the n-type gate material us used in the source-side portion of the gate region.

Abstract: A one-time programmable memory (OTP) is provided that includes a combined word line programming line (WL-PL). The OTP includes a programmable transistor having a first threshold voltage and a first breakdown voltage, and a pass transistor having a second threshold voltage and a second breakdown voltage. The combined WL-PL is electrically connected to respective gate electrodes of both the programmable transistor and the pass transistor so that both receive the same control voltage. The second gate electrode has a work function that is greater than that of the first gate electrode, so that the second gate breakdown voltage is greater than the first gate breakdown voltage, which enables the use of the combined WL-PL.

Abstract: Methods of fabricating devices (e.g., FDSOI devices) having multiple threshold voltages are described. One method includes providing a first fixed charge region proximate to an interface of an insulating (e.g., buried oxide (BOX) layer) and a semiconductor substrate for a first device. The first charge region has a first configuration of fixed charges. The method also includes providing a second fixed charge region proximate to the interface of the insulating layer and the semiconductor substrate for the second device. The second charge region has a second configuration of fixed charges that is different than the first configuration.

Abstract: A fin-shaped field-effect transistor (finFET) device is provided. The finFET device includes a substrate material with a top surface and a bottom surface. The finFET device also includes a well region formed in the substrate material. The well region may include a first type of dopant. The finFET device also includes a fin structure disposed on the top surface of the substrate material. A portion of the fin structure may include the first type of dopant. The finFET device also includes an oxide material disposed on the top surface of the substrate material and adjacent to the portion of the fin structure. The finFET device also includes a first epitaxial material disposed over a portion of the fin structure. The first epitaxial material may include a second type of dopant.

Abstract: Methods of fabricating devices (e.g., FDSOI devices) having multiple threshold voltages are described. One method includes providing a first fixed charge region proximate to an interface of an insulating (e.g., buried oxide (BOX) layer) and a semiconductor substrate for a first device. The first charge region has a first configuration of fixed charges. The method also includes providing a second fixed charge region proximate to the interface of the insulating layer and the semiconductor substrate for the second device. The second charge region has a second configuration of fixed charges that is different than the first configuration.

Abstract: A programmable cell includes a split gate structure. The split gate structure includes a thin gate dielectric region and a thick gate dielectric region disposed below a gate conductor. A thickness of the thick oxide region is more than a thickness of the thin oxide region. The programmable cell can be fabricated using angle doping to dope an area associated with the thin dielectric region.

Abstract: An MOS device with increased drain-source voltage (Vds) includes a source region and a drain region deposited on a substrate. A gate region includes an inner spacer that extends the drain region. The inner spacer is formed attached to an isolation spacer that isolates the drain region from the gate region. The inner spacer is configured to extend the drain region to modify an electric field in a portion of a conductive band of the MOS device.

Abstract: An MOS device with increased drain-source voltage (Vds) includes a source region and a drain region deposited on a substrate. A gate region includes an inner spacer that extends the drain region. The inner spacer is formed attached to an isolation spacer that isolates the drain region from the gate region. The inner spacer is configured to extend the drain region to modify an electric field in a portion of a conductive band of the MOS device.

Abstract: A fin-shaped field-effect transistor (finFET) device is provided. The finFET device includes a substrate material with a top surface and a bottom surface. The finFET device also includes a well region formed in the substrate material. The well region may include a first type of dopant. The finFET device also includes a fin structure disposed on the top surface of the substrate material. A portion of the fin structure may include the first type of dopant. The finFET device also includes an oxide material disposed on the top surface of the substrate material and adjacent to the portion of the fin structure. The finFET device also includes a first epitaxial material disposed over a portion of the fin structure. The first epitaxial material may include a second type of dopant.

Abstract: A FinFET semiconductor device fabrication process includes forming a plurality of FinFET fins upon a semiconductor substrate, forming a first dielectric layer upon the semiconductor substrate so that an upper surface of the first dielectric layer is coplanar with upper surfaces of the FinFET fins, forming a plurality of dummy gates upon the FinFET fins and the first dielectric layer orthogonal to the FinFET fins, revealing the FinFET fins by removing first portions of the first dielectric layer from source-drain regions, removing the dummy gates, and subsequent to the removal of the dummy gates, revealing the FinFET fins by removing second portions of the first dielectric layer from channel regions.

Abstract: A FinFET semiconductor device fabrication process includes forming a plurality of FinFET fins upon a semiconductor substrate, forming a first dielectric layer upon the semiconductor substrate so that an upper surface of the first dielectric layer is coplanar with upper surfaces of the FinFET fins, forming a plurality of dummy gates upon the FinFET fins and the first dielectric layer orthogonal to the FinFET fins, revealing the FinFET fins by removing first portions of the first dielectric layer from source-drain regions, removing the dummy gates, and subsequent to the removal of the dummy gates, revealing the FinFET fins by removing second portions of the first dielectric layer from channel regions.