Abstract: Methods and apparatus for detecting and/or predicting emergency events based on vehicle occupant behavior data are disclosed. An apparatus includes at least one of a camera and an audio sensor, and further includes an event detector, a notification generator, and a radio transmitter. The camera is to capture image data associated with an occupant inside of a vehicle. The audio sensor is to capture audio data associated with the occupant inside of the vehicle. The event detector is to at least one of predict or detect an emergency event based on the at least one of the image data and the audio data. The notification generator is to generate notification data in response to an output of the event detector. The radio transmitter is to transmit the notification data.

Abstract: Apparatus and methods for bone conduction detection are disclosed herein. An example wearable device includes a first sensor positioned to generate first vibration information from a bone structure of a user and a second sensor positioned to generate second vibration information from the bone structure of the user. The first vibration information and the second vibration information include sound data and motion data. The motion data is indicative of a motion by the user. The example wearable device includes a signal modifier to generate a modified signal including the sound data based on the first vibration information and the second vibration information. The example wearable device includes a communicator to transmit the modified signal for output via a speaker.

Abstract: A wearable electronic device includes a displaceable member communicably coupled to a haptic control circuit. The haptic control circuit is communicably coupled to a configurable haptic output device. A user input, received at the displaceable member generates an input signal that includes information and/or data indicative of at least one displacement parameter associated with the displacement of the displaceable member. The input signal is communicated to the haptic control circuit. The haptic control circuit determines a haptic output parameter that corresponds to the received displacement parameter.

Abstract: An integrated circuit device that comprises a single semiconductor substrate, a device layer formed on a frontside of the single semiconductor substrate, a redistribution layer formed on a backside of the single semiconductor substrate, a through silicon via (TSV) formed within the single semiconductor substrate that is electrically coupled to the device layer and to the redistribution layer, a logic-memory interface (LMI) formed on a backside of the single semiconductor substrate that is electrically coupled to the redistribution layer, and a MEMS device formed on the backside of the single semiconductor substrate that is electrically coupled to the redistribution layer.

Abstract: Embodiments of the invention provide methods for forming electrical connections using liquid metals. Electrical connections that employ liquid metals are useful for testing and validation of semiconductor devices. Electrical connections are formed between the probes of a testing interface and the electronic interface of a device under test through a liquid metal region. In embodiments of the invention, liquid metal interconnects are comprised of gallium or liquid metal alloys of gallium. The use of liquid metal contacts does not require a predetermined amount of force be applied in order to reliably make an electrical connection.

Abstract: Methods of forming passive elements under a device layer are described. Those methods and structures may include forming at least one passive structure, such as a capacitor and a resistor structure, in a substrate, wherein the passive structures are vertically disposed within the substrate. An insulator layer is formed on a top surface of the passive structure, a device layer is formed on the insulator layer, and a contact is formed to couple a device disposed in the device layer to the at least one passive structure.

Abstract: Methods of forming passive elements under a device layer are described. Those methods and structures may include forming at least one passive structure, such as a capacitor and a resistor structure, in a substrate, wherein the passive structures are vertically disposed within the substrate. An insulator layer is formed on a top surface of the passive structure, a device layer is formed on the insulator layer, and a contact is formed to couple a device disposed in the device layer to the at least one passive structure.

Abstract: Various embodiments are generally directed to an apparatus and method for determining when an eye is focused on a display scene and determining movement of the eye based on image information when the eye is focused on the display scene. Various embodiments may also include detecting motion of an apparatus based on motion information and adjusting at least one of a position and a size of a frame in the display scene based on at least one of the movement of the eye and the motion of the apparatus.

Abstract: Methods of forming passive elements under a device layer are described. Those methods and structures may include forming at least one passive structure, such as a capacitor and a resistor structure, in a substrate, wherein the passive structures are vertically disposed within the substrate. An insulator layer is formed on a top surface of the passive structure, a device layer is formed on the insulator layer, and a contact is formed to couple a device disposed in the device layer to the at least one passive structure.

Abstract: Briefly, in accordance with one or more embodiments, a method to test one or more sensors of a device under test may comprise capturing visual motion data of the device under test disposed on an arm of a pendulum apparatus while the arm of the pendulum apparatus is in motion, capturing data from the one or more sensors while the arm of the pending apparatus is in motion, and comparing the visual motion data with the data from the one or more sensors to determine a relationship between the visual motion data and the data from the one or more sensors.

