Abstract: The invention is embodied in a TAB frame with wide spaced area array contacts. The area array contacts serve to transform the narrow pitch contacts which connect to a chip mounted on the tab frame into wide spaced TAB edge contacts. These area array contacts allow for the convenient connection of the TAB frame to a printed circuit board and eliminate the need for fine line printed circuit board technology to support the TAB assembly.

Abstract: The invention is embodied in a demountable TAB assembly. By using two springs in series, the present invention is able to maintain reliable contact between the TAB frame and the printed circuit board even if the elastomeric spring relaxes. The present invention also incorporates a novel TAB frame using contacts formed into an area-array. This area-array concept eliminated the need for fine line printed circuit board technology to support the TAB assembly.

Abstract: An integrated circuit package (10) has a layer (22) of silicon positioned between copper die attach pad (18) and silicon integrated circuit die (12). The layer (22) should have a thickness of about half that of the silicon die (12). The layer (22) should also extend symmetrically beyond the die (12). Such an extension provides a horizontal surface beyond the die (12) to which thermosetting encapsulating resin (20) will adhere to produce an enhanced stress reduction effect. Vertical edges (23) of the layer (22) also help to prevent stress of the die (12) by resisting force from the encapsulating resin (20) after it shrinks during curing.