Patents by Inventor Rajendra Yammanuru
Rajendra Yammanuru has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230024264Abstract: A fluid control device includes a housing having plural surfaces defining a cavity within the housing. The housing includes an inlet to receive a fluid mixture and an outlet to direct the fluid mixture out of the housing. The fluid mixture includes a fluid combined with debris. A structure array is disposed within the cavity and includes plural structures. Each of the plural structures includes a first surface coupled with an internal surface of the housing and a second surface disposed a distance away from the internal surface of the housing. The structure array includes a first portion and a second portion. The first portion is configured to interfere with the fluid mixture to separate at least some of the debris from the fluid, and the second portion is configured to direct the fluid and at least some of the debris toward the outlet.Type: ApplicationFiled: July 20, 2021Publication date: January 26, 2023Inventors: Mark Murphy, Jain Raj Vettuvazhy Puthenpurayil, Rajendra Yammanuru, Theodore Brown
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Patent number: 10383261Abstract: A system includes a front plate, first and second side plates extending from the front plate, a bridge heat sink coupled to and extending from the front plate between the side plates, and a heat pipe coupled to the front plate. The front plate defines a slot therethrough between the front and back sides. The first side plate includes a fin bank mounted on an outer side thereof. The bridge heat sink defines a fluid channel that is fluidly connected to the slot of the front plate. The fluid channel is configured to receive a first cooling fluid therein to dissipate heat from electronics packages that engage the bridge heat sink. The heat pipe extends to and at least partially through the fin bank. The heat pipe contains a second cooling fluid therein that transfers heat absorbed from the front plate to the fin bank for dissipating heat.Type: GrantFiled: July 28, 2016Date of Patent: August 13, 2019Assignee: GE GLOBAL SOURCING LLCInventors: Andrew Louis Krivonak, Theodore Clark Brown, Shreenath Shekar Perlaguri, Brian Magann Rush, Rajendra Yammanuru, Naveenan Thiagarajan, Arunpandi Radhakrishnan
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Patent number: 10032693Abstract: A system includes a front plate, a manifold cover, and bridge heat sinks. The manifold cover is secured to the front plate to define a fluid distribution chamber along a front side of the front plate. The manifold cover defines a port opening through which a cooling fluid is received from outside of the manifold cover. The bridge heat sinks extend rearward from a back side of the front plate. The bridge heat sinks define fluid channels that are fluidly connected with the fluid distribution chamber through corresponding slots in the front plate. The fluid distribution chamber is configured to distribute the cooling fluid received from outside of the manifold cover through the fluid channels of the bridge heat sinks in order to cool one or more electronics packages disposed along the bridge heat sinks without the cooling fluid engaging the one or more electronics packages.Type: GrantFiled: October 20, 2015Date of Patent: July 24, 2018Assignee: General Electric CompanyInventors: Andrew Louis Krivonak, Shreenath Shekar Perlaguri, Rajendra Yammanuru, Arunpandi Radhakrishnan, Theodore Clark Brown
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Publication number: 20170112020Abstract: A system includes a front plate, a manifold cover, and bridge heat sinks. The manifold cover is secured to the front plate to define a fluid distribution chamber along a front side of the front plate. The manifold cover defines a port opening through which a cooling fluid is received from outside of the manifold cover. The bridge heat sinks extend rearward from a back side of the front plate. The bridge heat sinks define fluid channels that are fluidly connected with the fluid distribution chamber through corresponding slots in the front plate. The fluid distribution chamber is configured to distribute the cooling fluid received from outside of the manifold cover through the fluid channels of the bridge heat sinks in order to cool one or more electronics packages disposed along the bridge heat sinks without the cooling fluid engaging the one or more electronics packages.Type: ApplicationFiled: October 20, 2015Publication date: April 20, 2017Inventors: Andrew Louis Krivonak, Shreenath Shekar Perlaguri, Rajendra Yammanuru, Arunpandi Radhakrishnan, Theodore Clark Brown