Abstract: A method of fabricating a microelectronic package having a direct contact heat spreader, a package formed according to the method, a die-heat spreader combination formed according to the method, and a system incorporating the package. The method comprises metallizing a backside of a microelectronic die to form a heat spreader body directly contacting and fixed to the backside of the die thus yielding a die-heat spreader combination. The package includes the die-heat spreader combination and a substrate bonded to the die.

Abstract: Systems and methods may provide for a headset including a housing and a speaker positioned within the housing and directed toward a region external to the housing such as, for example, an ear canal when the headset is being worn. The headset may also include an ear pressure sensor positioned within the housing and directed toward the same region external to the housing. In one example, a measurement signal is received from the pressure sensor, one or more characteristics of an audio signal are automatically adjusted based on the measurement signal, and the audio signal is transmitted to the speaker.

Abstract: An embodiment includes an apparatus comprising: a first layer, including a first semiconductor switching element, coupled to a first portion of a first bonding material; and a second layer, including a second semiconductor switching element, coupled to a second portion of a second bonding material; wherein (a) the first layer is over the second layer, (b) the first portion is directly connected to the second portion, and (c) first sidewalls of the first portion are unevenly serrated. Other embodiments are described herein.

Abstract: A device to output a haptic effect includes a haptic effect generator comprising one or more microdroplets of a fluid configured to output a haptic effect, and a substrate configured to control movement of the one or more microdroplets of fluid. The device further includes an actuator coupled to the haptic effect generator configured to exert one or more forces on the substrate to cause the one or more microdroplets of fluid to output the haptic effect.

Abstract: Methods of forming passive elements under a device layer are described. Those methods and structures may include forming at least one passive structure, such as a capacitor and a resistor structure, in a substrate, wherein the passive structures are vertically disposed within the substrate. An insulator layer is formed on a top surface of the passive structure, a device layer is formed on the insulator layer, and a contact is formed to couple a device disposed in the device layer to the at least one passive structure.

Abstract: An embodiment includes an oscillator comprising an amplifier formed on a substrate; a multiple gate resonant channel array, formed on the substrate, including: (a) transistors including fins, each of the fins having a channel between source and drain nodes, coupled to common source and drain contacts; and (b) common first and second tri-gates coupled to each of the fins and located between the source and drain contacts; wherein the fins mechanically resonate at a first frequency when one of the first and second tri-gates is periodically activated to produce periodic downward forces on the fins. Other embodiments include a non planar transistor with a channel between the source and drain nodes and a tri-gate on the fin; wherein the fin mechanically resonates when the first tri-gate is periodically activated to produce periodic downward forces on the fin. Other embodiments are described herein.

Abstract: An integrated circuit device that comprises a single semiconductor substrate, a device layer formed on a frontside of the single semiconductor substrate, a redistribution layer formed on a backside of the single semiconductor substrate, a through silicon via (TSV) formed within the single semiconductor substrate that is electrically coupled to the device layer and to the redistribution layer, a logic-memory interface (LMI) formed on a backside of the single semiconductor substrate that is electrically coupled to the redistribution layer, and a MEMS device formed on the backside of the single semiconductor substrate that is electrically coupled to the redistribution layer.

Abstract: Systems and methods may provide for a headset including a housing and a speaker positioned within the housing and directed toward a region external to the housing such as, for example, an ear canal when the headset is being worn. The headset may also include an ear pressure sensor positioned within the housing and directed toward the same region external to the housing. In one example, a measurement signal is received from the pressure sensor, one or more characteristics of an audio signal are automatically adjusted based on the measurement signal, and the audio signal is transmitted to the speaker.

Abstract: A device to output a haptic effect includes a haptic effect generator comprising one or more microdroplets of a fluid configured to output a haptic effect, and a substrate configured to control movement of the one or more microdroplets of fluid. The device further includes an actuator coupled to the haptic effect generator configured to exert one or more forces on the substrate to cause the one or more microdroplets of fluid to output the haptic effect.

Abstract: An integrated circuit device that comprises a single semiconductor substrate, a device layer formed on a frontside of the single semiconductor substrate, a redistribution layer formed on a backside of the single semiconductor substrate, a through silicon via (TSV) formed within the single semiconductor substrate that is electrically coupled to the device layer and to the redistribution layer, a logic-memory interface (LMI) formed on a backside of the single semiconductor substrate that is electrically coupled to the redistribution layer, and a MEMS device formed on the backside of the single semiconductor substrate that is electrically coupled to the redistribution layer.