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Publication number: 20170112018Abstract: A system includes a front plate, first and second side plates extending from the front plate, a bridge heat sink coupled to and extending from the front plate between the side plates, and a heat pipe coupled to the front plate. The front plate defines a slot therethrough between the front and back sides. The first side plate includes a fin bank mounted on an outer side thereof. The bridge heat sink defines a fluid channel that is fluidly connected to the slot of the front plate. The fluid channel is configured to receive a first cooling fluid therein to dissipate heat from electronics packages that engage the bridge heat sink. The heat pipe extends to and at least partially through the fin bank. The heat pipe contains a second cooling fluid therein that transfers heat absorbed from the front plate to the fin bank for dissipating heat.Type: ApplicationFiled: July 28, 2016Publication date: April 20, 2017Inventors: Andrew Louis Krivonak, Theodore Clark Brown, Shreenath Shekar Perlaguri, Brian Magann Rush, Rajendra Yammanuru, Naveenan Thiagarajan, Arunpandi Radhakrishnan
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Patent number: 8599551Abstract: A cooling system includes a heat sink to absorb heat that is generated by a component of a device, where the heat sink includes a base to dissipate the heat, and a group of fins via which the heat, that is dissipated by the base, is transferred; and an inverted heat sink to receive the heat via the fins. The inverted heat sink includes another base to prevent a portion of the heat, transferred into an environment where another component is located, from causing a temperature, of the environment, to increase above a threshold; a heat pipe to transfer another portion of the heat, not transferred into the environment, to a portion of the other base; and another group of fins to receive the other portion of the heat via the portion of the other base. The inverted heat sink is also to transfer the other portion of the heat to another environment to prevent a temperature, of the component, from increasing above another threshold.Type: GrantFiled: April 14, 2011Date of Patent: December 3, 2013Assignee: Juniper Networks, Inc.Inventors: Ravichandran V, Rajendra Yammanuru
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Patent number: D802582Type: GrantFiled: August 8, 2016Date of Patent: November 14, 2017Assignee: General Electric CompanyInventors: Andrew Louis Krivonak, Theodore Clark Brown, Shreenath Shekar Perlaguri, Rajendra Yammanuru, Michael Jay Grutkowski, Arunpandi Radhakrishnan
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Patent number: D807824Type: GrantFiled: July 18, 2016Date of Patent: January 16, 2018Assignee: General Electric CompanyInventors: Andrew Louis Krivonak, Shreenath Shekar Perlaguri, Rajendra Yammanuru, Arunpandi Radhakrishnan
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Patent number: D825463Type: GrantFiled: December 5, 2017Date of Patent: August 14, 2018Assignee: General Electric CompanyInventors: Andrew Louis Krivonak, Shreenath Shekar Perlaguri, Rajendra Yammanuru, Arunpandi Radhakrishnan
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Patent number: D843996Type: GrantFiled: August 23, 2017Date of Patent: March 26, 2019Assignee: GE Global Sourcing LLCInventors: Andrew Louis Krivonak, Theodore Clark Brown, Shreenath Shekar Perlaguri, Rajendra Yammanuru, Michael Jay Grutkowski, Arunpandi Radhakrishnan
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Patent number: D873228Type: GrantFiled: August 12, 2016Date of Patent: January 21, 2020Assignee: Transportation Holdings, LLCInventors: Andrew Louis Krivonak, Shreenath Shekar Perlaguri, Brian Magann Rush, Rajendra Yammanuru, Michael Grutkowski, Naveenan Thiagarajan, Arunpandi Radhakrishnan
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Patent number: D893440Type: GrantFiled: November 26, 2019Date of Patent: August 18, 2020Assignee: TRANSPORTATION IP HOLDINGS, LLCInventors: Andrew Louis Krivonak, Shreenath Shekar Perlaguri, Brian Magann Rush, Rajendra Yammanuru, Michael Grutkowski, Naveenan Thiagarajan, Arunpandi Radhakrishnan
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Patent number: D1009399Type: GrantFiled: July 20, 2021Date of Patent: December 26, 2023Assignee: Transportation IP Holdings, LLCInventors: Mark Murphy, Jain Raj Vettuvazhy Puthenpurayil, Rajendra Yammanuru, Theodore Brown